Longnan Li

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Nenad MiljkovicUniversity of Illinois at Urbana-ChampaignAdresse e-mail validée de illinois.edu
Xiao Yan (颜笑)Chongqing UniversityAdresse e-mail validée de cqu.edu.cn
Daejoong KimSogang UniversityAdresse e-mail validée de sogang.ac.kr
Soumyadip SettAssistant Professor, Indian Institute of Technology GandhinagarAdresse e-mail validée de iitgn.ac.in
Kazi Fazle RabbiUniversity of illinois at Urbana-ChampaignAdresse e-mail validée de illinois.edu
Muhammad Jahidul HoqueUniversity of Illinois Urbana ChampaignAdresse e-mail validée de illinois.edu
Kilsung KwonKorea Atomic Energy Research InstituteAdresse e-mail validée de kaeri.re.kr
Hyeongyun ChaUniversity at Buffalo, The State University of New YorkAdresse e-mail validée de buffalo.edu
Junho OhDepartment of Mechanical Engineering, Hanyang University ERICAAdresse e-mail validée de hanyang.ac.kr
Siavash KhodakaramiBrown UniversityAdresse e-mail validée de brown.edu
Jingcheng MaAssistant Professor, the University of Notre DameAdresse e-mail validée de nd.edu
Seungjun LeeUniversity of Illinois Urbana ChampaignAdresse e-mail validée de illinois.edu
Chongyan ZhaoTsinghua UniversityAdresse e-mail validée de mails.tsinghua.edu.cn
Kalyan BoyinaTrane TechnologiesAdresse e-mail validée de trane.com
Seong Hyuk LeeChung-Ang UniversityAdresse e-mail validée de cau.ac.kr
Thomas FoulkesFounder of Pacergy and Innovation Crossroads Entrepreneurial Fellow at Oak Ridge National LabAdresse e-mail validée de pacergy.com
Peter SokalskiUniversity of Texas at AustinAdresse e-mail validée de utexas.edu
Sanjiv SinhaAsst. Professor of Mechanical Engineering, University of IllinoisAdresse e-mail validée de illinois.edu
Chenhui ShaoAssociate Professor, Mechanical Engineering, University of Michigan, Ann ArborAdresse e-mail validée de umich.edu
Manjunath C RajagopalIntel Corporation, University of Illinois at Urbana-Champaign.Adresse e-mail validée de intel.com

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Longnan Li

Changchun Institute of Optics Fine Mechanics and Physics, Chinese Academy of Sciences; UIUC

