| MEMS Packaging Reliability in Board-Level Drop Tests Under Severe Shock and Impact Loading Conditions–Part I: Experiment J Meng, ST Douglas, A Dasgupta IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016 | 36 | 2016 |
| Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies J Meng, T Mattila, A Dasgupta, M Sillanpaa, R Jaakkola, K Andersson, ... 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012 | 23 | 2012 |
| Reliability assessment of a MEMS microphone under shock impact loading J Li, J Makkonen, M Broas, J Hokka, TT Mattila, M Paulasto-Kröckel, ... 2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013 | 18 | 2013 |
| Drop qualification of MEMS components in handheld electronics at extremely high accelerations J Meng, T Mattila, A Dasgupta, M Sillanpaa, R Jaakkola, G Luo, ... 13th InterSociety conference on thermal and thermomechanical phenomena in …, 2012 | 16 | 2012 |
| MEMS packaging reliability in board-level drop tests under severe shock and impact loading conditions—Part II: Fatigue damage modeling J Meng, A Dasgupta IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 13 | 2016 |
| The effect of secondary impacts on PWB-level drop tests at high impact accelerations S Douglas, J Meng, J Akman, I Yildiz, M Al-Bassyiouni, A Dasgupta 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011 | 13 | 2011 |
| Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board J Meng, A Dasgupta Journal of Electronic Packaging 138 (1), 010914, 2016 | 9 | 2016 |
| Influence of secondary impact on printed wiring assemblies—Part II: Competing failure modes in surface mount components J Meng, A Dasgupta Journal of Electronic Packaging 139 (3), 031001, 2017 | 7 | 2017 |
| Release mechanisms for coupled devices M Jingshi, SC Lee, DN Zieba, KS Ryu, NG Aguilar, OJ Allen, Y Chen, ... US Patent 11,402,873, 2022 | 5 | 2022 |
| Influence of secondary impact on failure modes in PWAs with high resonant frequency J Meng, A Dasgupta International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 5 | 2015 |
| Effect of strain rate on adhesion strength of Anisotropic Conductive Film (ACF) joints J Meng, P Stark, A Dasgupta, M Sillanpaa, E Hussa, JP Seppanen, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 1252-1258, 2013 | 5 | 2013 |
| Eng1 WDC Douglas, P Arden, X Xiping, DS John, HW James, EF Martha, ... J Med 329, 1753-1759, 1993 | 4 | 1993 |
| Multi-scale dynamic study of secondary impact during drop testing of surface mount packages J Meng University of Maryland, College Park, 2016 | 3 | 2016 |
| Side impact reliability of micro-switches J Meng, A Dasgupta Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th …, 2015 | 3 | 2015 |
| Durability assessment of photovoltaic (PV) products under environmental thermal cycling J Akman, C Choi, S Mukherjee, J Meng, E Mirbagheri, G Haddad, D Das, ... 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 2 | 2012 |
| Influence of Secondary Impact on Printed Wiring Assemblies— Part I: High Frequency †œBreathing Mode†Deformations in the Printed Wiring Board J Meng, A Dasgupta The American Society of Mechanical Engineers (ASME), 2016 | | 2016 |
| Detrended Fluctuation Analysis of Full Logistic Mapping Chaotic Sequence Y Niu, J Meng, J Bao, L Wang Journal of Shenyang Jianzhu University (Natural Science), 813-816, 2009 | | 2009 |
| Multifunctional embedded medicine bag type leg protection plate J Meng CN Patent CN201143239 Y, 2008 | | 2008 |
| Magnetic bookmark with electronic dictionary J Meng CN Patent CN201143817 Y, 2008 | | 2008 |
Abhijit DasguptaProfessor of Mechanical Engineering, University of MarylandVerified email at umd.edu