Suivre
Guy Cohen
Guy Cohen
Researcher, IBM T.J. Watson Research Center, Yorktown Height, New York
Adresse e-mail validée de us.ibm.com
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Année
High performance and highly uniform gate-all-around silicon nanowire MOSFETs with wire size dependent scaling
S Bangsaruntip, GM Cohen, A Majumdar, Y Zhang, SU Engelmann, ...
2009 IEEE International Electron Devices Meeting (IEDM), 1-4, 2009
6312009
Gate-all-around silicon nanowire 25-stage CMOS ring oscillators with diameter down to 3 nm
S Bangsaruntip, A Majumdar, GM Cohen, SU Engelmann, Y Zhang, ...
2010 symposium on VLSI technology, 21-22, 2010
3212010
Electrical integrity of state-of-the-art 0.13/spl mu/m SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication
KW Guarini, AW Topol, M Ieong, R Yu, L Shi, MR Newport, DJ Frank, ...
Digest. International Electron Devices Meeting,, 943-945, 2002
2062002
Universality of short-channel effects in undoped-body silicon nanowire MOSFETs
S Bangsaruntip, GM Cohen, A Majumdar, JW Sleight
IEEE Electron Device Letters 31 (9), 903-905, 2010
1952010
Nanowire field-effect transistors
S Bangsaruntip, GM Cohen, KL Saenger
US Patent 7,795,677, 2010
1912010
Strained-channel Fin field effect transistor (FET) with a uniform channel thickness and separate gates
GM Cohen
US Patent 7,355,253, 2008
1732008
Method of forming vertical FET with nanowire channels and a silicided bottom contact
GM Cohen, PM Solomon
US Patent 7,446,025, 2008
1432008
Vertical FET with nanowire channels and a silicided bottom contact
GM Cohen, PM Solomon
US Patent 7,230,286, 2007
1262007
Process for forming a surrounding gate for a nanowire using a sacrificial patternable dielectric
S Bangsaruntip, G Cohen, MA Guillorn
US Patent 9,029,834, 2015
1252015
Density scaling with gate-all-around silicon nanowire MOSFETs for the 10 nm node and beyond
S Bangsaruntip, K Balakrishnan, SL Cheng, J Chang, M Brink, I Lauer, ...
2013 IEEE international electron devices meeting, 20.2. 1-20.2. 4, 2013
1252013
Strained-channel Fin field effect transistor (FET) with a uniform channel thickness and separate gates
GM Cohen
US Patent 7,384,830, 2008
1192008
Maskless process for suspending and thinning nanowires
S Bangsaruntip, G Cohen, JW Sleight
US Patent 7,884,004, 2011
1162011
Two gates are better than one [double-gate MOSFET process]
PM Solomon, KW Guarini, Y Zhang, K Chan, EC Jones, GM Cohen, ...
IEEE circuits and devices magazine 19 (1), 48-62, 2003
1162003
Mixed orientation and mixed material semiconductor-on-insulator wafer
GM Cohen, A Reznicek, KL Saenger, M Yang
US Patent 7,125,785, 2006
1152006
Self-aligned double-gate MOSFET by selective epitaxy and silicon wafer bonding techniques
KK Chan, GM Cohen, Y Taur, HSP Wong
US Patent 6,365,465, 2002
1062002
Triple-self-aligned, planar double-gate MOSFETs: devices and circuits
KW Guarini, PM Solomon, Y Zhang, KK Chan, EC Jones, GM Cohen, ...
International Electron Devices Meeting. Technical Digest (Cat. No. 01CH37224 …, 2001
1052001
Self-aligned silicide (salicide) process for low resistivity contacts to thin film silicon-on-insulator and bulk mosfets and for shallow junctions
C Cabral, K Chan, G Cohen, C Lavoie, R Roy, P Solomon
US Patent App. 10/989,639, 2006
1002006
Semiconductor-on-insulator lateral pin photodetector with a reflecting mirror and backside contact and method for forming the same
GM Cohen, K Rim, DL Rogers, JD Schaub, M Yang
US Patent 6,667,528, 2003
992003
Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures
AW Topol, BK Furman, KW Guarini, L Shi, GM Cohen, GF Walker
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
962004
Method and system for providing a quality metric for improved process control
D Kandel, G Cohen, D Klein, V Levinski, N Sapiens, A Shulman, ...
US Patent 11,372,340, 2022
882022
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