Prati
Joo-Youl Huh
Joo-Youl Huh
Ostala imenaJ.Y. Huh
고려대학교 신소재공학부
Potvrđena adresa e-pošte na korea.ac.kr
Naslov
Citirano
Citirano
Godina
Carbon-induced undersaturation of silicon self-interstitials
R Scholz, U Gösele, JY Huh, TY Tan
Applied Physics Letters 72 (2), 200-202, 1998
2271998
Physical, mathematical, and numerical derivations of the Cahn–Hilliard equation
D Lee, JY Huh, D Jeong, J Shin, A Yun, J Kim
Computational Materials Science 81, 216-225, 2014
2022014
Mechanism for the formation of Ag crystallites in the Ag thick-film contacts of crystalline Si solar cells
KK Hong, SB Cho, JS You, JW Jeong, SM Bea, JY Huh
Solar Energy Materials and Solar Cells 93 (6-7), 898-904, 2009
1912009
Experiments on anisotropic etching of Si in TMAH
JS You, D Kim, JY Huh, HJ Park, JJ Pak, CS Kang
Solar energy materials and solar cells 66 (1-4), 37-44, 2001
1192001
Role of PbO-based glass frit in Ag thick-film contact formation for crystalline Si solar cells
KK Hong, SB Cho, JY Huh, HJ Park, JW Jeong
Metals and Materials International 15, 307-312, 2009
852009
Phase field simulations of intermetallic compound growth during soldering reactions
JY Huh, KK Hong, YB Kim, KT Kim
Journal of electronic materials 33, 1161-1170, 2004
712004
Facile surface modification of LSCF/GDC cathodes by epitaxial deposition of Sm 0.5 Sr 0.5 CoO 3 via ultrasonic spray infiltration
YH Song, SU Rehman, HS Kim, HS Song, RH Song, TH Lim, JE Hong, ...
Journal of Materials Chemistry A 8 (7), 3967-3977, 2020
572020
Role of the ambient oxygen on the silver thick-film contact formation for crystalline silicon solar cells
SB Cho, KK Hong, JY Huh, HJ Park, JW Jeong
Current Applied Physics 10 (2), S222-S225, 2010
572010
Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints
CK Shin, YJ Baik, JY Huh
Journal of Electronic Materials 30, 1323-1331, 2001
482001
Effects of pulsing frequency on characteristics of electrohydrodynamic inkjet using micro-Al and nano-Ag particles
MW Lee, S An, NY Kim, JH Seo, JY Huh, HY Kim, SS Yoon
Experimental thermal and fluid science 46, 103-110, 2013
432013
Time-resolved analysis of the set process in an electrical phase-change memory device
DH Kang, B Cheong, J Jeong, TS Lee, IH Kim, WM Kim, JY Huh
Applied Physics Letters 87 (25), 2005
402005
Effect of oxygen partial pressure on Ag crystallite formation at screen-printed Pb-free Ag contacts of Si solar cells
JY Huh, KK Hong, SB Cho, SK Park, BC Lee, K Okamoto
Materials Chemistry and Physics 131 (1-2), 113-119, 2011
362011
Tailoring the equilibrium hydrogen pressure of TiFe via vanadium substitution
JY Jung, YS Lee, JY Suh, JY Huh, YW Cho
Journal of Alloys and Compounds 854, 157263, 2021
352021
Thin elemental coatings of yttrium, cobalt, and yttrium/cobalt on ferritic stainless steel for SOFC interconnect applications
SH Kim, JY Huh, JH Jun, JH Jun, J Favergeon
Current Applied Physics 10 (2), S86-S90, 2010
352010
Effect of cross-interaction between Ni and Cu on growth kinetics of intermetallic compounds in Ni/Sn/Cu diffusion couples during aging
KK Hong, JB Ryu, CY Park, JY Huh
Journal of electronic materials 37, 61-72, 2008
352008
Phase field simulations of morphological evolution and growth kinetics of solder reaction products
KK Hong, JY Huh
Journal of electronic materials 35, 56-64, 2006
352006
Microstructural evolution and creep-rupture life estimation of high-Cr martensitic heat-resistant steels
KH Lee, JY Suh, SM Hong, JY Huh, WS Jung
Materials Characterization 106, 266-272, 2015
332015
Effect of Cr addition on room temperature hydrogenation of TiFe alloys
JY Jung, SI Lee, M Faisal, H Kim, YS Lee, JY Suh, JH Shim, JY Huh, ...
International Journal of Hydrogen Energy 46 (37), 19478-19485, 2021
312021
Mechanism underlying the beneficial effect of forming gas annealing on screen-printed Ag contacts of crystalline Si solar cells
SB Cho, HS Kim, JY Huh
Acta Materialia 70, 1-7, 2014
302014
Influence of oxygen on Ag ionization in molten lead borosilicate glass during screen-printed Ag contact formation for Si solar cells
BM Chung, SB Cho, JW Chun, YS Kim, K Okamoto, JY Huh
Electrochimica Acta 106, 333-341, 2013
302013
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