| Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps CS Selvanayagam, JH Lau, X Zhang, SKW Seah, K Vaidyanathan, ... IEEE transactions on advanced packaging 32 (4), 720-728, 2009 | 409 | 2009 |
| Development of 3-D silicon module with TSV for system in packaging N Khan, VS Rao, S Lim, HS We, V Lee, X Zhang, EB Liao, R Nagarajan, ... IEEE Transactions on Components and Packaging Technologies 33 (1), 3-9, 2010 | 208 | 2010 |
| High-density 3D-boron nitride and 3D-graphene for high-performance nano–thermal interface material M Loeblein, SH Tsang, M Pawlik, EJR Phua, H Yong, XW Zhang, CL Gan, ... ACS nano 11 (2), 2033-2044, 2017 | 190 | 2017 |
| Heterogeneous 2.5 D integration on through silicon interposer X Zhang, JK Lin, S Wickramanayaka, S Zhang, R Weerasekera, R Dutta, ... Applied physics reviews 2 (2), 2015 | 177 | 2015 |
| The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures FX Che, WH Zhu, ESW Poh, XW Zhang, XR Zhang Journal of Alloys and Compounds 507 (1), 215-224, 2010 | 174 | 2010 |
| Development of through silicon via (TSV) interposer technology for large die (21× 21mm) fine-pitch Cu/low-k FCBGA package X Zhang, TC Chai, JH Lau, CS Selvanayagam, K Biswas, S Liu, D Pinjala, ... 2009 59th Electronic components and technology conference, 305-312, 2009 | 136 | 2009 |
| Study on Cu protrusion of through-silicon via FX Che, WN Putra, A Heryanto, A Trigg, X Zhang, CL Gan IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013 | 113 | 2013 |
| Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology FX Che, D Ho, MZ Ding, X Zhang 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-8, 2015 | 96 | 2015 |
| TSV interposer fabrication for 3D IC packaging VS Rao, HS Wee, LWS Vincent, LH Yu, L Ebin, R Nagarajan, CT Chong, ... 2009 11th Electronics Packaging Technology Conference, 431-437, 2009 | 88 | 2009 |
| Electromigration performance of Through Silicon Via (TSV)–A modeling approach YC Tan, CM Tan, XW Zhang, TC Chai, DQ Yu Microelectronics Reliability 50 (9-11), 1336-1340, 2010 | 85 | 2010 |
| Enhancement of hotspot cooling with diamond heat spreader on Cu microchannel heat sink for GaN-on-Si device Y Han, BL Lau, X Zhang, YC Leong, KF Choo IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (6 …, 2014 | 61 | 2014 |
| Design and development of a multi-die embedded micro wafer level package V Kripesh, VS Rao, A Kumar, G Sharma, KC Houe, Z Xiaowu, KY Mong, ... 2008 58th Electronic Components and Technology Conference, 1544-1549, 2008 | 60 | 2008 |
| Effect of TSV interposer on the thermal performance of FCBGA package YYG Hoe, TG Yue, P Damaruganath, CT Chong, JH Lau, Z Xiaowu, ... 2009 11th Electronics Packaging Technology Conference, 778-786, 2009 | 58 | 2009 |
| A novel method to predict die shift during compression molding in embedded wafer level package CH Khong, A Kumar, X Zhang, G Sharma, SR Vempati, K Vaidyanathan, ... 2009 59th Electronic Components and Technology Conference, 535-541, 2009 | 57 | 2009 |
| Modeling stress in silicon with TSVs and its effect on mobility C Selvanayagam, X Zhang, R Rajoo, D Pinjala IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (9 …, 2011 | 56 | 2011 |
| Development of Large Die Fine-Pitch Cu/Low-FCBGA Package With Through Silicon via (TSV) Interposer TC Chai, X Zhang, JH Lau, CS Selvanayagam, P Damaruganath, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (5 …, 2011 | 56 | 2011 |
| Development of wafer-level warpage and stress modeling methodology and its application in process optimization for TSV wafers F Che, HY Li, X Zhang, S Gao, KH Teo IEEE transactions on components, packaging and manufacturing technology 2 (6 …, 2012 | 55 | 2012 |
| Thermo-mechanical finite element analysis in a multichip build up substrate based package design X Zhang, EH Wong, C Lee, TC Chai, Y Ma, PS Teo, D Pinjala, S Sampath Microelectronics Reliability 44 (4), 611-619, 2004 | 52 | 2004 |
| A damage evolution model for thermal fatigue analysis of solder joints X Zhang, SWR Lee, YH Pao J. Electron. Packag. 122 (3), 200-206, 2000 | 51 | 2000 |
| Thermal management of hotspots using diamond heat spreader on Si microcooler for GaN devices Y Han, BL Lau, G Tang, X Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 48 | 2015 |