| Surface diffraction study of the hydrated hematite (11¯ 02) surface KS Tanwar, CS Lo, PJ Eng, JG Catalano, DA Walko, GE Brown Jr, ... Surface Science 601 (2), 460-474, 2007 | 126 | 2007 |
| Pb (II) adsorption on isostructural hydrated alumina and hematite (0001) surfaces: A DFT study SE Mason, CR Iceman, KS Tanwar, TP Trainor, AM Chaka The Journal of Physical Chemistry C 113 (6), 2159-2170, 2009 | 123 | 2009 |
| Density functional theory study of the clean and hydrated hematite surfaces CS Lo, KS Tanwar, AM Chaka, TP Trainor Physical Review B—Condensed Matter and Materials Physics 75 (7), 075425, 2007 | 114 | 2007 |
| Fe (II) adsorption on hematite (0 0 0 1) KS Tanwar, SC Petitto, SK Ghose, PJ Eng, TP Trainor Geochimica et Cosmochimica Acta 73 (15), 4346-4365, 2009 | 80 | 2009 |
| Hydrated α-Fe2O3 (11¯ 02) surface structure: Role of surface preparation KS Tanwar, JG Catalano, SC Petitto, SK Ghose, PJ Eng, TP Trainor Surface science 601 (12), L59-L64, 2007 | 66 | 2007 |
| Integrated circuits having magnetic tunnel junctions (MTJ) and methods for fabricating the same X Zhang, SX Lin, K Tanwar US Patent 9,299,745, 2016 | 59 | 2016 |
| BEOL Cu CMP process evaluation for advanced technology nodes K Tanwar, D Canaperi, M Lofaro, W Tseng, R Patlolla, C Penny, ... Journal of The Electrochemical Society 160 (12), D3247, 2013 | 56 | 2013 |
| Structural study of Fe (II) adsorption on hematite (11¯ 02) KS Tanwar, SC Petitto, SK Ghose, PJ Eng, TP Trainor Geochimica et Cosmochimica Acta 72 (14), 3311-3325, 2008 | 49 | 2008 |
| Methods for fabricating integrated circuits with ruthenium-lined copper K Tanwar, X Zhang, M He US Patent 8,586,473, 2013 | 36 | 2013 |
| Surface structure of magnetite (111) under hydrated conditions by crystal truncation rod diffraction SC Petitto, KS Tanwar, SK Ghose, PJ Eng, TP Trainor Surface science 604 (13-14), 1082-1093, 2010 | 32 | 2010 |
| CVD-Co/Cu (Mn) integration and reliability for 10 nm node T Nogami, M He, X Zhang, K Tanwar, R Patlolla, J Kelly, D Rath, ... 2013 IEEE International Interconnect Technology Conference-IITC, 1-3, 2013 | 22 | 2013 |
| Electromigration extendibility of Cu (Mn) alloy-seed interconnects, and understanding the fundamentals T Nogami, C Penny, A Madan, C Parks, J Li, P Flaitz, A Uedono, S Chiang, ... 2012 International Electron Devices Meeting, 33.7. 1-33.7. 4, 2012 | 20 | 2012 |
| BEOL integration scheme for copper CMP to prevent dendrite formation K Tanwar US Patent 8,669,176, 2014 | 12 | 2014 |
| Surface structure and reactivity of iron oxide–water interfaces SK Ghose, SC Petitto, KS Tanwar, CS Lo, PJ Eng, AM Chaka, TP Trainor Developments in Earth and Environmental Sciences 7, 1-29, 2007 | 11 | 2007 |
| Methods for fabricating integrated circuits having embedded electrical interconnects ET Ryan, K Tanwar US Patent 8,835,306, 2014 | 10 | 2014 |
| Chapter 1 Surface Structure and Reactivity of Iron Oxide-Water Interfaces. Developments in Earth and Environmental Sciences SK Ghose, SC Petitto, KS Tanwar, CS Lo, PJ Eng, AM Chaka Amsterdam, The Netherlands: Elsevier, 2007 | 10 | 2007 |
| Moisture scavenging layer for thinner barrier application in beol integration M He, K Tanwar US Patent 9,318,437, 2016 | 7 | 2016 |
| Methods for fabricating integrated circuits using chemical mechanical planarization to recess metal K Tanwar, X Zhang, D Canaperi, R Patlolla US Patent 9,275,874, 2016 | 7 | 2016 |
| Performance of ultrathin alternative diffusion barrier metals for next-Generation BEOL technologies, and their effects on reliability T Nogami, M Chae, C Penny, T Shaw, H Shobha, J Li, S Cohen, CK Hu, ... IEEE International Interconnect Technology Conference, 223-226, 2014 | 7 | 2014 |
| Electroless fill of trench in semiconductor structure SX Lin, X Zhang, M He, L Zhao, J Iacoponi, K Tanwar US Patent 9,087,881, 2015 | 6 | 2015 |
