Profili

Victor M. Bright

Professor of Mechanical Engineering, University of Colorado

Potvrđena adresa e-pošte na colorado.edu

Spominje se 12018 puta

electronics packaging microsensors MEMS NEMS atomic-layer deposition (ALD)

Hafiz Waqas Ali

Dalian University of Technology

Spominje se 11428 puta

electronics packaging IC reliability lead free solders renewable energy advanced materials

james drewniak

Missouri University of Science and Technology

Potvrđena adresa e-pošte na mst.edu

Spominje se 10891 puta

Electromagnetic Compatibility Electronics Packaging Signal and Power Integrity

Bahgat G Sammakia

Binghamton University

Potvrđena adresa e-pošte na binghamton.edu

Spominje se 10191 puta

Electronics packaging thermal sciences electronics cooling heat transfer data centers

Mohd Faizul Mohd Sabri

Universiti Malaya

Potvrđena adresa e-pošte na um.edu.my

Spominje se 6957 puta

Thermoelectric Electronics packaging Micro/Nano devices MEMS

Takafumi Fukushima

Associate Procfessor, Tohoku University

Potvrđena adresa e-pošte na lbc.mech.tohoku.ac.jp

Spominje se 5279 puta

Electronics Packaging 3D IC Micro/Nano/Self-Assemby DSA Polymer Technologies

Chris Bailey

Arizona State University

Potvrđena adresa e-pošte na asu.edu

Spominje se 4904 puta

Electronics Packaging Multi-Physics Modelling Reliability

Willem G. Odendaal

Associate Professor of Electrical and Computer Engineering, Virginia Tech

Potvrđena adresa e-pošte na vt.edu

Spominje se 4688 puta

power electronics pulse power electromagnetics electronics packaging

Eiji Higurashi

Tohoku University

Potvrđena adresa e-pošte na tohoku.ac.jp

Spominje se 4247 puta

Electronics Packaging Low Temperature Bonding Sensors and MEMS

Kim S Siow

Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia …

Potvrđena adresa e-pošte na ukm.edu.my

Spominje se 4158 puta

sintered silver electronics packaging mechanical behavior of materials plasma treatment

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