| Investigation of mechanical/dynamic properties of carbon fiber reinforced polymer concrete for low noise railway slab EB Jeon, SK Ahn, IG Lee, HI Koh, J Park, HS Kim Composite structures 134, 27-35, 2015 | 75 | 2015 |
| Two-step flash light sintering process for enhanced adhesion between copper complex ion/silane ink and a flexible substrate EB Jeon, SJ Joo, H Ahn, HS Kim Thin Solid Films 603, 382-390, 2016 | 51 | 2016 |
| Bi-axial fracture strength characteristic of an ultra-thin flash memory chip EB Jeon, JD Park, JH Song, HJ Lee, HS Kim Journal of Micromechanics and Microengineering 22 (10), 105014, 2012 | 31 | 2012 |
| In situ fabrication of copper electrodes on carbon-fiber-reinforced polymer (CFRP) for damage monitoring by printing and flash light sintering SJ Joo, MH Yu, EB Jeon, HS Kim Composites Science and Technology 142, 189-197, 2017 | 30 | 2017 |
| Identification of stiffness distribution of fatigue loaded polymer concrete through vibration measurements S Ahn, EB Jeon, HI Koh, HS Kim, J Park Composite Structures 136, 11-15, 2016 | 25 | 2016 |
| An investigation of contact resistance between carbon fiber/epoxy composite laminate and printed silver electrode for damage monitoring EB Jeon, T Fujimura, K Takahashi, HS Kim Composites Part A: Applied Science and Manufacturing 66, 193-200, 2014 | 23 | 2014 |
| Instant electrode fabrication on carbon-fiber-reinforced plastic structures using metal nano-ink via flash light sintering for smart sensing K Takahashi, K Namiki, T Fujimura, EB Jeon, HS Kim Composites Part B: Engineering 76, 167-173, 2015 | 13 | 2015 |
| Analysis of interfacial peeling of an ultrathin silicon wafer chip in a pick-up process using an air blowing method EB Jeon, SH Park, YS Yoo, HS Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 12 | 2016 |
| Dependence of polymer concrete vibration characteristics on internal pipe and damper embedment S Ahn, EB Jeon, W Yang, HI Koh, HS Kim, J Park Composite Structures 143, 347-351, 2016 | 10 | 2016 |
| Measurements of dynamic characteristics of intermediate layer in thin semiconductors B Park, EB Jeon, HS Kim, N Kang, J Park Journal of nanoscience and nanotechnology 13 (12), 7969-7974, 2013 | 6 | 2013 |
| Ultra-fast annealing to reduce the residual stress in ultra-thin chips using flash light EB Jeon, J Park, HS Kim Journal of Micromechanics and Microengineering 24 (4), 045006, 2014 | 5 | 2014 |
| Investigation of damping in the polymer concrete sleeper for use in reduction of rolling noise from railway SK Ahn, E Jeon, J Park, H Kim, H Kho The Journal of the Acoustical Society of America 136 (4_Supplement), 2209-2210, 2014 | 4 | 2014 |
| Evaluation of contact resistance between carbon fiber/epoxy composite laminate and printed silver electrode for damage monitoring EB Jeon, K Takahashi, HS Kim Journal of the Korean Society for Nondestructive Testing 34 (5), 377-383, 2014 | 2 | 2014 |
| Effect of the smart cure cycle on mechanical property of carbon epoxy composite laminate EB Jeon, SH Yoo, SH Chang, HS Kim ICCM Int. Conf. Compos. Mater 1, 2-6, 2011 | 2 | 2011 |
| Apparatus and method for reducing residual stress of semiconductor JD Park, HS Kim, JS Lee, EB Jeon, HT Jin US Patent App. 14/143,759, 2014 | | 2014 |
