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Coauteurs
Chun LiUniversity of Electronic Science and Technology of ChinaAdresse e-mail validée de uestc.edu.cn- Johnny C. HoAssociate VP (Enterprise) and Professor, Materials Science and Engin., City University of Hong KongAdresse e-mail validée de cityu.edu.hk
- Sen Po YIPAssociate Professor, Kyushu UniversityAdresse e-mail validée de m.kyushu-u.ac.jp
- Yong LiuProfessor, University of Electronic Science and Technology of ChinaAdresse e-mail validée de uestc.edu.cn
- You MENG (孟优)City University of Hong Kong, Hunan UniversityAdresse e-mail validée de cityu.edu.hk
- Renjie (Leon) WeiCorningAdresse e-mail validée de corning.com
- Dapan LIDepartment of Materials Science and Engineering, City University of Hong KongAdresse e-mail validée de cityu.edu.hk
- Xiuming BuShanghai Institute of Ceramics, Chinese Academy of ScienceAdresse e-mail validée de mail.sic.ac.cn
- Jiangfeng GongHohai UniversityAdresse e-mail validée de hhu.edu.cn
- Shangjian ZhangUniversity of Electronic Science and Technology of ChinaAdresse e-mail validée de uestc.edu.cn
- Xiaoguang LiangCity University of Hong KongAdresse e-mail validée de my.cityu.edu.hk
- ning hanInstitute of Process Engineering, CASAdresse e-mail validée de home.ipe.ac.cn
- Sai Wing TSANGAssociate Professor, Department of Materials Science and Engineering, City University of Hong KongAdresse e-mail validée de cityu.edu.hk
- Guofa DONGCity University of Hong KongAdresse e-mail validée de my.cityu.edu.hk
- Ming Fang (方明)College of Materials Science and Engineering,Shenzhen UniversityAdresse e-mail validée de szu.edu.cn
- Xiuwen Xu (徐修文)Professor, Nanjing University of Posts and TelecommunicationsAdresse e-mail validée de njupt.edu.cn
- Yu-Lun ChuehNational Tsing Huniversity, Materials Science and EngineeringAdresse e-mail validée de mx.nthu.edu.tw
- Qing-Ping DingAmes National Laboratory, Iowa State UniversityAdresse e-mail validée de ameslab.gov
- Zhiqiang WangResearch Associate, Department of Chemistry, University of Western OntarioAdresse e-mail validée de uwo.ca
