Macroscopic and microscopic investigation on chemical mechanical polishing of sapphire wafer H Lee, H Lee, H Jeong, S Choi, Y Lee, M Jeong, H Jeong Journal of Nanoscience and Nanotechnology 12 (2), 1256-1259, 2012 | 53 | 2012 |
Polypyrrole films with micro/nanosphere shapes for electrodes of high-performance supercapacitors JK Lee, H Jeong, R Lassarote Lavall, A Busnaina, Y Kim, YJ Jung, ... ACS applied materials & interfaces 9 (38), 33203-33211, 2017 | 36 | 2017 |
High‐Rate Nanoscale Offset Printing Process Using Directed Assembly and Transfer of Nanomaterials H Cho, S Somu, JY Lee, H Jeong, A Busnaina Advanced materials 27 (10), 1759-1766, 2015 | 30 | 2015 |
Planarization of wafer edge profile in chemical mechanical polishing Y Park, H Jeong, S Choi, H Jeong International Journal of Precision Engineering and Manufacturing 14, 11-15, 2013 | 23 | 2013 |
Prediction of real contact area from microtopography on CMP pad H Jeong, H Lee, S Choi, Y Lee, H Jeong Journal of Advanced Mechanical Design, Systems, and Manufacturing 6 (1), 113-120, 2012 | 17 | 2012 |
Fabrication of organic field effect transistors using directed assembled and transfer printed carbon nanotube source/drain electrodes Z Chai, H Jeong, SA Abbasi, AA Busnaina Applied Physics Letters 114 (10), 2019 | 16 | 2019 |
Solution processed all-carbon transistors via directed assembly and transfer printing of CNT channel and electrodes WH Wang, SA Abbasi, Z Chai, H Jeong, A Busnaina Applied physics letters 117 (13), 2020 | 5 | 2020 |
Effect of Current Density on Material Removal in Cu ECMP E Park, H Lee, H Jeong, H Jeong Tribology and Lubricants 31 (3), 79-85, 2015 | 3 | 2015 |
Development of Directed-Assembly Based Printing Process for Electronics, Sensing, and Material Application H Jeong Northeastern University, 2017 | 1 | 2017 |
Effect of Pad Wear on Stress Distribution in CMP Process SH Choi, HS Lee, MK Jeong, HB Jeong, HJ Lee, HH Jo, HD Jeong Proceedings of the Korean Society of Precision Engineering Conference, 123-124, 2010 | 1 | 2010 |
Damascene template for nanoelement printing fabricated without chemomechanical planarization H Jeong, A Busnaina US Patent 11,156,914, 2021 | | 2021 |
Highly engineered pyrrole micro-loop arrays for high-capacitance supercapacitor JK Lee, H Jeong, A Busnaina, YJ Jung, HY Lee ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY 252, 2016 | | 2016 |
AFM detection of an Alzheimer marker: Different stages of amyloid beta peptide on a mica substrate JK Lee, H Jeong, C Bubar, A Busnaina, HY Lee Journal of the Korean Physical Society 67, 1957-1960, 2015 | | 2015 |
Wafer Edge Profile Control for Improvement of Removal Uniformity in Oxide CMP SH Choi, HB Jeong, YB Park, HJ Lee, HJ Kim, HD Jeong Journal of the Korean Society for Precision Engineering 29 (3), 289-294, 2012 | | 2012 |