| Fracture criteria for piezoelectric ceramics S Park, CT Sun Journal of the american ceramic society 78 (6), 1475-1480, 1995 | 747 | 1995 |
| Effect of electric field on fracture of piezoelectric ceramics SB Park, CT Sun International Journal of Fracture 70, 203-216, 1993 | 472 | 1993 |
| High-cycle fatigue life prediction for Pb-free BGA under random vibration loading D Yu, A Al-Yafawi, TT Nguyen, S Park, S Chung Microelectronics Reliability 51 (3), 649-656, 2011 | 189 | 2011 |
| Design, fabrication, and experimental characterization of a flap valve IPMC micropump with a flexibly supported diaphragm TT Nguyen, NS Goo, VK Nguyen, Y Yoo, S Park Sensors and Actuators A: Physical 141 (2), 640-648, 2008 | 142 | 2008 |
| Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading S Park, R Dhakal, L Lehman, E Cotts Acta materialia 55 (9), 3253-3260, 2007 | 137 | 2007 |
| Accurate assessment of packaging stress effects on MEMS sensors by measurement and sensor–package interaction simulations X Zhang, S Park, MW Judy Journal of microelectromechanical systems 16 (3), 639-649, 2007 | 104 | 2007 |
| Transient dynamic simulation and full-field test validation for a slim-PCB of mobile phone under drop/impact S Park, C Shah, J Kwak, C Jang, J Pitarresi, T Park, S Jang 2007 Proceedings 57th Electronic Components and Technology Conference, 914-923, 2007 | 104 | 2007 |
| Effects of temperature on mechanical properties of SU-8 photoresist material S Chung, S Park Journal of Mechanical Science and Technology 27, 2701-2707, 2013 | 95 | 2013 |
| Three-dimensional shape measurement with a fast and accurate approach Z Wang, H Du, S Park, H Xie Applied optics 48 (6), 1052-1061, 2009 | 94 | 2009 |
| Characterizing the mechanical properties of actual SAC105, SAC305, and SAC405 solder joints by digital image correlation TT Nguyen, D Yu, SB Park Journal of Electronic Materials 40, 1409-1415, 2011 | 83 | 2011 |
| Advanced thermal-moisture analogy scheme for anisothermal moisture diffusion problem C Jang, S Park, B Han, S Yoon | 79 | 2008 |
| Three-dimensional and 2.5 dimensional interconnection technology: State of the art D Liu, S Park Journal of Electronic Packaging 136 (1), 014001, 2014 | 74 | 2014 |
| A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs C Cai, J Xu, H Wang, SB Park Microelectronics Reliability 119, 114065, 2021 | 72 | 2021 |
| Dynamic responses of PCB under product-level free drop impact D Yu, JB Kwak, S Park, J Lee Microelectronics Reliability 50 (7), 1028-1038, 2010 | 71 | 2010 |
| Predictive model for optimized design parameters in flip-chip packages and assemblies S Park, HC Lee, B Sammakia, K Raghunathan IEEE Transactions on Components and Packaging Technologies 30 (2), 294-301, 2007 | 70 | 2007 |
| Warpage compensating heat spreader EA Johnson, S Park US Patent 6,288,900, 2001 | 58 | 2001 |
| Effect of oxidation on indium solderability J Kim, H Schoeller, J Cho, S Park Journal of electronic materials 37, 483-489, 2008 | 55 | 2008 |
| Effect of glue on reliability of flip chip BGA packages under thermal cycling TT Nguyen, D Lee, JB Kwak, S Park Microelectronics Reliability 50 (7), 1000-1006, 2010 | 53 | 2010 |
| Moisture diffusion modeling–A critical review EH Wong, SB Park Microelectronics Reliability 65, 318-326, 2016 | 50 | 2016 |
| Comprehensive study on 2.5 D package design for board-level reliability in thermal cycling and power cycling S Shao, Y Niu, J Wang, R Liu, S Park, H Lee, G Refai-Ahmed, L Yip 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1668-1675, 2018 | 48 | 2018 |
Ke PanApple Inc.Verified email at binghamton.edu
