| Best practices for correlating electrical conductivity with broadband EMI shielding in binary filler-based conducting polymer composites J Hong, J Kwon, D Im, J Ko, CY Nam, HG Yang, SH Shin, SM Hong, ... Chemical Engineering Journal 455, 140528, 2023 | 56 | 2023 |
| High mechanical properties of covalently functionalized carbon fiber and polypropylene composites by enhanced interfacial adhesion derived from rationally designed polymer … HY Seo, KY Cho, D Im, YJ Kwon, M Shon, KY Baek, HG Yoon Composites Part B: Engineering 228, 109439, 2022 | 41 | 2022 |
| Unprecedentedly high thermal conductivity of carbon/epoxy composites derived from parameter optimization studies YS Yeom, KY Cho, HY Seo, JS Lee, CY Nam, HG Yoon Composites Science and Technology 186, 107915, 2020 | 33 | 2020 |
| Simultaneous flow enhancement of high-filled polyamide 66/glass fiber composites HS Choi, D Lim, DG Kim, BG Kim, YS Kim, SG Lee, SG Kim, BW Park, ... Journal of Alloys and Compounds 722, 628-636, 2017 | 13 | 2017 |
| Facile preparation and immediate effect of novel flow modifiers for engineering the flowability of high-filled composites D Im, S Ahn, C Park, HG Yoon, YS Kim, Y Yoo Journal of Materials Research and Technology 14, 47-56, 2021 | 10 | 2021 |
| A strategy for dual-networked epoxy composite systems toward high cross-linking density and solid interfacial adhesion HY Seo, D Im, YJ Kwon, CY Nam, SH Kim, T Nam, C Kim, E Vivek, ... Composites Part B: Engineering 254, 110564, 2023 | 9 | 2023 |
| Scalable and efficient radiative cooling coatings using uniform-hollow silica spheres J Lee, D Im, S Sung, J Yu, H Kim, J Lee, Y Yoo Applied Thermal Engineering 254, 123810, 2024 | 7 | 2024 |
| Polyamide based polymer compositions comprising cyclic compound and polymer based composite material using the same YOO Youngjae, HS Choi, YS Kim, BG Kim, DG Kim, SG Lee, D Im US Patent 10,100,161, 2018 | 1 | 2018 |
