| Signal transmission analysis of multilayer graphene nano-ribbon (MLGNR) interconnects JP Cui, WS Zhao, WY Yin, J Hu IEEE transactions on electromagnetic compatibility 54 (1), 126-132, 2012 | 185 | 2012 |
| Reconfigurable terahertz leaky-wave antenna using graphene-based high-impedance surface XC Wang, WS Zhao, J Hu, WY Yin IEEE Transactions on Nanotechnology 14 (1), 62-69, 2015 | 159 | 2015 |
| Comparative study on multilayer graphene nanoribbon (MLGNR) interconnects WS Zhao, WY Yin IEEE Transactions on Electromagnetic Compatibility 56 (3), 638-645, 2014 | 131 | 2014 |
| Differential Microwave Microfluidic Sensor Based on Microstrip Complementary Split-Ring Resonator (MCSRR) Structure HY Gan, WS Zhao, Q Liu, DW Wang, L Dong, G Wang, WY Yin IEEE Sensors Journal 20 (11), 5876-5884, 2020 | 119 | 2020 |
| Ultrahigh-sensitivity microwave microfluidic sensors based on modified complementary electric-LC and split-ring resonator structures WJ Wu, WS Zhao, DW Wang, B Yuan, G Wang IEEE Sensors Journal 21 (17), 18756-18763, 2021 | 79 | 2021 |
| An Ultrahigh Sensitivity Microwave Sensor for Microfluidic Applications LC Fan, WS Zhao, DW Wang, Q Liu, S Chen, G Wang IEEE Microwave and Wireless Components Letters 30 (12), 1201-1204, 2020 | 78 | 2020 |
| Electromagnetic compatibility-oriented study on through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) arrays WS Zhao, WY Yin, YX Guo IEEE Transactions on Electromagnetic Compatibility 54 (1), 149-157, 2012 | 60 | 2012 |
| Frequency-and temperature-dependent modeling of coaxial through-silicon vias for 3-D ICs WS Zhao, WY Yin, XP Wang, XL Xu IEEE Transactions on Electron Devices 58 (10), 3358-3368, 2011 | 60 | 2011 |
| Mini-review: Recent progress in the development of MoSe2 based chemical sensors and biosensors F Jiang, WS Zhao, J Zhang Microelectronic Engineering 225, 111279, 2020 | 57 | 2020 |
| The gas leak detection based on a wireless monitoring system L Dong, Z Qiao, H Wang, W Yang, W Zhao, K Xu, G Wang, L Zhao, H Yan IEEE Transactions on Industrial Informatics 15 (12), 6240-6251, 2019 | 51 | 2019 |
| Analysis of Cu-Graphene Interconnects ZH Cheng, WS Zhao, DW Wang, J Wang, L Dong, G Wang, WY Yin IEEE Access 6, 53499-53508, 2018 | 48 | 2018 |
| Tunable THz Multiband Frequency-Selective Surface Based on Hybrid Metal–Graphene Structures DW Wang, WS Zhao, H Xie, J Hu, L Zhou, W Chen, P Gao, J Ye, Y Xu, ... IEEE Transactions on Nanotechnology 16 (6), 1132-1137, 2017 | 46 | 2017 |
| Swarm Intelligence Algorithm-Based Optimal Design of Microwave Microfluidic Sensors WS Zhao, BX Wang, DW Wang, B You, Q Liu, G Wang IEEE Transactions on Industrial Electronics 69 (2), 2077-2087, 2021 | 44 | 2021 |
| Investigation of Copper–Carbon Nanotube Composites as Global VLSI Interconnects ZH Cheng, WS Zhao, L Dong, J Wang, P Zhao, H Gao, G Wang IEEE Transactions on Nanotechnology 16 (6), 891-900, 2017 | 44 | 2017 |
| Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects WS Zhao, K Fu, DW Wang, M Li, G Wang, WY Yin Applied Sciences 9 (11), 2174, 2019 | 43 | 2019 |
| Wideband Modeling and Characterization of Differential Through-Silicon Vias for 3-D ICs WS Zhao, J Zheng, F Liang, K Xu, X Chen, G Wang IEEE Transactions on Electron Devices 63 (3), 1168-1175, 2016 | 42 | 2016 |
| Wideband modeling of graphene-based structures at different temperatures using hybrid FDTD method DW Wang, WS Zhao, XQ Gu, W Chen, WY Yin IEEE Transactions on Nanotechnology 14 (2), 250-258, 2015 | 42 | 2015 |
| Vertical Graphene Nanoribbon Interconnects at the End of the Roadmap WS Zhao, ZH Cheng, J Wang, K Fu, DW Wang, P Zhao, G Wang, L Dong IEEE Transactions on Electron Devices 65 (6), 2632-2637, 2018 | 40 | 2018 |
| Electrothermal Cosimulation of 3-D Carbon-Based Heterogeneous Interconnects N Li, J Mao, WS Zhao, M Tang, W Chen, WY Yin IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (4 …, 2016 | 40 | 2016 |
| A CSRR-loaded planar sensor for simultaneously measuring permittivity and permeability HY Gan, WS Zhao, L He, Y Yu, K Xu, F Wen, L Dong, G Wang IEEE Microwave and Wireless Components Letters 30 (2), 219-221, 2020 | 39 | 2020 |
Gaofeng WangDistinguished Professor in Electrical Engineering, Hangzhou Dianzi UniversityVahvistettu sähköpostiosoite verkkotunnuksessa alumni.stanford.edu