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A. A. Saad
A. A. Saad
School of Mechanical Engineering, Universiti Sains Malaysia
Adresse e-mail validée de usm.my - Page d'accueil
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Characterization of viscoplasticity behaviour of P91 and P92 power plant steels
AA Saad, TH Hyde, W Sun, CJ Hyde, DWJ Tanner
International Journal of Pressure Vessels and Piping 111, 246-252, 2013
782013
Cyclic softening behaviour of a P91 steel under low cycle fatigue at high temperature
AA Saad, W Sun, TH Hyde, DWJ Tanner
Procedia Engineering 10, 1103-1108, 2011
692011
Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan
AM Najib, MZ Abdullah, CY Khor, AA Saad
International Journal of Heat and Mass Transfer 87, 49-58, 2015
542015
Thermal-mechanical fatigue simulation of a P91 steel in a temperature range of 400–600 C
AA Saad, CJ Hyde, W Sun, TH Hyde
Materials at High Temperatures, 2011
532011
Cyclic plasticity and creep of power plant materials
AA Saad
University of Nottingham, 2012
472012
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering
AM Najib, MZ Abdullah, AA Saad, Z Samsudin, FC Ani
Microelectronics Reliability 79, 69-78, 2017
462017
Simulation of the fatigue behaviour of a power plant steel with a damage variable
J Lu, W Sun, A Becker, AA Saad
International Journal of Mechanical Sciences 100, 145-157, 2015
382015
SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
F Che Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ...
Soldering & Surface Mount Technology 30 (1), 1-13, 2018
362018
Thermo-mechanical fatigue testing and simulation using a viscoplasticty model for a P91 steel
CJ Hyde, W Sun, TH Hyde, AA Saad
Computational Materials Science 56, 29-33, 2012
322012
Characterization of SAC–x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly
F Che Ani, A Jalar, AA Saad, CY Khor, MA Abas, Z Bachok, NK Othman
Soldering & Surface Mount Technology 31 (2), 109-124, 2019
252019
The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly
F Che Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ...
The International Journal of Advanced Manufacturing Technology 96, 717-733, 2018
212018
Experimental study of self-alignment during reflow soldering process
AM Najib, MZ Abdullah, AA Saad, Z Samsudin, FC Ani
Journal of Advanced Manufacturing Technology (JAMT) 12 (1 (2)), 355-366, 2018
182018
Stress analysis of a stretchable electronic circuit
AA Norhidayah, AA Saad, MFM Sharif, FC Ani, MYT Ali, MS Ibrahim, ...
Procedia engineering 184, 625-630, 2017
152017
Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process
S Zulfiqar, AA Saad, MFM Sharif, Z Samsudin, MYT Ali, FC Ani, Z Ahmad, ...
Microelectronics Reliability 127, 114373, 2021
142021
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages
MS Haslinda, A Abas, FC Ani, A Jalar, AA Saad, MZ Abdullah
Microelectronics Reliability 79, 336-351, 2017
122017
Wind noise analysis of a two-way radio
UMM Fisol, ZM Ripin, NA Ismail, AA Saad, MKR Hashim, PY Chan, ...
2013 IEEE International Conference on Smart Instrumentation, Measurement and …, 2013
102013
A study on a stretchable conductive polymer of thermoplastic automotive device
MFM Sharif, AA Saad, MK Abdullah, NA Aziz, NA Ismail, FC Ani, MYT Ali, ...
2018 IEEE 38th International Electronics Manufacturing Technology Conference …, 2018
92018
Structural and Random Vibration Analysis of LEDs Conductive Polymer Interconnections
S Zulfiqar, AA Saad, MAW Chek, MFM Sharif, Z Samsudin, MYT Ali
IOP Conference Series: Materials Science and Engineering 815 (1), 012003, 2020
82020
Structural assessment of lead free solder joint of miniaturized electronics assembly
AA Saad, Z Bachok, FC Ani, A Jalar, MA Abas
International Journal of Integrated Engineering 10 (5), 2018
82018
Structural analysis and material characterization of silver conductive ink for stretchable electronics
S Zulfiqar, AA Saad, Z Ahmad, F Yusof, Z Bachok
International Journal of Integrated Engineering 13 (7), 128-135, 2021
72021
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