| High-resolution deposition of conductive and insulating materials at micrometer scale on complex substrates M Łysień, Ł Witczak, A Wiatrowska, K Fiączyk, J Gadzalińska, L Schneider, ... Scientific reports 12 (1), 9327, 2022 | 31 | 2022 |
| Synthesis and luminescence of Eu3+ doped nanocrystalline TiO2 spheres M Łysień, K Fiączyk, R Tomala, F Granek, W Stręk Journal of Rare Earths 37 (11), 1121-1125, 2019 | 9 | 2019 |
| 55‐1: Deposition of Conductive and Insulating Materials at Micrometer Scale for Display‐Component Prototyping M Łysien, Ł Witczak, J Gadzalińska, I Grądzka-Kurzaj, L Schneider, ... SID Symposium Digest of Technical Papers 53 (1), 723-726, 2022 | 8 | 2022 |
| 59‐3: Ultra‐Precise Printing of Micrometer‐Size Interconnectors for High‐Resolution MicroLED Displays A Wiatrowska, P Kowalczewski, K Fiączyk, Ł Witczak, J Gadzalińska, ... SID Symposium Digest of Technical Papers 52 (1), 833-836, 2021 | 7 | 2021 |
| High Frequency Solution‐Processed Organic Field‐Effect Transistors with High‐Resolution Printed Short Channels T Losi, Ł Witczak, M Łysień, P Rossi, P Moretti, C Bertarelli, V Mattoli, ... Advanced Functional Materials 33 (48), 2302656, 2023 | 5 | 2023 |
| Ultraprecise deposition of micrometer-size conductive features for advanced packaging A Wiatrowska, P Kowalczewski, K Fiączyk, Ł Witczak, J Gadzalińska, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1573-1576, 2022 | 3 | 2022 |
| Flexible Quantum-Dot Light-Emitting Diodes Using Embedded Silver Mesh Transparent Electrodes Manufactured by an Ultraprecise Deposition Method Ł Witczak, M Chrzanowski, P Sitarek, M Łysień, A Podhorodecki ACS omega 8 (42), 39217-39221, 2023 | 2 | 2023 |
| Drop feature optimization for fine trace inkjet printing N Mohan, SK Bhogaraju, M Łysień, L Schneider, F Granek, K Lux, G Elger 2021 23rd European Microelectronics and Packaging Conference & Exhibition …, 2021 | 2 | 2021 |
| Printing of micrometer-size features on complex substrates for system integration A Wiatrowska, K Fiączyk, P Kowalczewski, M Łysień, Ł Witczak, ... 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC …, 2022 | 1 | 2022 |
| Depositon of Micrometer-Size Features on Complex Substrates for Heterogeneous Integration A Wiatrowska, K Fiączyk, P Kowalczewski, M Łysień, Ł Witczak, ... 2022 IEEE International Conference on Flexible and Printable Sensors and …, 2022 | 1 | 2022 |
| 27.3: Ultraprecise Deposition of Micrometer‐Size Conductive Structures for Printed Displays A Wiatrowska, P Kowalczewski, K Fiączyk, Ł Witczak, J Gadzalińska, ... SID Symposium Digest of Technical Papers 52, 370-370, 2021 | 1 | 2021 |
| Ultra-precise deposition: additive manufacturing process for next-generation electronics K Duczmal, P Kowalczewski, Ł Witczak, J Gadzalińska, I Grądzka-Kurzaj, ... Transactions on Additive Manufacturing Meets Medicine 5 (S1), 832-832, 2023 | | 2023 |
| 55.3: Deposition of Conductive and Insulating Features at Micrometer Scale for Flexible Electronics and Printed Displays A Wiatrowska, K Fiączyk, P Kowalczewski, M Łysień, Ł Witczak, ... SID Symposium Digest of Technical Papers 53 (S1), 551-551, 2022 | | 2022 |
