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Daniel C. Smallwood
Daniel C. Smallwood
Tyndall National Institute
Dirección de correo verificada de tyndall.ie
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Methods for latent image simulations in photolithography with a polychromatic light attenuation equation for fabricating VIAs in 2.5 D and 3D advanced packaging architectures
DC Smallwood, P McCloskey, C O’Mathuna, DP Casey, JF Rohan
Microsystems & Nanoengineering 7 (1), 39, 2021
52021
Multiphysics design and fabrication of 3D electroplated VIA materials topographies for next generation energy and sensor technologies
DC Smallwood, P McCloskey, JF Rohan
Materials & Design 221, 111001, 2022
32022
Design, Modeling, and Analysis of a 3-D Spiral Inductor With Magnetic Thin-Films for PwrSoC/PwrSiP DC-DC Converters
C Shetty, DC Smallwood
IEEE Access 10, 92105-92127, 2022
22022
A vertical magnetic structure for integrated power conversion
C O'mathuna, D Smallwood, Z Pavlovic, H Smiddy, S O'driscoll, ...
US Patent App. 17/285,751, 2022
2022
Electrochemical materials for integrated magnetics
DC Smallwood
University College Cork, 2021
2021
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Artículos 1–5