Damage by radicals and photons during plasma cleaning of porous low-k SiOCH. I. Ar/O2 and He/H2 plasmas J Shoeb, MM Wang, MJ Kushner
Journal of Vacuum Science & Technology A 30 (4), 2012
61 2012 A fast and accurate maximum power point tracker for PV systems S Yuvarajan, J Shoeb
2008 Twenty-Third Annual IEEE Applied Power Electronics Conference and …, 2008
53 2008 Damage by radicals and photons during plasma cleaning of porous low-k SiOCH. II. Water uptake and change in dielectric constant J Shoeb, MJ Kushner
Journal of Vacuum Science & Technology A 30 (4), 2012
36 2012 Systems and methods for achieving peak ion energy enhancement with a low angular spread J Shoeb, Y Wu, A Paterson
US Patent 10,395,894, 2019
29 2019 Mechanisms for sealing of porous low-k SiOCH by combined He and NH3 plasma treatment J Shoeb, MJ Kushner
Journal of Vacuum Science & Technology A 29 (5), 2011
27 2011 Methods and apparatuses for etch profile matching by surface kinetic model optimization MD Tetiker, S Sriraman, AD Bailey III, J Shoeb, A Paterson, RA Gottscho
US Patent 10,386,828, 2019
22 2019 Mechanisms for plasma etching of HfO2 gate stacks with Si selectivity and photoresist trimming J Shoeb, MJ Kushner
Journal of Vacuum Science & Technology A 27 (6), 1289-1302, 2009
21 2009 Multi-level pulsing of DC and RF signals J Shoeb, A Paterson, Y Wu
US Patent 10,580,618, 2020
12 2020 Polymer Cleaning From Porous Low- J Shoeb, MJ Kushner
IEEE Transactions on Plasma Science 39 (11), 2828-2829, 2011
7 2011 Multi-level parameter and frequency pulsing with a low angular spread J Shoeb, A Paterson, Y Wu
US Patent 10,224,183, 2019
6 2019 Multi-level parameter and frequency pulsing with a low angular spread J Shoeb, A Paterson, Y Wu
US Patent 10,573,494, 2020
4 2020 Multi-level pulsing of DC and RF signals J Shoeb, A Paterson, Y Wu
US Patent 10,304,660, 2019
4 2019 Systems for controlling plasma density distribution profiles including multi-rf zoned substrate supports J Shoeb, AM Paterson
US Patent App. 18/013,145, 2023
2 2023 Pulsing rf coils of a plasma chamber in reverse synchronization J Shoeb, TA Kamp, AM Paterson
US Patent App. 18/015,708, 2023
2 2023 Multi-level parameter and frequency pulsing with a low angular spread J Shoeb, A Paterson, Y Wu
US Patent 11,462,390, 2022
2 2022 Minimizing damage of porous SiCOH using He/H2 plasmas J Shoeb, MJ Kushner
2011 Abstracts IEEE International Conference on Plasma Science, 1-1, 2011
2 2011 Comparison Of Cleaning And Damage Of Porous Low-k SiCOH In Ar/O 2 And He/H 2 Plasmas With UV/VUV Fluxes J Shoeb, MJ Kushner
Ispc 20, 2-5, 2011
1 2011 A METHOD AND APPARATUS FOR ENHANCING ION ENERGY AND REDUCING ION ENERGY SPREAD IN AN INDUCTIVELY COUPLED PLASMA J Shoeb, MY Choi, AM Paterson, Y Wang
US Patent App. 18/693,940, 2025
2025 Selective silicon dioxide removal using low pressure low bias deuterium plasma J Shoeb, A Paterson
US Patent App. 18/764,079, 2024
2024 Etching isolation features and dense features within a substrate J Shoeb, AM Paterson, Y Wu
US Patent 12,119,232, 2024
2024 