| Polymer matrix composite engineering for PDMS based capacitive sensors to achieve high-performance and broad-range pressure sensing AR Tripathy, A Choudhury, A Dash, P Panigrahi, SS Kumar, PP Pancham, ... Applied Surface Science Advances 3, 100062, 2021 | 23 | 2021 |
| Recent advances in flexible force sensors and their applications: A review YW Chen, PP Pancham, A Mukherjee, E Martincic, CY Lo Flexible and Printed Electronics 7 (3), 033002, 2022 | 13 | 2022 |
| Strain visualization in flexible sensors with functional materials: A review PP Pancham, WH Chiu, A Mukherjee, CY Lo Advanced Materials Interfaces 10 (14), 2300029, 2023 | 10 | 2023 |
| Flexible BSA MIM capacitor with negative voltage coefficient for RF applications P Kumar, S Guhathakurata, A Choudhury, A Sharma, AR Tripathy, ... Applied Physics Letters 116 (17), 2020 | 9 | 2020 |
| Novel graphene transfer method to silicone and its sensing application on porous PDMS PP Pancham, A Mukherjee, BL Yuan, P Yu, WH Chiu, G Ahmad, S Mallik, ... IEEE Sensors Letters 7 (5), 1-4, 2023 | 4 | 2023 |
| A sustainable industrial Silicone based substrate as well as circular platform to drive FHE manufacturing and supply chain for wearable, e-skin applications A Mukherjee, PP Pancham, HY Yang 2021 IEEE International Flexible Electronics Technology Conference (IFETC …, 2021 | 4 | 2021 |
| Electromagnetic characteristic estimation on spiral antennas through AOI, ML, and AI MJ Wu, MC Chang, CC Chung, PP Pancham, TJ Yen, CY Lo Flexible and Printed Electronics 7 (2), 025012, 2022 | 2 | 2022 |
| Thermoresistive Profile Sensing Based on Isotropic Strain Detection with Taiji Pattern Routing YR Yang, TC Liu, YW Chen, PP Pancham, G Ahmad, S Mallik, CY Lo IEEE Sensors Journal, 2024 | 1 | 2024 |
| Functional Composite Silicone Made by Roll-to-Roll Manufacturing for Sensing Applications and Circular Economy PP Pancham, A Mukherjee, BL Yuan, P Yu, G Ahmad, S Mallik, CY Lo 2023 IEEE International Flexible Electronics Technology Conference (IFETC), 1-3, 2023 | 1 | 2023 |
| Capacitive Tactile Sensor with Stacked Structure and Hybrid Fabrication for Multiaxial Force Decoupling JY Wu, PP Pancham, TY Hsu, A Mukherjee, CY Lo 2022 IEEE Sensors, 1-3, 2022 | 1 | 2022 |
| Composite and Stretchable Silicone for Niche Profiling Applications PP Pancham, A Mukherjee, TC Liu, KH Lin, WH Chiu, C Liu, CY Lo 2024 IEEE SENSORS, 1-4, 2024 | | 2024 |
| Integrated Pressure and Proximity Sensors on Silicone and PU Substrates that Supports Flexible Hybrid Electronics PP Pancham, A Mukherjee, BL Yuan, CH Tsai, P Yu, CY Lo IEEE Journal on Flexible Electronics, 2024 | | 2024 |
| Optoelectronic device CY Lo, PP PANCHAM, Z Yu-Xin, CL Pan US Patent App. 18/302,157, 2024 | | 2024 |
| 2-D Modelling of Fan-Out Panel Level Package and its Warpage Suppression Solution SP Singh, PP Pancham, CY Lo 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 53-56, 2023 | | 2023 |
| Universal Optimization Solution for Dielectric Geometry on Sensitivity Maximization in Flexible Capacitive Tactile Sensors TY Hsu, CC Wang, PP Pancham, WH Chiu, D Yamane, CY Lo 2023 22nd International Conference on Solid-State Sensors, Actuators and …, 2023 | | 2023 |
| BENDABLE PHOTOVOLTAIC DEVICE PACKAGING STRUCTURES AND ENCAPSULANT MATERIAL CONTAINING CURED SILICONE P YU, LIU Hsuehli, A MUKHERJEE, H WU, LY BOONG, PP PANCHAM US Patent WO/2023/043,448, 2023 | | 2023 |
| 用於電子皮膚應用的靈活且生物兼容的銀/石墨烯電容式傳感器 PP PANCHAM 交通大學電機資訊國際學位學程學位論文 2019, 1-62, 2019 | | 2019 |
Cheng-Yao LoNational Tsing Hua UniversityVahvistettu sähköpostiosoite verkkotunnuksessa mx.nthu.edu.tw