| Thermal comfort analysis in a passenger compartment considering the solar radiation effect JH Moon, JW Lee, CH Jeong, SH Lee International journal of thermal sciences 107 (9), 77-88, 2016 | 114 | 2016 |
| Design and optimization of rotating triboelectric nanogenerator by water electrification and inertia T Kim, J Chung, DY Kim, JH Moon, S Lee, M Cho, SH Lee, S Lee Nano Energy 27 (9), 340-351, 2016 | 103 | 2016 |
| Dynamic wetting and heat transfer characteristics of a liquid droplet impinging on heated textured surfaces JH Moon, M Cho, SH Lee International Journal of Heat and Mass Transfer 97 (6), 308-317, 2016 | 80 | 2016 |
| Spreading and receding characteristics of a non-Newtonian droplet impinging on a heated surface JH Moon, DY Kim, SH Lee Experimental thermal and fluid science 57 (9), 94-101, 2014 | 68 | 2014 |
| Boiling-driven, wickless, and orientation-independent thermal ground plane JH Moon, D Fadda, DH Shin, JS Kim, J Lee, SM You International Journal of Heat and Mass Transfer 167 (3), 120817, 2021 | 36 | 2021 |
| Dynamic behavior of non-Newtonian droplets impinging on solid surfaces JH Moon, JB Lee, SH Lee Materials transactions 54 (2), 260-265, 2013 | 34 | 2013 |
| The thermal conductivity of Al (OH) 3 covered MWCNT/epoxy terminated dimethyl polysiloxane composite based on analytical Al (OH) 3 covered MWCNT H Im, Y Hwang, JH Moon, SH Lee, J Kim Composites Part A: Applied Science and Manufacturing 54 (11), 159-165, 2013 | 25 | 2013 |
| Numerical case study and modeling for spreading thermal resistance and effective thermal conductivity for flat heat pipe M Kim, KH Lee, DI Han, JH Moon Case Studies in Thermal Engineering 31 (3), 101803, 2022 | 19 | 2022 |
| Numerical investigation and modeling of thermal resistance and effective thermal conductivity for two-phase thermosyphon M Kim, JH Moon Case Studies in Thermal Engineering 27 (10), 101358, 2021 | 19 | 2021 |
| Dynamic contact angle and liquid displacement of a droplet impinging on heated textured surfaces JH Moon, M Cho, SH Lee Experimental Thermal and Fluid Science 101 (1), 128-135, 2019 | 18 | 2019 |
| Numerical study on subcooled water jet impingement cooling on superheated surfaces JH Moon, S Lee, J Lee, SH Lee Case Studies in Thermal Engineering 31 (4), 101883, 2022 | 17 | 2022 |
| Observation of a mixed regime for an impinging droplet on a sessile droplet JH Moon, CK Choi, JS Allen, SH Lee International Journal of Heat and Mass Transfer 127 (12), 130-135, 2018 | 16 | 2018 |
| Deep neural network prediction for effective thermal conductivity and spreading thermal resistance for flat heat pipe M Kim, JH Moon International Journal of Numerical Methods for Heat & Fluid Flow, 2022 | 15 | 2022 |
| Thermal Assessment of Lithium-ion Battery Pack System with Heat Pipe Assisted Passive Cooling Using Simulink DY Kim, B Lee, M Kim, JH Moon Thermal Science and Engineering Progress 46 (12), 102230, 2023 | 14 | 2023 |
| Characteristics of heat transfer and chemical reaction of methane-steam reforming in a porous catalytic medium J Lee, JH Han, JH Moon, CH Jeong, M Kim, JY Kim, SH Lee Journal of Mechanical Science and Technology 30 (1), 473-481, 2016 | 12 | 2016 |
| Thermal-Economic Optimization of Plate–Fin Heat Exchanger Using Improved Gaussian Quantum-Behaved Particle Swarm Algorithm JH Moon, KH Lee, H Kim, DI Han Mathematics 10 (14), 2527, 2022 | 9 | 2022 |
| Dynamic characteristics of droplet impingement on microscale hole-patterned surfaces with anodization JH Moon, S Lee, CK Choi, SH Lee International Communications in Heat and Mass Transfer 124 (5), 105260, 2021 | 9 | 2021 |
| Modeling of the evaporation rate of liquid droplets on anodized heated surfaces JH Moon, SM Lee, CK Choi, SH Lee International Communications in Heat and Mass Transfer 98 (11), 209-215, 2018 | 9 | 2018 |
| Effect of Flame Spray Distance on the Adhesive Characteristics of Ni–20 mass% Cr Layers on SCM415 Substrates JB Lee, DH Shin, JH Moon, SH Lee Materials Transactions 53 (11), 2043-2048, 2012 | 8 | 2012 |
| Effect of Integrated Copper Pad on the Performance of Boiling-Driven Wickless Thermal Ground Plane JH Moon, X Wang, D Fadda, DH Shin, J Lee, SM You Applied Thermal Engineering 199 (11), 117595, 2021 | 7 | 2021 |
Seong Hyuk LeeChung-Ang UniversityAdresse e-mail validée de cau.ac.kr
