Chris Bailey

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Hua LuUniversity of GreenwichDirección de correo verificada de gre.ac.uk
Stoyan StoyanovProfessor in Computational Engineering, University of Greenwich, London, UKDirección de correo verificada de gre.ac.uk
Mark CrossProfessor of Engineering, Swansea UniversityDirección de correo verificada de swansea.ac.uk
Marc DesmulliezHeriot-Watt University, School of Engineering & Physical Sciences, Edinburgh EH14 4ASDirección de correo verificada de hw.ac.uk
Tim TilfordSenior Lecturer, University of GreenwichDirección de correo verificada de gre.ac.uk
Koulis PericleousProfessor of Computational Fluid Dynamics, University of GreenwichDirección de correo verificada de gre.ac.uk
Y C ChanCity University of Hong KongDirección de correo verificada de cityu.edu.hk
Pushparajah RajaguruUniversity of GreenwichDirección de correo verificada de gre.ac.uk
Gareth TaylorProfessor of Power Systems, Brunel University LondonDirección de correo verificada de brunel.ac.uk
Mayur K PatelUniversity of GreenwichDirección de correo verificada de gre.ac.uk
Dr Ohidul AlamLumentum - TelecommunicationDirección de correo verificada de lumentum.com
Professor Robert KayUniversity of LeedsDirección de correo verificada de leeds.ac.uk
Md Jahir RizviLecturer in Mechanical & Marine Engineering, University of PlymouthDirección de correo verificada de plymouth.ac.uk
Daniel WheelerNational Institute of Standards and TechnologyDirección de correo verificada de nist.gov
David FlynnProfessor , University of GlasgowDirección de correo verificada de Glasgow.ac.uk
S. K. PavuluriHeriot-Watt UniversityDirección de correo verificada de hw.ac.uk
Yasmine RosunallyUniversity of the West of EnglandDirección de correo verificada de uwe.ac.uk
Thamo SutharssanUniversity of East LondonDirección de correo verificada de uel.ac.uk
Samjid H. MannanKing's College LondonDirección de correo verificada de kcl.ac.uk
George GoussetisHeriot-Watt UniversityDirección de correo verificada de ieee.org

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Chris Bailey

Arizona State University

Dirección de correo verificada de asu.edu - Página principal

Electronics Packaging Multi-Physics Modelling Reliability


Título Ordenar por citas Ordenar por año Ordenar por título	Citado por Citado por	Año
Design for reliability of power electronics modules H Lu, C Bailey, C Yin Microelectronics reliability 49 (9-11), 1250-1255, 2009	259	2009
A finite volume procedure to solve elastic solid mechanics problems in three dimensions on an unstructured mesh C Bailey, M Cross International journal for numerical methods in engineering 38 (10), 1757-1776, 1995	175	1995
Prognostic and health management for engineering systems: a review of the data‐driven approach and algorithms T Sutharssan, S Stoyanov, C Bailey, C Yin The Journal of engineering 2015 (7), 215-222, 2015	147	2015
A control volume procedure for solving the elastic stress-strain equations on an unstructured mesh YD Fryer, C Bailey, M Cross, CH Lai Applied mathematical modelling 15 (11-12), 639-645, 1991	138	1991
Dynamic solid mechanics using finite volume methods AK Slone, C Bailey, M Cross Applied mathematical modelling 27 (2), 69-87, 2003	136	2003
Comparison of finite element and finite volume methods application in geometrically nonlinear stress analysis NA Fallah, C Bailey, M Cross, GA Taylor Applied Mathematical Modelling 24 (7), 439-455, 2000	121	2000
Solution of the elastic/visco-plastic constitutive equations: a finite volume approach GA Taylor, C Bailey, M Cross Applied mathematical modelling 19 (12), 746-760, 1995	103	1995
A vertex‐based finite volume method applied to non‐linear material problems in computational solid mechanics GA Taylor, C Bailey, M Cross International journal for numerical methods in engineering 56 (4), 507-529, 2003	87	2003
Predicting optimal process conditions for flip-chip assembly using copper column bumped dies H Lu, C Bailey 4th Electronics Packaging Technology Conference, 2002., 338-343, 2002	77	2002
A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter AK Slone, K Pericleous, C Bailey, M Cross, C Bennett Applied mathematical modelling 28 (2), 211-239, 2004	74	2004
Discretisation procedures for multi-physics phenomena C Bailey, GA Taylor, M Cross, P Chow Journal of Computational and Applied Mathematics 103 (1), 3-17, 1999	73	1999
Lifetime prediction for power electronics module substrate mount-down solder interconnect H Lu, T Tilford, C Bailey, DR Newcombe 2007 International Symposium on High Density packaging and Microsystem …, 2007	70	2007
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications CY Yin, MO Alam, YC Chan, C Bailey, H Lu Microelectronics Reliability 43 (4), 625-633, 2003	68	2003
Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications F Dinmohammadi, D Flynn, C Bailey, M Pecht, C Yin, P Rajaguru, V Robu IEEE access 7, 54658-54669, 2019	66	2019
Analysis of fluid separation in microfluidic T-channels X Xue, MK Patel, M Kersaudy-Kerhoas, MPY Desmulliez, C Bailey, ... Applied Mathematical Modelling 36 (2), 743-755, 2012	62	2012
The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing MJ Rizvi, YC Chan, C Bailey, H Lu, A Sharif Soldering & Surface Mount Technology 17 (2), 40-48, 2005	57	2005
Multiphysics modelling of the metals casting process C Bailey, P Chow, M Cross, Y Fryer, K Pericleous Proceedings of the Royal Society of London. Series A: Mathematical, Physical …, 1996	57	1996
Correlation of solder paste rheology with computational simulations of the stencil printing process R Durairaj, GJ Jackson, NN Ekere, G Glinski, C Bailey Soldering & Surface Mount Technology 14 (1), 11-17, 2002	56	2002
A non-Newtonian computational fluid dynamics study of the stencil printing process GP Glinski, C Bailey, KA Pericleous Proceedings of the Institution of Mechanical Engineers, Part C: Journal of …, 2001	56	2001
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints Y Xu, J Xian, S Stoyanov, C Bailey, RJ Coyle, CM Gourlay, FPE Dunne International Journal of Plasticity 155, 103308, 2022	55	2022

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