| 2D boron nitride nanosheets for polymer composite materials MG Rasul, A Kiziltas, B Arfaei, R Shahbazian-Yassar npj 2D Materials and Applications 5 (1), 56, 2021 | 205 | 2021 |
| Recrystallization and precipitate coarsening in Pb-free solder joints during thermomechanical fatigue L Yin, L Wentlent, LL Yang, B Arfaei, A Oasaimeh, P Borgesen Journal of electronic materials 41, 241-252, 2012 | 163 | 2012 |
| Dependence of Sn grain morphology of Sn-Ag-Cu solder on solidification temperature B Arfaei, N Kim, EJ Cotts Journal of Electronic Materials 41, 362-374, 2012 | 132 | 2012 |
| Thermal fatigue evaluation of Pb-free solder joints: results, lessons learned, and future trends RJ Coyle, K Sweatman, B Arfaei Jom 67 (10), 2394-2415, 2015 | 114 | 2015 |
| The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints B Arfaei, Y Xing, J Woods, J Wolcott, P Tumne, P Borgesen, E Cotts 2008 58th Electronic Components and Technology Conference, 459-465, 2008 | 69 | 2008 |
| Reliability and failure mechanism of solder joints in thermal cycling tests B Arfaei, S Mahin-Shirazi, S Joshi, M Anselm, P Borgesen, E Cotts, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 976-985, 2013 | 56 | 2013 |
| Correlations between the microstructure and fatigue life of near-eutectic Sn-Ag-Cu Pb-free solders B Arfaei, E Cotts Journal of electronic materials 38, 2617-2627, 2009 | 49 | 2009 |
| Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure B Arfaei, L Wentlent, S Joshi, A Alazzam, T Tashtoush, M Halaweh, ... 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 44 | 2012 |
| Polyethylene-BN nanosheets nanocomposites with enhanced thermal and mechanical properties MG Rasul, A Kiziltas, CD Malliakas, R Rojaee, S Sharifi-Asl, T Foroozan, ... Composites Science and Technology 204, 108631, 2021 | 37 | 2021 |
| Effects of varying amplitudes on the fatigue life of lead free solder joints M Obaidat, S Hamasha, Y Jaradat, A Qasaimeh, B Arfaei, M Anselm, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 1308-1314, 2013 | 37 | 2013 |
| Influence of equal-channel angular pressing on the microstructure and corrosion behaviour of a 6xxx aluminium alloy for automotive conductors C Rochet, M Veron, EF Rauch, TC Lowe, B Arfaei, A Laurino, ... Corrosion Science 166, 108453, 2020 | 33 | 2020 |
| Nucleation rates of Sn in undercooled Sn-Ag-Cu flip-chip solder joints B Arfaei, M Benedict, EJ Cotts Journal of Applied Physics 114 (17), 2013 | 33 | 2013 |
| Pb-free solder joint thermo-mechanical modeling: state of the art and challenges JPM Clech, RJ Coyle, B Arfaei JOM 71, 143-157, 2019 | 32 | 2019 |
| Hurst-exponent-based detection of high-impedance DC arc events for 48-V systems in vehicles Y Abdullah, J Shaffer, B Hu, B Hall, J Wang, A Emrani, B Arfaei IEEE Transactions on Power Electronics 36 (4), 3803-3813, 2020 | 30 | 2020 |
| Improvement of the thermal conductivity and tribological properties of polyethylene by incorporating functionalized boron nitride nanosheets MG Rasul, A Kiziltas, MSB Hoque, A Banik, PE Hopkins, KT Tan, B Arfaei, ... Tribology International 165, 107277, 2022 | 29 | 2022 |
| Effect of microstructure evolution on Pb-free solder joint reliability in thermomechanical fatigue L Yin, M Meilunas, B Arfaei, L Wentlent, P Borgesen 2012 IEEE 62nd Electronic Components and Technology Conference, 493-499, 2012 | 27 | 2012 |
| Dependence of SnAgCu solder joint properties on solder microstructure B Arfaei, T Tashtoush, N Kim, L Wentlent, E Cotts, P Borgesen 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 125-132, 2011 | 27 | 2011 |
| LGAs vs. BGAs–lower profile and better reliability S Joshi, B Arfaei, A Singh, M Gharaibeh, M Obaidat, A Alazzam, ... Proc. SMTAI, 47-57, 2012 | 26 | 2012 |
| The effect of nickel microalloying on thermal fatigue reliability and microstructure of SAC105 and SAC205 solders R Coyle, R Parker, B Arfaei, F Mutuku, K Sweatman, K Howell, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 425-440, 2014 | 24 | 2014 |
| Recrystallization behavior of lead free and lead containing solder in cycling A Qasaimeh, Y Jaradat, L Wentlent, L Yang, L Yin, B Arfaei, P Borgesen 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1775-1781, 2011 | 24 | 2011 |