| Review on the modeling of electrostatic MEMS WC Chuang, HL Lee, PZ Chang, YC Hu Sensors 10 (6), 6149-6171, 2010 | 219 | 2010 |
| The fringe capacitance formula of microstructures WC Chuang, CW Wang, WC Chu, PZ Chang, YC Hu Journal of Micromechanics and Microengineering 22 (2), 025015, 2012 | 40 | 2012 |
| An approximate analytical solution to the pull-in voltage of a micro bridge with an elastic boundary YC Hu, PZ Chang, WC Chuang Journal of Micromechanics and Microengineering 17 (9), 1870, 2007 | 21 | 2007 |
| Electromechanical behavior of the curled cantilever beam WC Chuang, YC Hu, CY Lee, WP Shih, PZ Chang Journal of Micro/Nanolithography, MEMS and MOEMS 8 (3), 033020-033020-8, 2009 | 15 | 2009 |
| A method integrating optimal algorithm and FEM on CMOS residual stress WC Chuang, DTW Lin, YC Hu, HL Lee, CH Cheng, PZ Chang, NB Quyen Journal of Mechanics 30 (02), 123-128, 2014 | 12 | 2014 |
| Study on the Strip Warpage Issues Encountered in the Flip-Chip Process WC Chuang, WL Chen Materials 15 (1), 323, 2022 | 8 | 2022 |
| Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging WC Chuang, Y Huang, PE Chen Materials 16 (9), 3482, 2023 | 7 | 2023 |
| Flexible Strain Sensor, Method for Producing Same, and Measuring Device Including Same WC Chuang, WL Chen, HT Lin US Patent App. 14/557,542, 2014 | 6 | 2014 |
| CMOS-MEMS test-key for extracting wafer-level mechanical properties WC Chuang, YC Hu, PZ Chang Sensors 12 (12), 17094-17111, 2012 | 6 | 2012 |
| A fringing capacitance model for electrostatic microstructure WC Chuang, YC Hu, CW Wang, WC Chu, PZ Chang Proceedings of the 13th International Congress on Mesomechanics, Vicenza …, 2011 | 6 | 2011 |
| Reliability of ball grid array subjected to temperature cycling WC Chuang, B Tsai, WL Chen, J Su 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2017 | 5 | 2017 |
| Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling WC Chuang, WL Chen Journal of Electronic Packaging 142 (1), 011007, 2020 | 4 | 2020 |
| Strengthening of back muscles using a module of flexible strain sensors WC Chuang, HT Lin, WL Chen Sensors 15 (2), 3975-3987, 2015 | 4 | 2015 |
| An electrical testing method of the structural material of micro devices YC Hu, JH Lin, KY Huang, WC Chuang 2008 3rd IEEE International Conference on Nano/Micro Engineered and …, 2008 | 3 | 2008 |
| Real-Time Monitoring for Knee Extensor Muscle Training With Flexible Sensors WC Chuang, WL Chen Journal of Microelectromechanical Systems 28 (6), 1005-1012, 2019 | 2 | 2019 |
| Investigation of Strip Warpage Behavior in Wire Bonding Process WC Chuang, WL Chen Journal of Electronic Packaging 142 (2), 021002, 2020 | 1 | 2020 |
| Using Taguchi method to identify the key factors of increasing spacing between the dies during dicing tape expansion WC Chuang, WL Chen Journal of the Chinese Institute of Engineers 42 (4), 290-296, 2019 | 1 | 2019 |
| Etching holes effects on CMOS-MEMS capacitive structure WH Tu, WC Chuang, WC Chu, CK Lee, PZ Chang, YC Hu | 1 | |
| Analysis for the spacing between the separated dies during the dicing wafer expanding WC Chuang, WL Chen, B Tsai, R Wu 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2016 | | 2016 |
| The robustness of an algorithm applied in wafer-level material property extraction WC Chuang Microsystem Technologies 22 (3), 531-536, 2016 | | 2016 |