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Nenad MiljkovicUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
Soumyadip SettAssistant Professor, Indian Institute of Technology GandhinagarVerified email at iitgn.ac.in
Xiao Yan (颜笑)Chongqing UniversityVerified email at cqu.edu.cn
Moonkyung KimStaff Engineer at Samsung Electronics Device Solutions Semiconductor R&D CenterVerified email at illinois.edu
Shreyas ChavanGraduate Student, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
Junho OhDepartment of Mechanical Engineering, Hanyang University ERICAVerified email at hanyang.ac.kr
Longnan LiChangchun Institute of Optics Fine Mechanics and Physics, Chinese Academy of Sciences; UIUCVerified email at ciomp.ac.cn
Daniel OrejonSenior Lecturer Chemical Engineering, Institute Multiacale Thermofluids, The University of EdinburghVerified email at ed.ac.uk
Jingcheng MaAssistant Professor, the University of Notre DameVerified email at nd.edu
Evelyn N WangMechanical Engineering, MITVerified email at mit.edu
Ryan EnrightSeguente, Nokia Bell Labs, MIT, University of LimerickVerified email at seguente.tech
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Hyeongyun Cha
University at Buffalo, The State University of New York
Verified email at buffalo.edu - Homepage