Adresse e-mail validée de ciomp.ac.cn - Page d'accueil

Heat transfer Microfluidics Micro/nanofabrication Electronics cooling


Titre Trier par citations Trier par année Trier par titre	Citée par Citée par	Année
Atmosphere-mediated superhydrophobicity of rationally designed micro/nanostructured surfaces X Yan, Z Huang, S Sett, J Oh, H Cha, L Li, L Feng, Y Wu, C Zhao, ... Acs Nano 13 (4), 4160-4173, 2019	218	2019
Stable dropwise condensation of ethanol and hexane on rationally designed ultrascalable nanostructured lubricant-infused surfaces S Sett, P Sokalski, K Boyina, L Li, KF Rabbi, H Auby, T Foulkes, A Mahvi, ... Nano letters 19 (8), 5287-5296, 2019	134	2019
Hierarchical condensation X Yan, F Chen, S Sett, S Chavan, H Li, L Feng, L Li, F Zhao, C Zhao, ... ACS nano 13 (7), 8169-8184, 2019	104	2019
Laplace pressure driven single-droplet jumping on structured surfaces X Yan, Y Qin, F Chen, G Zhao, S Sett, MJ Hoque, KF Rabbi, X Zhang, ... Acs Nano 14 (10), 12796-12809, 2020	92	2020
Energy harvesting system using reverse electrodialysis with nanoporous polycarbonate track‐etch membranes K Kwon, SJ Lee, L Li, C Han, D Kim International Journal of Energy Research 38 (4), 530-537, 2014	82	2014
Extreme antiscaling performance of slippery omniphobic covalently attached liquids H Zhao, CA Deshpande, L Li, X Yan, MJ Hoque, G Kuntumalla, ... ACS applied materials & interfaces 12 (10), 12054-12067, 2020	75	2020
Molecular and topographical organization: Influence on cicada wing wettability and bactericidal properties J Román‐Kustas, JB Hoffman, JH Reed, AE Gonsalves, J Oh, L Li, ... Advanced Materials Interfaces 7 (10), 2000112, 2020	70	2020
An empirical model for ionic wind generation by a needle-to-cylinder dc corona discharge L Li, SJ Lee, W Kim, D Kim Journal of Electrostatics 73, 125-130, 2015	65	2015
Breaking droplet jumping energy conversion limits with superhydrophobic microgrooves Q Peng, X Yan, J Li, L Li, H Cha, Y Ding, C Dang, L Jia, N Miljkovic Langmuir 36 (32), 9510-9522, 2020	62	2020
Modeling of power generation with thermolytic reverse electrodialysis for low-grade waste heat recovery DH Kim, BH Park, K Kwon, L Li, D Kim Applied Energy 189, 201-210, 2017	54	2017
A study on thermal performance of parallel connected pulsating heat pipe B Kim, L Li, J Kim, D Kim Applied Thermal Engineering 126, 1063-1068, 2017	47	2017
Enabling renewable energy technologies in harsh climates with ultra‐efficient electro‐thermal desnowing, defrosting, and deicing L Li, S Khodakarami, X Yan, K Fazle Rabbi, AA Gunay, A Stillwell, ... Advanced Functional Materials 32 (31), 2201521, 2022	45	2022
A deep learning perspective on dropwise condensation Y Suh, J Lee, P Simadiris, X Yan, S Sett, L Li, KF Rabbi, N Miljkovic, ... Advanced Science 8 (22), 2101794, 2021	44	2021
Composite structured surfaces for durable dropwise condensation HC Chang, MC Rajagopal, MJ Hoque, J Oh, L Li, J Li, H Zhao, ... International Journal of Heat and Mass Transfer 156, 119890, 2020	39	2020
Jumping droplets electronics cooling: Promise versus reality T Foulkes, J Oh, P Sokalski, L Li, S Sett, J Sotelo, X Yan, ... Applied Physics Letters 116 (20), 2020	36	2020
Parallel integration of ionic wind generators on PCBs for enhancing flow rate SJ Lee, L Li, K Kwon, W Kim, D Kim Microsystem Technologies 21, 1465-1471, 2015	35	2015
Ultra-resilient multi-layer fluorinated diamond like carbon hydrophobic surfaces MJ Hoque, L Li, J Ma, H Cha, S Sett, X Yan, KF Rabbi, JY Ho, ... Nature communications 14 (1), 4902, 2023	33	2023
A lipid-inspired highly adhesive interface for durable superhydrophobicity in wet environments and stable jumping droplet condensation J Ma, Z Zheng, MJ Hoque, L Li, KF Rabbi, JY Ho, PV Braun, P Wang, ... ACS nano 16 (3), 4251-4262, 2022	33	2022
High-throughput stamping of hybrid functional surfaces MJ Hoque, X Yan, H Keum, L Li, H Cha, JK Park, S Kim, N Miljkovic Langmuir 36 (21), 5730-5744, 2020	32	2020
Fabrication optimization of ultra-scalable nanostructured aluminum-alloy surfaces L Li, Y Lin, KF Rabbi, J Ma, Z Chen, A Patel, W Su, X Ma, K Boyina, S Sett, ... ACS Applied Materials & Interfaces 13 (36), 43489-43504, 2021	28	2021

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