| Fatigue damage detection in graphite/epoxy composites using sonic infrared imaging technique A Mian, X Han, S Islam, G Newaz Composites Science and Technology 64 (5), 657-666, 2004 | 157 | 2004 |
| The van der Pauw stress sensor A Mian, JC Suhling, RC Jaeger IEEE Sensors Journal 6 (2), 340-356, 2006 | 106 | 2006 |
| Laser bonded microjoints between titanium and polyimide for applications in medical implants A Mian, G Newaz, L Vendra, N Rahman, DG Georgiev, G Auner, R Witte, ... Journal of Materials Science: Materials in Medicine 16, 229-237, 2005 | 82 | 2005 |
| Laser micro-welding of aluminum and copper with and without tin foil alloy MM Hailat, A Mian, ZA Chaudhury, G Newaz, R Patwa, HJ Herfurth Microsystem technologies 18, 103-112, 2012 | 79 | 2012 |
| In-situ stress state measurements during chip-on-board assembly Y Zou, JC Suhling, RW Johnson, RC Jaeger, AKM Mian IEEE Transactions on Electronics Packaging Manufacturing 22 (1), 38-52, 1999 | 77 | 1999 |
| Advances in mechanical metamaterials for vibration isolation: A review M Al Rifaie, H Abdulhadi, A Mian Advances in Mechanical Engineering 14 (3), 16878132221082872, 2022 | 74 | 2022 |
| Compression behavior of three-dimensional printed polymer lattice structures M Al Rifaie, A Mian, R Srinivasan Proceedings of the Institution of Mechanical Engineers, Part L: Journal of …, 2019 | 68 | 2019 |
| Design and calibration of optimized (111) silicon stress sensing test chips JC Suhling, RC Jaeger, ST Lin, A Mian, RA Cordes, BM Wilamowski | 65 | 1997 |
| Finite element modeling of transmission laser microjoining process T Mahmood, A Mian, MR Amin, G Auner, R Witte, H Herfurth, G Newaz Journal of Materials Processing Technology 186 (1-3), 37-44, 2007 | 63 | 2007 |
| A review on laser processing in electronic and MEMS packaging K Rahim, A Mian Journal of Electronic Packaging 139 (3), 030801, 2017 | 62 | 2017 |
| Effect of laser power and scan speed on melt pool characteristics of commercially pure titanium (CP-Ti) C Kusuma, SH Ahmed, A Mian, R Srinivasan Journal of Materials Engineering and Performance 26, 3560-3568, 2017 | 62 | 2017 |
| Effect of strut length and orientation on elastic mechanical response of modified body-centered cubic lattice structures HS Abdulhadi, A Mian Proceedings of the Institution of Mechanical Engineers, Part L: Journal of …, 2019 | 59 | 2019 |
| Development of an elastic material model for BCC lattice cell structures using finite element analysis and neural networks approaches TA Alwattar, A Mian Journal of composites science 3 (2), 33, 2019 | 58 | 2019 |
| Response of sub-surface fatigue damage under sonic load–a computational study A Mian, G Newaz, X Han, T Mahmood, C Saha Composites Science and Technology 64 (9), 1115-1122, 2004 | 52 | 2004 |
| Low-velocity impact behavior of sandwich structures with additively manufactured polymer lattice cores AJ Turner, M Al Rifaie, A Mian, R Srinivasan Journal of Materials Engineering and Performance 27, 2505-2512, 2018 | 49 | 2018 |
| Effect of vertical strut arrangements on compression characteristics of 3D printed polymer lattice structures: experimental and computational study A Fadeel, A Mian, M Al Rifaie, R Srinivasan Journal of Materials Engineering and Performance 28, 709-716, 2019 | 47 | 2019 |
| Characterization of the temperature dependence of the pressure coefficients of n-and p-type silicon using hydrostatic testing CH Cho, RC Jaeger, JC Suhling, Y Kang, A Mian IEEE Sensors Journal 8 (4), 392-400, 2008 | 45 | 2008 |
| The effect of laser power and scan speed on melt pool characteristics of pure titanium and Ti-6Al-4V alloy for selective laser melting C Kusuma | 44 | 2016 |
| Laser fabrication and characterization of sub-millimeter joints between polyimide and Ti-coated borosilicate glass DG Georgiev, T Sultana, A Mian, G Auner, H Herfurth, R Witte, G Newaz Journal of Materials Science 40, 5641-5647, 2005 | 41 | 2005 |
| Measurement of backside flip chip die stresses using piezoresistive test die JC Suhling, R Johnson, AKM Mian, M Rahim, Y Zou, C Ellis, S Ragam, ... 32nd International Symposium on Microelectronics, 298-303, 1999 | 41 | 1999 |
G. NewazProfessor of Mechanical Engineering, Wayne State UniversityVerified email at eng.wayne.edu