| Mechanical behavior of particle reinforced metal matrix composites N Chawla, YL Shen Advanced engineering materials 3 (6), 357-370, 2001 | 959 | 2001 |
| Microstructure and mechanical behavior of porous sintered steels N Chawla, X Deng Materials Science and Engineering: A 390 (1-2), 98-112, 2005 | 428 | 2005 |
| Tensile behavior of high performance natural (sisal) fibers F Silva, N Chawla Composites Science and Technology 68 (15), 3438-3443, 2008 | 411 | 2008 |
| Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation X Deng, N Chawla, KK Chawla, M Koopman Acta materialia 52 (14), 4291-4303, 2004 | 387 | 2004 |
| Three-dimensional visualization and microstructure-based modeling of deformation in particle-reinforced composites N Chawla, RS Sidhu, VV Ganesh Acta materialia 54 (6), 1541-1548, 2006 | 366 | 2006 |
| Microstructure and deformation behavior of biocompatible TiO2 nanotubes on titanium substrate GA Crawford, N Chawla, K Das, S Bose, A Bandyopadhyay Acta Biomaterialia 3 (3), 359-367, 2007 | 328 | 2007 |
| Effect of SiC volume fraction and particle size on the fatigue resistance of a 2080 Al/SiC p composite N Chawla, JW Jones, C Andres, JE Allison Metallurgical and Materials Transactions A 29, 2843-2854, 1998 | 314 | 1998 |
| Three-dimensional (3D) microstructure visualization and finite element modeling of the mechanical behavior of SiC particle reinforced aluminum composites N Chawla, VV Ganesh, B Wunsch Scripta materialia 51 (2), 161-165, 2004 | 285 | 2004 |
| Creep deformation behavior of Sn–3.5 Ag solder/Cu couple at small length scales M Kerr, N Chawla Acta materialia 52 (15), 4527-4535, 2004 | 272 | 2004 |
| Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5 wt.% Ag solder F Ochoa, JJ Williams, N Chawla Journal of Electronic Materials 32, 1414-1420, 2003 | 222 | 2003 |
| Young’s modulus of (Cu, Ag)–Sn intermetallics measured by nanoindentation X Deng, M Koopman, N Chawla, KK Chawla Materials Science and Engineering: A 364 (1-2), 240-243, 2004 | 214 | 2004 |
| Effect of particle orientation anisotropy on the tensile behavior of metal matrix composites: experiments and microstructure-based simulation VV Ganesh, N Chawla Materials Science and Engineering: A 391 (1-2), 342-353, 2005 | 212 | 2005 |
| Metal-matrix composites in ground transportation N Chawla, KK Chawla JoM 58, 67-70, 2006 | 209 | 2006 |
| Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5 Ag solder/Cu joints X Deng, RS Sidhu, P Johnson, N Chawla Metallurgical and Materials Transactions A 36, 55-64, 2005 | 204 | 2005 |
| Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints X Deng, G Piotrowski, JJ Williams, N Chawla Journal of Electronic Materials 32, 1403-1413, 2003 | 199 | 2003 |
| Microstructure-based modeling of the deformation behavior of particle reinforced metal matrix composites N Chawla, KK Chawla Journal of Materials Science 41, 913-925, 2006 | 197 | 2006 |
| Microstructure-based modeling of crack growth in particle reinforced composites A Ayyar, N Chawla Composites Science and technology 66 (13), 1980-1994, 2006 | 180 | 2006 |
| The influence of microencapsulated phase change material (PCM) characteristics on the microstructure and strength of cementitious composites: Experiments and finite element … M Aguayo, S Das, A Maroli, N Kabay, JCE Mertens, SD Rajan, G Sant, ... Cement and Concrete Composites 73, 29-41, 2016 | 178 | 2016 |
| Microstructure-based simulation of thermomechanical behavior of composite materials by object-oriented finite element analysis N Chawla, BV Patel, M Koopman, KK Chawla, R Saha, BR Patterson, ... Materials Characterization 49 (5), 395-407, 2002 | 157 | 2002 |
| Damage evolution in SiC particle reinforced Al alloy matrix composites by X-ray synchrotron tomography JJ Williams, Z Flom, AA Amell, N Chawla, X Xiao, F De Carlo Acta Materialia 58 (18), 6194-6205, 2010 | 152 | 2010 |
Krishan ChawlaUniversity of Alabama at BirminghamVerified email at uab.edu