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Van-Thuc Nguyen
Van-Thuc Nguyen
University of Technology and Education, Ho Chi Minh city, Vietnam
Dirección de correo verificada de hcmute.edu.vn - Página principal
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Material removal and interactions between an abrasive and a SiC substrate: A molecular dynamics simulation study
VT Nguyen, TH Fang
Ceramics International 46 (5), 5623-5633, 2020
552020
Influences of Material Selection, Infill Ratio, and Layer Height in the 3D Printing Cavity Process on the Surface Roughness of Printed Patterns and Casted Products in …
TT Nguyen, VT Tran, THN Pham, VT Nguyen, NC Thanh, HMN Thi, ...
Micromachines 14 (2), 395, 2023
302023
Optimizing 3D printing process parameters for the tensile strength of thermoplastic polyurethane plastic
D Le, CH Nguyen, THN Pham, VT Nguyen, SM Pham, MT Le, TT Nguyen
Journal of Materials Engineering and Performance 32 (23), 10805-10816, 2023
262023
Phase transformation and subsurface damage formation in the ultrafine machining process of a diamond substrate through atomistic simulation
VT Nguyen, TH Fang
Scientific Reports 11 (1), 17795, 2021
252021
Study on the Fatigue Strength of Welding Line in Injection Molding Products under Different Tensile Conditions
PS Minh, VT Nguyen, VT Nguyen, TMT Uyen, TT Do, VTT Nguyen
Micromachines 13 (11), 1890, 2022
222022
Morphological and Mechanical Properties of Poly (Butylene Terephthalate)/High‐Density Polyethylene Blends
NTH Pham, VT Nguyen
Advances in Materials Science and Engineering 2020 (1), 8890551, 2020
202020
Optimization design for die-sinking EDM process parameters employing effective intelligent method
VT Tran, MH Le, MT Vo, QT Le, VH Hoang, NT Tran, VT Nguyen, ...
Cogent Engineering 10 (2), 2264060, 2023
192023
Interfacial strength and deformation mechanism of Ni/Co multilayers under uniaxial tension using molecular dynamics simulation
TN Vu, VT Pham, VT Nguyen, TH Fang
Materials Today Communications 30, 103088, 2022
172022
Conformal Cooling Channel Design for Improving Temperature Distribution on the Cavity Surface in the Injection Molding Process
VT Nguyen, PS Minh, TMT Uyen, TT Do, NC Ha, VTT Nguyen
Polymers 15 (13), 2793, 2023
162023
WAAM Technique: Process Parameters Affecting the Mechanical Properties and Microstructures of Low-Carbon Steel
VT Nguyen, PS Minh, TMT Uyen, TT Do, HVT Ngoc, MT Le, ...
Metals 13 (5), 873, 2023
142023
Revealing the mechanisms for inactive rolling and wear behaviour on chemical mechanical planarization
VT Nguyen, TH Fang
Applied Surface Science 595, 153524, 2022
142022
Effect of incidence and size of graphite particle on the formation of graphene on Ni surfaces
AV Pham, TH Fang, VT Nguyen, TH Chen
Vacuum 187, 110092, 2021
132021
Trajectory Strategy Effects on the Material Characteristics in the WAAM Technique
TMT Uyen, PS Minh, VT Nguyen, TT Do, VT Nguyen, MT Le, VTT Nguyen
Micromachines 14 (4), 827, 2023
122023
Atomic stick-slip behaviors and anisotropic deformations on a rough surface during GaN wafer polishing: A simulation study
VT Nguyen, TH Fang
Thin Solid Films 731, 138744, 2021
122021
Material removal mechanism and deformation characteristics of GaN surface at the nanoscale
VT Nguyen, TH Fang
Micro and Nanostructures 164, 107159, 2022
112022
Effect of calcium carbonate on the mechanical properties of polyethylene terephthalate/polypropylene blends with styrene-ethylene/butylene-styrene
HNT Pham, VT Nguyen
Journal of Mechanical Science and Technology 34, 3925-3930, 2020
112020
Turning Chatter Detection Using a Multi-Input Convolutional Neural Network via Image and Sound Signal
QN The Ho, TT Do, PS Minh, VT Nguyen, VTT Nguyen
Machines 11 (6), 644, 2023
102023
Contact strength and deformation of straining free-standing borophene
TH Fang, VT Nguyen, VT Pham
Computational Materials Science 197, 110624, 2021
102021
Behaviour of TiC Particles on the Co50‐Based Coatings by Laser Cladding: Morphological Characteristics and Growth Mechanism
NTH Pham, VT Nguyen
Advances in Materials Science and Engineering 2020 (1), 8462607, 2020
102020
Investigating the structures and residual stress of Cux (FeAlCr) 100− x film on Ni substrate using molecular dynamics
AV Pham, TH Fang, VT Nguyen, TH Chen
Materials Today Communications 31, 103378, 2022
72022
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