| Flexible router architecture for network-on-chip MS Sayed, A Shalaby, M El-Sayed, V Goulart Computers & Mathematics with Applications 64 (5), 1301-1310, 2012 | 38 | 2012 |
| A survey on the security of wired, wireless, and 3D network-on-chips A Sarihi, A Patooghy, A Khalid, M Hasanzadeh, M Said, AHA Badawy IEEE Access 9, 107625-107656, 2021 | 27 | 2021 |
| LoCool: Fighting Hot Spots Locally for Improving System Energy Efficiency AKC F. Kaplan, M. Said, S. Reda IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2019 | 25* | 2019 |
| Securing network-on-chips via novel anonymous routing A Sarihi, A Patooghy, M Hasanzadeh, M Abdelrehim, AHA Badawy Proceedings of the 15th IEEE/ACM International Symposium on Networks-on-Chip …, 2021 | 15 | 2021 |
| Thermal-aware network-on-chips: Single-and cross-layered approaches M Said, A Shalaby, F Gebali Future Generation Computer Systems 91, 61-85, 2019 | 13 | 2019 |
| Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips AKC Z. Yuan, G. Vaartstra, P. Shukla, M. Said, S. Reda, E. Wang 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2019 | 10 | 2019 |
| Understanding The Sources of Power Consumption in Mobile SoCs SR M. Said, S. Chetoui, A. Belouchrani IEEE International Green and Sustainable Computing Conference (IGSC), 2018 | 9* | 2018 |
| Securing network-on-chips against fault-injection and crypto-analysis attacks via stochastic anonymous routing A Patooghy, M Hasanzadeh, A Sarihi, M Abdelrehim, AHA Badawy ACM Journal on Emerging Technologies in Computing Systems 19 (3), 1-21, 2023 | 7 | 2023 |
| Improving performance and fabrication metrics of three-dimensional ics by multiplexing through-silicon vias M Said, F Mehdipour, M El-Sayed 2013 Euromicro Conference on Digital System Design, 925-932, 2013 | 7 | 2013 |
| An efficient reconfigurable neural network on chip K Khalil, B Dey, M Abdelrehim, A Kumar, M Bayoumi 2021 28th IEEE International Conference on Electronics, Circuits, and …, 2021 | 6 | 2021 |
| CONGESTION MITIGATION USING FLEXIBLE ROUTER ARCHITECTURE FOR NETWORK-ON-CHIP M Said Egypt-Japan University of Science and Technology (E-JUST), 2012 | 6 | 2012 |
| Novel flexible buffering architectures for 3D-NoCs M Said, A Sarihi, A Patooghy, AM El-Mohandes, AHA Badawy, F Gebali Sustainable Computing: Informatics and Systems 29, 100472, 2021 | 5 | 2021 |
| BIC: Blind Identification Countermeasure for Malicious Thermal Sensor Attacks in Mobile SoCs M Abdelrehim, A Patooghy, A Malekmohammadi, AHA Badawy 2022 23rd International Symposium on Quality Electronic Design (ISQED), 1-6, 2022 | 4 | 2022 |
| Securing on-chip communications: An on-the-fly encryption architecture for socs A Sarihi, A Patooghy, M Hasanzadeh, M Abdelrehim, AHA Badawy 2021 International Conference on Computational Science and Computational …, 2021 | 4 | 2021 |
| Performance evaluation of buffer sharing routers for Network on Chip H Hassan, M Said, HW Kim 2016 IEEE 59th International Midwest Symposium on Circuits and Systems …, 2016 | 4 | 2016 |
| Keep-Out-Zone analysis for three-dimensional ICs M Said, M El-Sayed, F Mehdipour, N Miyakawa Technical Papers of 2014 International Symposium on VLSI Design, Automation …, 2014 | 4 | 2014 |
| Thermal analysis of three-dimensional ICs, investigating the effect of through-silicon vias and fabrication parameters M Said, F Mehdipour, M El-Sayed 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS …, 2013 | 4 | 2013 |
| A novel power reduction technique using wire multiplexing M Said, H Hassan, HW Kim, M Khamis 2017 30th IEEE International System-on-Chip Conference (SOCC), 149-152, 2017 | 3 | 2017 |
| A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias M Said, A Shalaby, F Mehdipour, M Biglari-Abhari, M El-Sayed Microprocessors and Microsystems 43, 26-46, 2016 | 3 | 2016 |
| A design methodology for performance maintenance of 3d network-on-chip with multiplexed through-silicon vias M Said, F Mehdipour, K Murakami, M El-Sayed Proceedings of the 3rd International Workshop on Many-core Embedded Systems …, 2015 | 3 | 2015 |
Abdel-Hameed A. BadawyAssociate Professor, Klipsch School of Electrical & Computer Engineering, New Mexico State Univ.Adresse e-mail validée de nmsu.edu