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Joanna AizenbergHarvard UniversityAdresse e-mail validée de seas.harvard.edu
Tak-Sing WongProfessor of Mechanical Engineering, The Pennsylvania State UniversityAdresse e-mail validée de psu.edu
Katia BertoldiSEAS, Harvard UniversityAdresse e-mail validée de seas.harvard.edu
Lichen FangApple Inc.Adresse e-mail validée de jhu.edu
Dr. Sicong ShanSchool of Engineering and Applied Sciences (SEAS), Harvard UniversityAdresse e-mail validée de seas.harvard.edu
Pai WangUniversity of Utah; Harvard UniversityAdresse e-mail validée de utah.edu
Philseok KimARPA-E, Department of EnergyAdresse e-mail validée de hq.doe.gov
Santiago Orrego, Ph.D.Assistant Professor, Temple UniversityAdresse e-mail validée de temple.edu
Krishna MandalDepartment of Electrical Engineering, University of South Carolina, Columbia, SC 29208, USAAdresse e-mail validée de cec.sc.edu
Sindy KY TangAssociate Professor, Mechanical Engineering, Stanford UniversityAdresse e-mail validée de stanford.edu
Boaz PokroyTechnion Israel Institute of TechnologyAdresse e-mail validée de technion.ac.il
L MahadevanHarvard, Cambridge, MITAdresse e-mail validée de seas.harvard.edu
James C. WeaverWyss Institute, Harvard UniversityAdresse e-mail validée de wyss.harvard.edu
Jordan R. RaneyUniversity of PennsylvaniaAdresse e-mail validée de seas.upenn.edu
Jennifer A. LewisHarvard UniversityAdresse e-mail validée de seas.harvard.edu
Vladimir BulovicMassachusetts Institute of TechnologyAdresse e-mail validée de mit.edu
Andrej KošmrljAssociate Professor of Mechanical and Aerospace Engineering, Princeton UniversityAdresse e-mail validée de princeton.edu
Samuel ShianResearch Associate in Materials Science and Mechanical Engineering, Harvard UniversityAdresse e-mail validée de seas.harvard.edu
Mikhail KatsElectrical and Computer Engineering, University of Wisconsin-MadisonAdresse e-mail validée de wisc.edu
Darren J. LipomiDepartment of Chemical Engineering, University of RochesterAdresse e-mail validée de rochester.edu