| Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects EP Li, XC Wei, AC Cangellaris, EX Liu, YJ Zhang, M D'amore, J Kim, ... IEEE Transactions on Electromagnetic Compatibility 52 (2), 248-265, 2010 | 222 | 2010 |
| Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz R Rimolo-Donadio, X Gu, YH Kwark, MB Ritter, B Archambeault, ... IEEE Transactions on Microwave Theory and Techniques 57 (8), 2072-2083, 2009 | 200 | 2009 |
| Analytical evaluation of via-plate capacitance for multilayer printed circuit boards and packages Y Zhang, J Fan, G Selli, M Cocchini, F de Paulis IEEE Transactions on Microwave Theory and Techniques 56 (9), 2118-2128, 2008 | 174 | 2008 |
| An intrinsic circuit model for multiple vias in an irregular plate pair through rigorous electromagnetic analysis YJ Zhang, J Fan IEEE transactions on microwave theory and techniques 58 (8), 2251-2265, 2010 | 108 | 2010 |
| Probable aerosol transmission of severe fever with thrombocytopenia syndrome virus in southeastern China Z Gong, S Gu, Y Zhang, J Sun, X Wu, F Ling, W Shi, P Zhang, D Li, H Mao, ... Clinical Microbiology and Infection 21 (12), 1115-1120, 2015 | 94 | 2015 |
| Estimating radio-frequency interference to an antenna due to near-field coupling using decomposition method based on reciprocity H Wang, V Khilkevich, YJ Zhang, J Fan IEEE Transactions on Electromagnetic Compatibility 55 (6), 1125-1131, 2013 | 94 | 2013 |
| A magnetic-field resonant probe with enhanced sensitivity for RF interference applications HH Chuang, GH Li, E Song, HH Park, HT Jang, HB Park, YJ Zhang, ... IEEE transactions on electromagnetic compatibility 55 (6), 991-998, 2013 | 91 | 2013 |
| Signal/power integrity analysis for multilayer printed circuit boards using cascaded S-parameters F De Paulis, YJ Zhang, J Fan IEEE Transactions on Electromagnetic Compatibility 52 (4), 1008-1018, 2010 | 82 | 2010 |
| Far-field prediction using only magnetic near-field scanning for EMI test X Gao, J Fan, Y Zhang, H Kajbaf, D Pommerenke IEEE transactions on electromagnetic compatibility 56 (6), 1335-1343, 2014 | 76 | 2014 |
| A novel impedance definition of a parallel plate pair for an intrinsic via circuit model YJ Zhang, G Feng, J Fan IEEE transactions on microwave theory and techniques 58 (12), 3780-3789, 2010 | 66 | 2010 |
| Accuracy of physics-based via models for simulation of dense via arrays S Müller, X Duan, M Kotzev, YJ Zhang, J Fan, X Gu, YH Kwark, ... IEEE Transactions on Electromagnetic Compatibility 54 (5), 1125-1136, 2012 | 60 | 2012 |
| A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias ZZ Oo, EX Liu, EP Li, X Wei, Y Zhang, M Tan, LWJ Li, R Vahldieck IEEE Transactions on Advanced Packaging 31 (2), 267-274, 2008 | 56 | 2008 |
| Modeling of ferrite-based materials for shielding enclosures M Koledintseva, J Drewniak, Y Zhang, J Lenn, M Thoms Journal of Magnetism and Magnetic Materials 321 (7), 730-733, 2009 | 48 | 2009 |
| Novel methods for modeling of multiple vias in multilayered parallel-plate structures EX Liu, EP Li, ZZ Oo, X Wei, Y Zhang, RÜ Vahldieck IEEE transactions on microwave theory and techniques 57 (7), 1724-1733, 2009 | 47 | 2009 |
| Systematic microwave network analysis for multilayer printed circuit boards with vias and decoupling capacitors YJ Zhang, ZZ Oo, XC Wei, EX Liu, J Fan, EP Li IEEE Transactions on Electromagnetic Compatibility 52 (2), 401-409, 2010 | 41 | 2010 |
| The hybridization of fast multipole method with asymptotic waveform evaluation for the fast monostatic RCS computation XC Wei, YJ Zhang, EP Li IEEE Transactions on Antennas and Propagation 52 (2), 605-607, 2004 | 41 | 2004 |
| A passive intermodulation source identification measurement system using a vibration modulation method S Yang, W Wu, S Xu, YJ Zhang, D Stutts, DJ Pommerenke IEEE Transactions on Electromagnetic compatibility 59 (6), 1677-1684, 2017 | 38 | 2017 |
| Near-field coupling estimation by source reconstruction and Huygens's equivalence principle L Li, J Pan, C Hwang, G Cho, H Park, Y Zhang, J Fan 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity …, 2015 | 38 | 2015 |
| Complex permittivity and permeability measurements and finite-difference time-domain simulation of ferrite materials J Xu, MY Koledintseva, Y Zhang, Y He, B Matlin, RE DuBroff, JL Drewniak, ... IEEE transactions on electromagnetic compatibility 52 (4), 878-887, 2010 | 37 | 2010 |
| Fast multipole accelerated scattering matrix method for multiple scattering of a large number of cylinders YJ Zhang, EP Li Progress In Electromagnetics Research 72, 105-126, 2007 | 36 | 2007 |
Soumya DeHardware Engineer, AppleDirección de correo verificada de apple.com
