Ahmed Busnaina

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Sivasubramanian SomuResearch Associate Professor Northeastern UniversityAdresse e-mail validée de neu.edu
Jin-Goo ParkProfessor of Materials Engineering, Hanyang UniversityAdresse e-mail validée de hanyang.ac.kr
Cihan YilmazPostdoctoral Research Associate, Northeastern UniversityAdresse e-mail validée de coe.neu.edu
Yung Joon Jung"Northeastern University"Adresse e-mail validée de northeastern.edu
Mehmet Remzi DokmeciAssociate Professor, Terasaki Institute for Biomedical InnovationAdresse e-mail validée de terasaki.org
Chia-Ling ChenUniversity of California, Los AngelesAdresse e-mail validée de ucla.edu
HeaYeon LeeVisiting Scholar, Harvard-Mass General Brigham, CEO/Mara Nanotech INCAdresse e-mail validée de neu.edu
M.A.R. SharifThe University of AlabamaAdresse e-mail validée de eng.ua.edu
Young Lae KimAssistant Professor, Gangneung-Wonju National UniversityAdresse e-mail validée de gwnu.ac.kr
Arif Engin CetinIzmir Biomedicine and Genome CenterAdresse e-mail validée de ibg.edu.tr
Jinyoung LeeSangmyung UniversityAdresse e-mail validée de smu.ac.kr
Hatice AltugFull Professor, Ecole Polytechnique Federale de Lausanne (EPFL)Adresse e-mail validée de epfl.ch
K. M. Abrahamresearch professor, northeastern universityAdresse e-mail validée de neu.edu
Ian Ivar SuniDirector, Materials Technology Center; Professor of Chemical and Biomolecular Sciences; Professor ofAdresse e-mail validée de siu.edu
Vladimir TorchilinUniversity Professor, Northeastern UniversityAdresse e-mail validée de neu.edu
Jacqueline A IsaacsMechanical and Industrial Engineering, Northeastern UniversityAdresse e-mail validée de coe.neu.edu
JuKyung LeeGumi Electronics&information Technology Research InstituteAdresse e-mail validée de geri.re.kr
Srinivas SridharUniversity Distinguished Professor, Northeastern UniversityAdresse e-mail validée de northeastern.edu
Hobin JeongNortheastern UniversityAdresse e-mail validée de husky.neu.edu
Jaydev UpponiNortheastern UniversityAdresse e-mail validée de jove.com

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Ahmed Busnaina

W.L. Smith Professor, Northeastern University

Adresse e-mail validée de northeastern.edu - Page d'accueil

Nanomanufacturing and nanoscale wafer printing


Titre Trier par citations Trier par année Trier par titre	Citée par Citée par	Année
Mitigation of layered to spinel conversion of a Li-rich layered metal oxide cathode material for Li-ion batteries MN Ates, Q Jia, A Shah, A Busnaina, S Mukerjee, KM Abraham Journal of The Electrochemical Society 161 (3), A290, 2013	221	2013
The adhesion of dry particles in the nanometer to micrometer-size range DS Rimai, DJ Quesnel, AA Busnaina Colloids and surfaces A: Physicochemical and engineering aspects 165 (1-3), 3-10, 2000	179	2000
Particle adhesion and removal in chemical mechanical polishing and post‐CMP cleaning F Zhang, AA Busnaina, G Ahmadi Journal of the Electrochemical Society 146 (7), 2665, 1999	155	1999
Particle adhesion and removal mechanisms in post-CMP cleaning processes AA Busnaina, H Lin, N Moumen, J Feng, J Taylor IEEE transactions on semiconductor manufacturing 15 (4), 374-382, 2002	146	2002
Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning JG Park, SH Lee, JS Ryu, YK Hong, TG Kim, AA Busnaina Journal of the Electrochemical society 153 (9), G811, 2006	134	2006
An experimental study of megasonic cleaning of silicon wafers AA Busnaina, II Kashkoush, GW Gale Journal of the Electrochemical Society 142 (8), 2812, 1995	127	1995
Method and apparatus to process substrates with megasonic energy GL Montierth, HR Miranda, SL Maraviov, AA Busnaina US Patent 7,238,085, 2007	120	2007
Removal of particulate contaminants using ultrasonics and megasonics: a review GW Gale, AA Busnaina Particulate science and Technology 13 (3-4), 197-211, 1995	117	1995
A nanoparticle convective directed assembly process for the fabrication of periodic surface enhanced Raman spectroscopy substrates V Liberman, C Yilmaz, TM Bloomstein, S Somu, Y Echegoyen, ... Adv. Mater 22 (38), 4298-4302, 2010	109	2010
The removal of deformed submicron particles from silicon wafers by spin rinse and megasonics F Zhang, AA Busnaina, MA Fury, SQ Wang Journal of Electronic Materials 29, 199-204, 2000	106	2000
The role of particle adhesion and surface deformation in chemical mechanical polishing processes F Zhang, A Busnaina Electrochemical and Solid-State Letters 1 (4), 184, 1998	105	1998
Monopole antenna arrays for optical trapping, spectroscopy, and sensing AE Cetin, AA Yanik, C Yilmaz, S Somu, A Busnaina, H Altug Applied Physics Letters 98 (11), 2011	101	2011
Building highly organized single‐walled‐carbon‐nanotube networks using template‐guided fluidic assembly X Xiong, L Jaberansari, MG Hahm, A Busnaina, YJ Jung Small 3 (12), 2006-2010, 2007	100	2007
A reusable high aspect ratio parylene-C shadow mask technology for diverse micropatterning applications S Selvarasah, SH Chao, CL Chen, S Sridhar, A Busnaina, ... Sensors and Actuators A: Physical 145, 306-315, 2008	96	2008
Wall deposition of aerosol particles in a turbulent channel flow S Abuzeid, AA Busnaina, G Ahmadi Journal of Aerosol Science 22 (1), 43-62, 1991	96	1991
Experimental and numerical investigation of nanoparticle removal using acoustic streaming and the effect of time K Bakhtari, RO Guldiken, P Makaram, AA Busnaina, JG Park Journal of the electrochemical society 153 (9), G846, 2006	92	2006
Nanomanufacturing handbook A Busnaina CRC press, 2017	85	2017
Highly aligned scalable platinum-decorated single-wall carbon nanotube arrays for nanoscale electrical interconnects YL Kim, B Li, X An, MG Hahm, L Chen, M Washington, PM Ajayan, ... ACS nano 3 (9), 2818-2826, 2009	85	2009
Roles of cavitation and acoustic streaming in megasonic cleaning GW GALE, AA Busnaina Particulate science and technology 17 (3), 229-238, 1999	83	1999
The adhesion-induced deformation and the removal of submicrometer particles S Krishnan, AA Busnaina, DS Rimai, LP Demejo Journal of adhesion science and technology 8 (11), 1357-1370, 1994	82	1994

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