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Jason KenneyApplied MaterialsVerified email at amat.com
Ken CollinsMaster, VP and Fellow at Applied MaterialsVerified email at amat.com
Mark J. KushnerUniversity of MichiganVerified email at umich.edu
Leonid DorfApplied MaterialsVerified email at amat.com
Samer BannaTechnion, Israel Institute of Technology, Applied MaterialsVerified email at amat.com
Mingfeng WuZenStone Venture CapitalVerified email at utexas.edu
Julian SchulzeProfessor (Ruhr-University Bochum)Verified email at aept.rub.de
Jun-Chieh WangApplied Materials, University of MichiganVerified email at umich.edu
Igor KaganovichPrinceton University, Princeton Plasma Physics LaboratoryVerified email at pppl.gov
S. Samukawa, Seiji SamukawaInstitute of Fluid Science and Advanced Institute for Material Research, Tohoku UniversityVerified email at ifs.tohoku.ac.jp
Thorsten LillClarycon Nanotechnology ResearchVerified email at claryconresearch.com
Syed M. AlamEverspin Technologies, Inc.Verified email at alum.mit.edu
David R. BorisResearch Physicist, U. S. Naval Research LaboratoryVerified email at nrl.navy.mil
Scott G WaltonNaval Research LaboratoryVerified email at nrl.navy.mil
Prof. Dr. Marius OrlowskiVirginia Tech, Bradly Department of Electrical and Computer EngineeeringVerified email at vt.edu
Ken HaraStanford UniversityVerified email at stanford.edu
Aaron TheanNational University of SingaporeVerified email at nus.edu.sg
Amr HaggagDistinguished Technical Staff, Corporate Quality, Freescale SemiconductorVerified email at freescale.com