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Taiuk RimPohang University of Science and TechnologyVerified email at postech.ac.kr
M. MeyyappanNASA Ames Research CenterVerified email at nasa.gov
JEONG-SOO LEEDepartment of electrical engineering, Pohang University of Science and TechnologyVerified email at postech.ac.kr
Junsik Yoon (Jun-Sik Yoon)Electrical Engineering, POSTECHVerified email at postech.ac.kr
Gianaurelio (Giovanni) CunibertiTU Dresden; https://ORCID.org/0000-0002-6574-7848Verified email at tu-dresden.de
Rock-Hyun BaekPOSTECH, Electrical EngineeringVerified email at postech.ac.kr
Larysa BarabanHelmholtz Center Dresden Rossendorf and TU DresdenVerified email at hzdr.de
Byoung Don KongPohang University of Science and Technology(POSTECH)Verified email at postech.ac.kr
Bergoi IbarluceaTecnaliaVerified email at tecnalia.com
Eunhye BaekTsinghua UniversityVerified email at tsinghua.edu.cn
Kim JungsikGyeongsang National UniversityVerified email at gnu.ac.kr
Seonghoon JinSamsung Semiconductor IncVerified email at samsung.com
Sung-Min HongSchool of EECS, Gwangju Institute of Science and TechnologyVerified email at gist.ac.kr
Bomsoo KimPrincipal Engineer, Samsung ElectronicsVerified email at us.ibm.com
CH PARKSamsung ElectronicsVerified email at umd.edu
SangWook ParkSamsung Electronics; TU Dresden; The Univ. of Tokyo; Seoul National Univ.Verified email at tu-dresden.de