| Multi-lattice inner structures for high-strength and light-weight in metal selective laser melting process D Kang, S Park, Y Son, S Yeon, SH Kim, I Kim Materials & Design 175, 107786, 2019 | 179 | 2019 |
| Selective compositional range exclusion via directed energy deposition to produce a defect-free Inconel 718/SS 316L functionally graded material SH Kim, H Lee, SM Yeon, C Aranas Jr, K Choi, J Yoon, SW Yang, H Lee Additive Manufacturing 47, 102288, 2021 | 93 | 2021 |
| Thermo-mechanical improvement of Inconel 718 using ex situ boron nitride-reinforced composites processed by laser powder bed fusion SH Kim, GH Shin, BK Kim, KT Kim, DY Yang, C Aranas Jr, JP Choi, JH Yu Scientific reports 7 (1), 14359, 2017 | 72 | 2017 |
| Topography‐supported nanoarchitectonics of hybrid scaffold for systematically modulated bone regeneration and remodeling TS Jang, SJ Park, JE Lee, J Yang, SH Park, MBG Jun, YW Kim, C Aranas, ... Advanced Functional Materials 32 (51), 2206863, 2022 | 51 | 2022 |
| Additive manufacturing of a shift block via laser powder bed fusion: The simultaneous utilisation of optimised topology and a lattice structure SH Kim, SM Yeon, JH Lee, YW Kim, H Lee, J Park, NK Lee, JP Choi, ... Virtual and physical prototyping 15 (4), 460-480, 2020 | 46 | 2020 |
| High-power energy harvesting and imperceptible pulse sensing through peapod-inspired hierarchically designed piezoelectric nanofibers S Kang, SH Kim, HB Lee, S Mhin, JH Ryu, YW Kim, JL Jones, Y Son, ... Nano Energy 99, 107386, 2022 | 32 | 2022 |
| Ternary Bi2Te3In2Te3Ga2Te3 (n-type) thermoelectric film on a flexible PET substrate for use in wearables SH Kim, T Min, JW Choi, SH Baek, JP Choi, C Aranas Jr Energy 144, 607-618, 2018 | 31 | 2018 |
| Lightweight injection mold using additively manufactured Ti-6Al-4V lattice structures SJ Park, JH Lee, J Yang, W Heogh, D Kang, SM Yeon, SH Kim, S Hong, ... Journal of Manufacturing Processes 79, 759-766, 2022 | 28 | 2022 |
| Fabrication of pre-alloyed Al–Li powders with high Li content via thermal dehydrogenation of LiH and rapid solidification process SH Kim, KN Hui, YJ Kim, TS Lim, DY Yang, KB Kim, YJ Kim, GJ Jang, ... Materials & Design 94, 159-165, 2016 | 24 | 2016 |
| Fine microstructured In–Sn–Bi solder for adhesion on a flexible PET substrate: its effect on superplasticity and toughness SH Kim, SM Yeon, JH Kim, SJ Park, JE Lee, SH Park, JP Choi, ... ACS applied materials & interfaces 11 (18), 17090-17099, 2019 | 22 | 2019 |
| Oxidation resistant effects of Ag2S in Sn–Ag–Al solder: A mechanism for higher electrical conductivity and less whisker growth SH Kim, KN Hui, YJ Kim, TS Lim, DY Yang, KB Kim, YJ Kim, S Yang Corrosion Science 105, 25-35, 2016 | 22 | 2016 |
| Functionally graded structure of a nitride-strengthened Mg2Si-based hybrid composite J Yang, W Heogh, H Ju, S Kang, TS Jang, HD Jung, M Jahazi, SC Han, ... Journal of Magnesium and Alloys 12 (3), 1239-1256, 2024 | 21 | 2024 |
| Improved electrical and thermo-mechanical properties of a MWCNT/In–Sn–Bi composite solder reflowing on a flexible PET substrate SH Kim, M Park, JP Choi, C Aranas Jr Scientific reports 7 (1), 13756, 2017 | 21 | 2017 |
| Microstructure and mechanical behavior of low-melting point Bi-Sn-In solder joints VL Nguyen, SH Kim, JW Jeong, TS Lim, DY Yang, KB Kim, YJ Kim, ... Electronic Materials Letters 13, 420-426, 2017 | 21 | 2017 |
| Strengthening mechanisms in a heatvar hot work tool steel fabricated by laser powder bed fusion Y Tian, K Chadha, SH Kim, C Aranas Jr Materials Science and Engineering: A 805, 140801, 2021 | 18 | 2021 |
| Additive manufacturing of the core template for the fabrication of an artificial blood vessel: The relationship between the extruded deposition diameter and the filament/nozzle … SJ Park, J Lee, JW Choi, JH Yang, JH Lee, J Lee, Y Son, CW Ha, NK Lee, ... Materials Science and Engineering: C 118, 111406, 2021 | 17 | 2021 |
| Thermo-mechanical evolution of ternary Bi–Sn–In solder micropowders and nanoparticles reflowed on a flexible PET substrate SH Kim, DY Yang, YJ Kim, T Min, J Choi, J Yun, KB Kim, YJ Kim, JH Lee, ... Applied Surface Science 415, 28-34, 2017 | 15 | 2017 |
| A phenomenological study of a Sn–Ag–Al composite solder reinforced with Mg–MWCNT: Improved electrical conductivity and thermo-physical performance SH Kim, JP Choi, Y Eom, Y Nam, S Baek, C Aranas Jr Materials & Design 140, 196-208, 2018 | 14 | 2018 |
| A modular solder system with hierarchical morphology and backward compatibility HB Lee, YW Kim, SH Kim, SH Park, JP Choi, C Aranas Jr Small 14 (33), 1801349, 2018 | 13 | 2018 |
| A flexible electromagnetic interference shielding film coated with a hybrid solder-magnetic powder mixture on a PET substrate JH Lee, DS Kang, SH Kim, MJ Son, JW Choi, DK Choi, JP Choi, ... Journal of Materiomics 4 (4), 390-401, 2018 | 12 | 2018 |
