| Chip-last (RDL-first) fan-out panel-level packaging (FOPLP) for heterogeneous integration JH Lau, CT Ko, CY Peng, KM Yang, T Xia, PB Lin, JJ Chen, PC Huang, ... Journal of Microelectronics and Electronic Packaging 17 (3), 89-98, 2020 | 65 | 2020 |
| Panel-level fan-out RDL-first packaging for heterogeneous integration JH Lau, CT Ko, KM Yang, CY Peng, T Xia, PB Lin, JJ Chen, PPC Huang, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 42 | 2020 |
| Improving interfacial electron transfer and light harvesting in dye-sensitized solar cells by using Ag nanowire/TiO 2 nanoparticle composite films PC Huang, TY Chen, YL Wang, CY Wu, TL Lin RSC advances 5 (86), 70172-70177, 2015 | 28 | 2015 |
| Heterogeneous junction engineering on core–shell nanocatalysts boosts the dye-sensitized solar cell CY Wu, YT Liu, PC Huang, TJM Luo, CH Lee, YW Yang, TC Wen, ... Nanoscale 5 (19), 9181-9192, 2013 | 18 | 2013 |
| Gold atomic clusters extracting the valence electrons to shield the carbon monoxide passivation on near-monolayer core–shell nanocatalysts in methanol oxidation reactions TY Chen, HD Li, GW Lee, PC Huang, PW Yang, YT Liu, YF Liao, HT Jeng, ... Physical Chemistry Chemical Physics 17 (23), 15131-15139, 2015 | 10 | 2015 |
| Mesoporous TiO2 film modified with a sol–gel based interconnecting network for boosting the dye-sensitized solar cell performance PC Huang, TY Chen, YL Wang, TL Lin Thin solid films 570, 268-272, 2014 | 8 | 2014 |
| Oxidation triggered atomic restructures enhancing the electrooxidation activities of carbon supported platinum–ruthenium catalysts PC Huang, HS Chen, YT Liu, IL Chen, SY Huang, HM Nguyen, KW Wang, ... CrystEngComm 16 (43), 10066-10079, 2014 | 8 | 2014 |
| Effects of different surfactant additions and treatments on the characteristics of tin nanosolder by chemical reduction method PC Huang, JG Duh 2008 58th Electronic Components and Technology Conference, 431-435, 2008 | 8 | 2008 |
| Thermal cycling test and simulation of fan-out chip-last panel-level packaging for heterogeneous integration JH Lau, CT Ko, CY Peng, KM Yang, T Xia, PB Lin, JJ Chen, PC Huang, ... Journal of Microelectronics and Electronic Packaging 18 (2), 29-39, 2021 | 7 | 2021 |
| Reliability of chip-last fan-out panel-level packaging for heterogeneous integration JH Lau, CT Ko, CY Peng, KM Yang, T Xia, PB Lin, JJ Chen, PC Huang, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 359-364, 2021 | 5 | 2021 |
| Shell thickness effects on reconfiguration of NiO core–Pt shell anodic catalysts in a high current density direct methanol fuel cell TY Chen, PC Huang, YF Liao, YT Liu, TK Yeh, TL Lin RSC Advances 6 (76), 72607-72615, 2016 | 5 | 2016 |
| Novel Lead-Free Sn-Cu-xBi Nanosolders by Chemical Reduction Method PC Huang, JG Duh Journal of Nanoscience and Nanotechnology 9 (2), 764-768, 2009 | 4 | 2009 |
| A novel polymer-based ultra-high density bonding interconnection YM Lin, TYO Yang, OH Lee, CK Lee, HK Ko, YS Chen, HH Chang, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1779-1784, 2023 | 3 | 2023 |
| Fan-Out RDL-first Panel-Level Packaging for Heterogeneous Integration JH Lau, CT Ko, KM Yang, CY Peng, T Xia, PB Lin, JJ Chen, PC Huang, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 339-347, 2020 | 3 | 2020 |
