| Preparation of highly (111) textured nanotwinned copper by medium-frequency pulsed electrodeposition in an additive-free electrolyte X Zhan, J Lian, H Li, X Wang, J Zhou, K Trieu, X Zhang Electrochimica Acta 365, 137391, 2021 | 62 | 2021 |
| Microstructure and mechanical properties of copper microtubes fabricated via the electroforming process XF Zhan, QD Cao, K Trieu, XP Zhang Journal of Materials Engineering and Performance 29, 1741-1750, 2020 | 19 | 2020 |
| Manipulating the microstructure of Cu from direct current electrodeposition without additives to overcome the strength-ductility trade-off Z Xue, Z Zhu, X Zhan, X Xu, C Shen, A Li, D Zhu Materials Science and Engineering: A 849, 143499, 2022 | 11 | 2022 |
| New precision electroforming process for the simultaneous improvement of thickness uniformity and microstructure homogeneity of wafer-scale nanotwinned copper arrays X Zhan, C Shen, Z Zhu, D Zhu International Journal of Machine Tools and Manufacture 187, 104006, 2023 | 8 | 2023 |
| Friction-assisted pulse electrodeposition of high-performance ultrafine-grained Cu deposits X Xu, Z Zhu, Z Xue, X Zhan Surface Engineering 37 (11), 1414-1421, 2021 | 8 | 2021 |
| In situ epitaxial thickening of wafer-scale, highly oriented nanotwinned Ag on tailored polycrystalline Cu substrates X Zhan, Z Zhu Acta Materialia 268, 119792, 2024 | 5 | 2024 |
| Contradictory Feature Size Effects in the Tensile Yield Strength of Cu Sheets Produced Using Different Sequences Involving Annealing, Rolling, and Grinding J Lv, X Zhan, X Zhang, X Dong Journal of Materials Engineering and Performance 27, 4672-4679, 2018 | 2 | 2018 |
