Physics-based electromigration assessment for power grid networks X Huang, T Yu, V Sukharev, SXD Tan Proceedings of the 51st Annual Design Automation Conference, 1-6, 2014 | 141 | 2014 |
Physics-based Electromigration Models and Full-chip Assessment for Power Grid Networks X Huang, A Kteyan, X Tan, V Sukharev IEEE, 0 | 82 | |
Analytical Modeling and Characterization of Electromigration Effects for Multi-Branch Interconnect Trees HB Chen, S Tan, X Huang, T Kim, V Sukharev IEEE, 2015 | 66 | 2015 |
Task migrations for distributed thermal management considering transient effects Z Liu, SXD Tan, X Huang, H Wang Very Large Scale Integration (VLSI) Systems, IEEE Transactions on 23 (2 …, 2015 | 60 | 2015 |
Post-voiding stress evolution in confined metal lines V Sukharev, A Kteyan, X Huang IEEE, 2015 | 58 | 2015 |
EM-based on-chip aging sensor for detection and prevention of counterfeit and recycled ICs K He, X Huang, SXD Tan Computer-Aided Design (ICCAD), 2015 IEEE/ACM International Conference on …, 2015 | 57 | 2015 |
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing X Huang, V Sukharev, T Kim, H Chen, SXD Tan 2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC), 244-249, 2016 | 42 | 2016 |
Voltage-based electromigration immortality check for general multi-branch interconnects Z Sun, E Demircan, MD Shroff, T Kim, X Huang, SXD Tan Computer-Aided Design (ICCAD), 2016 IEEE/ACM International Conference on, 1-7, 2016 | 37 | 2016 |
Electromigration induced stress evolution under alternate current and pulse current loads V Sukharev, X Huang, SXD Tan Journal of Applied Physics 118 (3), 034504, 2015 | 31 | 2015 |
Learning-based dynamic reliability management for dark silicon processor considering EM effects T Kim, X Huang, HB Chen, V Sukharev, SXD Tan 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), 463-468, 2016 | 30 | 2016 |
IR-drop based electromigration assessment: parametric failure chip-scale analysis V Sukharev, X Huang, HB Chen, SXD Tan Proceedings of the 2014 IEEE/ACM International Conference on Computer-Aided …, 2014 | 30 | 2014 |
Experimental investigation and design optimization guidelines of characteristic variability in silicon nanowire CMOS technology J Zhuge, R Wang, R Huang, J Zou, X Huang, DW Kim, D Park, X Zhang, ... Electron Devices Meeting (IEDM), 2009 IEEE International, 1-4, 2009 | 30 | 2009 |
Interconnect reliability modeling and analysis for multi-branch interconnect trees HB Chen, SXD Tan, V Sukharev, X Huang, T Kim Proceedings of the 52nd Annual Design Automation Conference, 90, 2015 | 22 | 2015 |
Electromigration assessment for power grid networks considering temperature and thermal stress effects X Huang, V Sukharev, JH Choy, M Chew, T Kim, SXD Tan Integration, the VLSI Journal, 2016 | 21 | 2016 |
Distributed task migration for thermal hot spot reduction in many-core microprocessors Z Liu, X Huang, SXD Tan, H Wang, H Tang ASIC (ASICON), 2013 IEEE 10th International Conference on, 1-4, 2013 | 21 | 2013 |
New electromigration modeling and analysis considering time-varying temperature and current densities HB Chen, SXD Tan, X Huang, V Sukharev Design Automation Conference (ASP-DAC), 2015 20th Asia and South Pacific …, 2015 | 17 | 2015 |
Method for fabricating surrounding-gate silicon nanowire transistor with air sidewalls R Huang, J Zhuge, J Fan, Y Ai, R Wang, X Huang US Patent 8,563,370, 2013 | 16 | 2013 |
Fabrication method for surrounding gate silicon nanowire transistor with air as spacers R Huang, J Zhuge, J Fan, Y Ai, R Wang, X Huang US Patent 8,513,067, 2013 | 16 | 2013 |
EM-Based on-Chip Aging Sensor for Dectection of Recycled ICs K He, X Huang, S Tan IEEE, 0 | 14 | |
Heat dissipation structure of SOI field effect transistor R Huang, X Huang, S Xue, Y Ai US Patent 8,598,636, 2013 | 12 | 2013 |