| Driving monitoring system application with stretchable conductive inks: A review AK Ab Wahid, MA Salim, NA Masripan, AM Saad, D Dobrota, G Omar, ... International Journal of Nanoelectronics & Materials 13, 2020 | 5 | 2020 |
| Integration of heterogeneous databases in academic environment using open source etl tools A Aziz, A Wahid, NA Hamid, A Rozaimee, US ZainalAbidin Proc. 1st Int. Conf. Inform. Appl.(ICIA), 433-439, 2012 | 3 | 2012 |
| Preparation of Silver and Graphene Paste with a Specific Ratio of Organic Solvent. SM Saleh, MA Salim, NA Masripan, AM Saad, F Dai, C Photong, ... International Journal of Nanoelectronics & Materials 15, 2022 | 2 | 2022 |
| MEASUREMENT OF OPTIMAL STRETCHABILITY GRAPHENE CONDUCTIVE INK PATTERN BY NUMERICAL ANALYSIS. AK Ab Wahid, MA Salim, M Ali, NA Masripan, F Dai, AM Saad Defence S&T Technical Bulletin 14 (1), 2021 | 2 | 2021 |
| Comparison Measurements of Low Resistance and High Strength on Synthesis Graphene Conductive Ink Filled Epoxy AK Ab Wahid, MA Salim, NA Masripan, C Photong, AM Saad, A Keroh International Journal of Nanoelectronics and Materials Volume 14 [333-342], 2021 | 1 | 2021 |
| Numerical Analysis of GNP/Ag Die-Attach Adhesives with Different Thermal Conductivity. AKA Wahid, MA Salim, NA Masripan, C Photong, AM Saad, MZ Akop, ... International Journal of Nanoelectronics & Materials 15, 2022 | | 2022 |
| Analyse of Strain and Stress on Different Stretchable Conductive Ink Materials by Numerical Method. AKA Wahid, MA Salim, NA Masripan, F Dai, AM Saad, MZ Akop International Journal of Nanoelectronics & Materials 15, 2022 | | 2022 |
| Optimal Prediction on Stretchability Thickness of Graphene Conductive Ink by Numerical Approach. AKA Wahid, MA Salim, NA Masripan, AM Saad, MZ Akop, C Photong International Journal of Nanoelectronics & Materials 15, 2022 | | 2022 |
| Evaluation of High Thermal Conductivity-Sintered Hybrid Die-Attach Materials in High-Power Electronic Packaging and Interconnections: A Comprehensive Review. SM Saleh, MA Salim, NA Masripan, AM Saad, F Dai, C Photong, ... International Journal of Nanoelectronics & Materials 15, 2022 | | 2022 |
| Transient Thermal Simulation Analysis of Die-Attach Adhesives. AKA Wahid, MA Salim, NA Masripan, C Photong, AM Saad, MZ Akop International Journal of Nanoelectronics & Materials 15, 2022 | | 2022 |
| Finite Element Analysis on Stretchable Conductive Ink Materials Structure Under Strain and Stress Behaviour. AKA Wahid, MA Salim, NA Masripan, C Photong, AM Saad, MZ Akop International Journal of Nanoelectronics & Materials 15, 2022 | | 2022 |
| FINITE ELEMENT ANALYSIS FOR TRANSIENT THERMAL CHARACTERISTICS OF DIE-ATTACH ADHESIVE GRAPHENE CONDUCTIVE PASTE AK Ab Wahid, MA Salim, NA Masripan, AM Saad Defence S&T Technical Bulletin 15 (1), 2022 | | 2022 |
| MEASUREMENT OF OPTIMAL STRETCHABILITY GRAPHENE CONDUCTIVE INK PATTERN BY NUMERICAL ANALYSIS FDAMS Ameeruz Kamal Ab Wahid, Mohd Azli Salim, Murni Ali, Nor Azmmi Masripan Defense S&T Technical Bulletin 14 (1), 100, 2021 | | 2021 |
| Design and Simulation of New Skewering Part in Satay Industries AK Ab Wahid, MKAS Hassan, WHW Mohamed Politeknik & Kolej Komuniti Journal of Engineering and Technology, 52-64, 2019 | | 2019 |
| REDUCING THE MAJOR DEFECT RATE IN INJECTION MOULDING FOR COVER DOOR OUTSIDE RH,(KEYLESS)(D63D) SNS YAHYA, MNM Sabri, AKA Wahid, MMA Malik Journal of Engineering, Communication and Technology in Education 10 (1 …, 2018 | | 2018 |
| SCIENCE & TECHNOLOGY RESEARCH INSTITUTE FOR DEFENCE (STRIDE) K Kamal, R Abidin, MA Ahamat, FR Hashim, MSM Zamshari, H Ithnin, ... | | |
Nor Azmmi Bin MasripanSenior Lecturer, Universiti Teknikal Malaysia Melaka (UTeM)Dirección de correo verificada de utem.edu.my