| A low-cost, precise piezoelectric droplet-on-demand generator DM Harris, T Liu, JWM Bush Experiments in Fluids 56 (4), 83, 2015 | 91 | 2015 |
| Optimizing the design of composite phase change materials for high thermal power density MT Barako, S Lingamneni, JS Katz, T Liu, KE Goodson, J Tice Journal of Applied Physics 124 (14), 145103, 2018 | 64 | 2018 |
| Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution T Liu, MT Dunham, KW Jung, B Chen, M Asheghi, KE Goodson International Journal of Heat and Mass Transfer 152, 119569, 2020 | 56 | 2020 |
| Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics S Scholl, C Gorle, F Houshmand, T Liu, H Lee, Y Won, M Asheghi, ... ASME 2015 International Technical Conference and Exhibition on Packaging and …, 2015 | 52 | 2015 |
| Heat transfer innovations and their application in thermal desalination processes T Liu, MS Mauter Joule, 2022 | 38 | 2022 |
| Performance and Manufacturing of Silicon-based Vapor Chambers T Liu, M Asheghi, K Goodson Applied Mechanics Reviews, 2021 | 36 | 2021 |
| Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density Gan-Sic chip T Liu, F Houshmand, C Gorle, S Scholl, H Lee, Y Won, M Asheghi, ... ASME 2015 International Technical Conference and Exhibition on Packaging and …, 2015 | 31 | 2015 |
| Low Offset and Noise in High Biased GaN 2DEG Hall-Effect Plates Investigated With Infrared Microscopy KM Dowling, T Liu, HS Alpert, CA Chapin, SR Eisner, AS Yalamarthy, ... Journal of Microelectromechanical Systems, 2020 | 16 | 2020 |
| Tunable, passive thermal regulation through liquid to vapor phase change T Liu, JW Palko, JS Katz, EM Dede, F Zhou, M Asheghi, KE Goodson Applied Physics Letters 115 (25), 254102, 2019 | 13 | 2019 |
| Optimization of hybrid wick structures for extreme spreading in high performance vapor chambers T Liu, S Lingamneni, J Palko, M Asheghi, KE Goodson Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 …, 2016 | 13 | 2016 |
| Multiobjective Optimization of Graded, Hybrid Micropillar Wicks for Capillary-Fed Evaporation T Liu, M Asheghi, KE Goodson Langmuir, 2021 | 12 | 2021 |
| Lithography and Etching‐Free Microfabrication of Silicon Carbide on Insulator using Direct UV Laser Ablation TK Nguyen, HP Phan, KM Dowling, AS Yalamarthy, T Dinh, ... Advanced Engineering Materials, 2020 | 8 | 2020 |
| Analytical modeling for prediction of chip package-level thermal performance T Liu, M Iyengar, C Malone, KE Goodson Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 …, 2016 | 7 | 2016 |
| Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure S Hazra, T Liu, M Asheghi, K Goodson ASME 2020 International Technical Conference and Exhibition on Packaging and …, 2020 | 6 | 2020 |
| Steady-State Parametric Optimization and Transient Characterization of Heat Flow Regulation with Binary Diffusion T Liu, JW Palko, JS Katz, F Zhou, EM Dede, M Asheghi, KE Goodson IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020 | 2 | 2020 |
| Numerical Study of Single-Phase Immersion Cooling Limits for Bare Die Packages S Khalili, T Liu, J Padilla, M Iyengar International Electronic Packaging Technical Conference and Exhibition 88469 …, 2024 | | 2024 |
| Numerical Study of Two-Phase Immersion Cooling Limits for Bare Die Packages With Novec 649 T Liu, S Khalili, J Padilla, M Iyengar International Electronic Packaging Technical Conference and Exhibition 88469 …, 2024 | | 2024 |
| Comparative Infrared Microscopy for Measuring Membrane Thermal Conductivity and Validating Theoretical Heat Transport Models T Liu, MS Mauter ACS ES&T Engineering, 2023 | | 2023 |
| Thermal modeling of single-phase and two-phase 2D-chip cooling using microchannels CR Kharangate, H Lee, T Liu, KW Jung, MK Iyengar, C Malone, ... Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 …, 2017 | | 2017 |