| Technology roadmap for flexible sensors Y Luo, MR Abidian, JH Ahn, D Akinwande, AM Andrews, M Antonietti, ... ACS nano 17 (6), 5211-5295, 2023 | 625 | 2023 |
| Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics H Fu†, K Nan†, W Bai, W Huang, K Bai, L Lu, C Zhou, Y Liu, F Liu, J Wang, ... Nature materials 17 (3), 268-276, 2018 | 389 | 2018 |
| A generic soft encapsulation strategy for stretchable electronics K Li†, X Cheng†, F Zhu, L Li, Z Xie, H Luan, Z Wang, Z Ji, H Wang, F Liu, ... Advanced Functional Materials 29 (8), 1806630, 2019 | 161 | 2019 |
| Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials H Song†, G Luo†, Z Ji, R Bo, Z Xue, D Yan, F Zhang, K Bai, J Liu, ... Science advances 8 (11), eabm3785, 2022 | 158 | 2022 |
| Micro/nanoscale 3D assembly by rolling, folding, curving, and buckling approaches X Cheng, Y Zhang* Advanced Materials 31 (36), 1901895, 2019 | 143 | 2019 |
| Programming 3D curved mesosurfaces using microlattice designs X Cheng†, Z Fan†, S Yao, T Jin, Z Lv, Y Lan, R Bo, Y Chen, F Zhang, ... Science 379 (6638), 1225-1232, 2023 | 102 | 2023 |
| Electro-mechanically controlled assembly of reconfigurable 3D mesostructures and electronic devices based on dielectric elastomer platforms W Pang, X Cheng, H Zhao, X Guo, Z Ji, G Li, Y Liang, Z Xue, H Song, ... National Science Review 7 (2), 342-354, 2020 | 84 | 2020 |
| Harnessing the interface mechanics of hard films and soft substrates for 3D assembly by controlled buckling Y Liu†, X Wang†, Y Xu, Z Xue, Y Zhang, X Ning, X Cheng, Y Xue, D Lu, ... Proceedings of the National Academy of Sciences 116 (31), 15368-15377, 2019 | 76 | 2019 |
| Assembly of complex 3D structures and electronics on curved surfaces Z Xue†, T Jin†, S Xu, K Bai, Q He, F Zhang, X Cheng, Z Ji, W Pang, ... Science advances 8 (31), eabm6922, 2022 | 72 | 2022 |
| A soft microrobot with highly deformable 3D actuators for climbing and transitioning complex surfaces W Pang†, S Xu†, J Wu, R Bo, T Jin, Y Xiao, Z Liu, F Zhang, X Cheng, ... Proceedings of the National Academy of Sciences 119 (49), e2215028119, 2022 | 65 | 2022 |
| Remotely Triggered Assembly of 3D Mesostructures Through Shape‐Memory Effects JK Park†, K Nan†, H Luan†, N Zheng†, S Zhao, H Zhang, X Cheng, ... Advanced Materials 31 (52), 1905715, 2019 | 64 | 2019 |
| Geometrically reconfigurable 3D mesostructures and electromagnetic devices through a rational bottom-up design strategy K Bai, X Cheng, Z Xue, H Song, L Sang, F Zhang, F Liu, X Luo, W Huang, ... Science advances 6 (30), eabb7417, 2020 | 63 | 2020 |
| A three-dimensionally architected electronic skin mimicking human mechanosensation Z Liu†, X Hu†, R Bo†, Y Yang, X Cheng, W Pang, Q Liu, Y Wang, S Wang, ... Science 384 (6699), 987-994, 2024 | 56 | 2024 |
| An Anti‐Fatigue Design Strategy for 3D Ribbon‐Shaped Flexible Electronics X Cheng, F Zhang, R Bo, Z Shen, W Pang, T Jin, H Song, Z Xue, Y Zhang* Advanced Materials 33 (37), 2102684, 2021 | 45 | 2021 |
| Rapidly deployable and morphable 3D mesostructures with applications in multimodal biomedical devices F Zhang†, S Li†, Z Shen, X Cheng, Z Xue, H Zhang, H Song, K Bai, D Yan, ... Proceedings of the National Academy of Sciences 118 (11), 2021 | 42 | 2021 |
| A nonlinear mechanics model of soft network metamaterials with unusual swelling behavior and tunable phononic band gaps H Zhang, X Cheng, D Yan, Y Zhang*, D Fang* Composites Science and Technology 183, 107822, 2019 | 42 | 2019 |
| Mechanics of bistable cross-shaped structures through loading-path controlled 3D assembly G Luo†, H Fu†, X Cheng, K Bai, L Shi, X He, JA Rogers, Y Huang, ... Journal of the Mechanics and Physics of Solids 129, 261-277, 2019 | 37 | 2019 |
| Design and fabrication of heterogeneous, deformable substrates for the mechanically guided 3D assembly H Luan†, X Cheng†, A Wang, S Zhao, K Bai, H Wang, W Pang, Z Xie, K Li, ... ACS applied materials & interfaces 11 (3), 3482-3492, 2018 | 32 | 2018 |
| Mechanically Guided Hierarchical Assembly of 3D Mesostructures H Zhao†, X Cheng†, C Wu†, TL Liu, Q Zhao, S Li, X Ni, S Yao, M Han, ... Advanced Materials, 2109416, 2022 | 30 | 2022 |
| Island Effect in Stretchable Inorganic Electronics K Li†, Y Shuai†, X Cheng, H Luan, S Liu, C Yang, Z Xue, Y Huang, ... Small, 2107879, 2022 | 28 | 2022 |
Yihui ZhangProfessor of Engineering Mechanics, Tsinghua UniversityDirección de correo verificada de mail.tsinghua.edu.cn