Carbon-induced undersaturation of silicon self-interstitials R Scholz, U Gösele, JY Huh, TY Tan Applied Physics Letters 72 (2), 200-202, 1998 | 227 | 1998 |
Physical, mathematical, and numerical derivations of the Cahn–Hilliard equation D Lee, JY Huh, D Jeong, J Shin, A Yun, J Kim Computational Materials Science 81, 216-225, 2014 | 202 | 2014 |
Mechanism for the formation of Ag crystallites in the Ag thick-film contacts of crystalline Si solar cells KK Hong, SB Cho, JS You, JW Jeong, SM Bea, JY Huh Solar Energy Materials and Solar Cells 93 (6-7), 898-904, 2009 | 191 | 2009 |
Experiments on anisotropic etching of Si in TMAH JS You, D Kim, JY Huh, HJ Park, JJ Pak, CS Kang Solar energy materials and solar cells 66 (1-4), 37-44, 2001 | 119 | 2001 |
Role of PbO-based glass frit in Ag thick-film contact formation for crystalline Si solar cells KK Hong, SB Cho, JY Huh, HJ Park, JW Jeong Metals and Materials International 15, 307-312, 2009 | 85 | 2009 |
Phase field simulations of intermetallic compound growth during soldering reactions JY Huh, KK Hong, YB Kim, KT Kim Journal of electronic materials 33, 1161-1170, 2004 | 71 | 2004 |
Facile surface modification of LSCF/GDC cathodes by epitaxial deposition of Sm 0.5 Sr 0.5 CoO 3 via ultrasonic spray infiltration YH Song, SU Rehman, HS Kim, HS Song, RH Song, TH Lim, JE Hong, ... Journal of Materials Chemistry A 8 (7), 3967-3977, 2020 | 57 | 2020 |
Role of the ambient oxygen on the silver thick-film contact formation for crystalline silicon solar cells SB Cho, KK Hong, JY Huh, HJ Park, JW Jeong Current Applied Physics 10 (2), S222-S225, 2010 | 57 | 2010 |
Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints CK Shin, YJ Baik, JY Huh Journal of Electronic Materials 30, 1323-1331, 2001 | 48 | 2001 |
Effects of pulsing frequency on characteristics of electrohydrodynamic inkjet using micro-Al and nano-Ag particles MW Lee, S An, NY Kim, JH Seo, JY Huh, HY Kim, SS Yoon Experimental thermal and fluid science 46, 103-110, 2013 | 43 | 2013 |
Time-resolved analysis of the set process in an electrical phase-change memory device DH Kang, B Cheong, J Jeong, TS Lee, IH Kim, WM Kim, JY Huh Applied Physics Letters 87 (25), 2005 | 40 | 2005 |
Effect of oxygen partial pressure on Ag crystallite formation at screen-printed Pb-free Ag contacts of Si solar cells JY Huh, KK Hong, SB Cho, SK Park, BC Lee, K Okamoto Materials Chemistry and Physics 131 (1-2), 113-119, 2011 | 36 | 2011 |
Tailoring the equilibrium hydrogen pressure of TiFe via vanadium substitution JY Jung, YS Lee, JY Suh, JY Huh, YW Cho Journal of Alloys and Compounds 854, 157263, 2021 | 35 | 2021 |
Thin elemental coatings of yttrium, cobalt, and yttrium/cobalt on ferritic stainless steel for SOFC interconnect applications SH Kim, JY Huh, JH Jun, JH Jun, J Favergeon Current Applied Physics 10 (2), S86-S90, 2010 | 35 | 2010 |
Effect of cross-interaction between Ni and Cu on growth kinetics of intermetallic compounds in Ni/Sn/Cu diffusion couples during aging KK Hong, JB Ryu, CY Park, JY Huh Journal of electronic materials 37, 61-72, 2008 | 35 | 2008 |
Phase field simulations of morphological evolution and growth kinetics of solder reaction products KK Hong, JY Huh Journal of electronic materials 35, 56-64, 2006 | 35 | 2006 |
Microstructural evolution and creep-rupture life estimation of high-Cr martensitic heat-resistant steels KH Lee, JY Suh, SM Hong, JY Huh, WS Jung Materials Characterization 106, 266-272, 2015 | 33 | 2015 |
Effect of Cr addition on room temperature hydrogenation of TiFe alloys JY Jung, SI Lee, M Faisal, H Kim, YS Lee, JY Suh, JH Shim, JY Huh, ... International Journal of Hydrogen Energy 46 (37), 19478-19485, 2021 | 31 | 2021 |
Mechanism underlying the beneficial effect of forming gas annealing on screen-printed Ag contacts of crystalline Si solar cells SB Cho, HS Kim, JY Huh Acta Materialia 70, 1-7, 2014 | 30 | 2014 |
Influence of oxygen on Ag ionization in molten lead borosilicate glass during screen-printed Ag contact formation for Si solar cells BM Chung, SB Cho, JW Chun, YS Kim, K Okamoto, JY Huh Electrochimica Acta 106, 333-341, 2013 | 30 | 2013 |