| Micro indentation measurements of the creep properties of CABGA doped solder joint MEA Belhadi, FJ Akkara, MA Hoque, PP Vyas, X Wei, A Shmatok, ... 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 18 | 2021 |
| Drop shock performance of SAC-Bi compared to SnPb PP Vyas, MEA Belhadi, X Wei, E HMasha, A Alakayleh, A Srinivasan, ... 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 17 | 2022 |
| Effect of temperature on the low cycle fatigue properties of BGA solder joints X Wei, A Alahmer, H Ali, S Tahat, PP Vyas Microelectronics Reliability 146, 115031, 2023 | 15 | 2023 |
| Fatigue performance of aged SAC-Bi solder joint under varying stress cycling M Jian, PP Vyas, X Wei, MEA Belhadi, J Suhling, P Lall 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 10 | 2021 |
| Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies PP Vyas, A Alahmer, SS Alavi, MEA Belhadi IEEE Transactions on Components, Packaging and Manufacturing Technology 14 …, 2024 | 9 | 2024 |
| Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature X Wei, A Alahmer, MEA Belhadi, PP Vyas Microelectronics Reliability 149, 115217, 2023 | 9 | 2023 |
| Reliability and IMC layer evolution of homogenous lead-free solder joints during thermal cycling MEA Belhadi, X Wei, P Vyas, R Zhao, S Hamasha, H Ali, J Suhling, P Lall, ... Proc. IPC APEX EXPO Tech. Conf., 1-14, 2022 | 7 | 2022 |
| Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling MEA Belhadi, X Wei, Q Qasaimeh, P Vyas, R Zhao, E Hmasha, D Ali, ... 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 4 | 2022 |
| Thermal cycling reliability of lead-free solder alloys using surface mount resistors considering aging FJ Akkara, M Abueed, A Srinivasan, M Belhadi, P Vyas, J Suhling, P Lall 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 4 | 2021 |
| Fatigue and shear properties of novel lead-free solder joints with low melting temperatures X Wei, MEA Belhadi, PP Vyas, ARN Sakib, H Ali 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 3 | 2022 |
| Drop shock testing analysis at elevated temperature: assessing SAC305 solder alloy reliability in BGA assemblies PP Vyas, A Alahmer, S Bolanos, SS Alavi IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | 2 | 2024 |
| Evaluating the Efficiency of Machine Learning Approaches for Predicting Solder Joint Characteristic Life under Isothermal Aging and Thermal Cycling Test Conditions S Alavi, D Silva, PP Vyas 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | | 2024 |
| The Effect of Bi Content and Strain Rate on Tensile Properties of SnAgCu-Bi Alloys S Bolanos, A Alahmer, A Alakayleh, S Pouya, PP Vyas, MEA Belhadi 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | | 2024 |
| Drop Shock Test of PCB at Elevated Temperature PP Vyas, A Alahmer, S Bolanos, S Pouya, S Daradkeh, MEA Belhadi 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | | 2024 |
| Aging Effect on Drop-Shock Reliability of SnAgCu305 Solder Alloy S Daradkeh, PP Vyas, A Alakayleh, MEA Belhadi, S Tahat, A Alahmer 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024 | | 2024 |
| Drop Shock Performance of Solder Alloys in BGA Assemblies under Different Thermal Conditions P Vyas | | 2024 |
| Effects of Matching Lead-free Solder Joints Compared to SnPb on BGA Reliability in Thermal Cycling MEA Belhadi, X Wei, PP Vyas, RK Akula, A Shmatok, BC Prorok | | |
| Effect of Temperature on the Fatigue Performance of Solder Joints in Ball Grid Array Assembly X Wei, MEA Belhadi, PP Vyas, JS Sa’d Hamasha, P Lall | | |