Bahgat G Sammakia

Citirano

	Sve	Od 2020.
Citati	10191	3282
H-indeks	44	25
i10-indeks	209	86

820

410

205

615

19901991199219931994199519961997199819992000200120022003200420052006200720082009201020112012201320142015201620172018201920202021202220232024202539 48 57 51 58 63 65 69 93 95 118 122 126 123 143 178 168 179 216 245 289 328 358 420 452 603 462 504 537 560 463 563 669 624 813 150

Javni pristup

Prikaži sve

57 članaka

14 članaka

dostupno

nije dostupno

Na temelju uvjeta financiranja

Suautori

Bruce T MurrayProfessor Emeritus, Mechanical Engineering, SUNY BinghamtonPotvrđena adresa e-pošte na binghamton.edu
Kourosh NematiResearch Manager at Future FacilitiesPotvrđena adresa e-pošte na binghamton.edu
Srikanth RangarajanAssistant Professor @SUNY BinghamtonPotvrđena adresa e-pošte na binghamton.edu
Husam AlissaDirector - Systems TechnologyPotvrđena adresa e-pošte na microsoft.com
Kanad GhoseDept. of Computer SciencePotvrđena adresa e-pošte na cs.binghamton.edu
Mohammad I TradatState University of New York at BinghamtonPotvrđena adresa e-pošte na binghamton.edu
Ganesh SubbarayanProfessor of Mechanical Engineering, Purdue UniversityPotvrđena adresa e-pošte na purdue.edu
Saurabh ShrivastavaYP-II (Computer Applications), Indian Agricultural Statistics Research Institute, PusaPotvrđena adresa e-pošte na gnxtsystems.com
Madhusudan K IyengarGooglePotvrđena adresa e-pošte na google.com
Siddharth BhopteR&D Engineer, Microsoft CorporationPotvrđena adresa e-pošte na microsoft.com
Sami AlkharabshehBinghamton UniversityPotvrđena adresa e-pošte na binghamton.edu
Yogendra JoshiProfessor of Mechanical Engineering, Georgia Institute of TechnologyPotvrđena adresa e-pošte na me.gatech.edu
Bharath RamakrishnanMicrosoft, Datacenter Advanced Development (DAD)Potvrđena adresa e-pošte na binghamton.edu
Susan LuBinghamton UniversityPotvrđena adresa e-pošte na binghamton.edu
Paul R ChiarotState University of New York at BinghamtonPotvrđena adresa e-pošte na binghamton.edu
Mark D PoliksSUNY Distinguished Professor, State University of New York at BinghamtonPotvrđena adresa e-pošte na binghamton.edu
Koneru RamakrishnaSenior Design and Simulation Engineer, Cirrus Logic, Inc.Potvrđena adresa e-pošte na ieee.org
Khalid Mohammad AlzoubiJordan University of Science and TechnologyPotvrđena adresa e-pošte na just.edu.jo
Sasanka KanuparthiProduct Development Engineer, Intel CorporationPotvrđena adresa e-pošte na intel.com
Siyi ZhouState University of New York at BinghamtonPotvrđena adresa e-pošte na binghamton.edu

Prati

Bahgat G Sammakia

Binghamton University

Potvrđena adresa e-pošte na binghamton.edu - Početna stranica

Electronics packaging thermal sciences electronics cooling heat transfer data centers


Naslov Poredaj po navodima Poredaj po godini Poredaj po naslovu	Citirano Citirano	Godina
Buoyancy-induced flows and transport B Gebhart CRC Press, 1988	1945	1988
Thermal challenges in next-generation electronic systems SV Garimella, AS Fleischer, JY Murthy, A Keshavarzi, R Prasher, C Patel, ... IEEE Transactions on Components and Packaging Technologies 31 (4), 801-815, 2008	545	2008
Bending fatigue study of sputtered ITO on flexible substrate K Alzoubi, MM Hamasha, S Lu, B Sammakia Journal of Display Technology 7 (11), 593-600, 2011	254	2011
Pluggable electronic circuit package assembly with snap together heat sink housing J Funari, TC Godown, SD Reynolds, BG Sammakia US Patent 5,109,318, 1992	162	1992
Electronic package with heat spreader member M Anschel, BG Sammakia US Patent 4,914,551, 1990	148	1990
A review of recent developments in some practical aspects of air-cooled electronic packages S Sathe, B Sammakia	145	1998
A brief overview of recent developments in thermal management in data centers S Alkharabsheh, J Fernandes, B Gebrehiwot, D Agonafer, K Ghose, ... Journal of Electronic Packaging 137 (4), 040801, 2015	131	2015
Comparative analysis of different data center airflow management configurations S Shrivastava, B Sammakia, R Schmidt, M Iyengar International Electronic Packaging Technical Conference and Exhibition 42002 …, 2005	128	2005
Experimental-numerical comparison for a high-density data center: Hot spot heat fluxes in excess of 500 W/ft2 SK Shrivastava, BG Sammakia, R Schmidt, M Iyengar, JW VanGilder Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006	110	2006
Control systems and prediction methods for it cooling performance in containment H Alissa, K Nemati, B Sammakia, K Ghose US Patent 11,076,509, 2021	103	2021
Optimization of data center room layout to minimize rack inlet air temperature S Bhopte, D Agonafer, R Schmidt, B Sammakia	102	2006
Thermal challenges in next generation electronic systems-summary of panel presentations and discussions SV Garimella, YK Joshi, A Bar-Cohen, R Mahajan, KC Toh, VP Carey, ... IEEE Transactions on Components and Packaging Technologies 25 (4), 569-575, 2002	101	2002
Method and apparatus for testing of integrated circuit chips M Anschel, AP Ingraham, CR Lamb, MD Lowell, VR Markovich, W Mayr, ... US Patent 5,420,520, 1995	101	1995
A review of recent advances in thermal management in three dimensional chip stacks in electronic systems V Venkatadri, B Sammakia, K Srihari, D Santos	97	2011
Electronic package having active means to maintain its operating temperature constant LSW Mok, S Purushothaman, BG Sammakia, JS Wilczynski, TY Wu US Patent 5,491,610, 1996	94	1996
Electronic package with improved heat sink J Funari, MC Green, SD Reynolds, BG Sammakia US Patent 4,849,856, 1989	91	1989
Control systems and prediction methods for it cooling performance in containment H Alissa, K Nemati, B Sammakia, K Ghose US Patent 11,985,802, 2024	89	2024
Estimating thermal conductivity of amorphous silica nanoparticles and nanowires using molecular dynamics simulations SS Mahajan, G Subbarayan, BG Sammakia Physical Review E—Statistical, Nonlinear, and Soft Matter Physics 76 (5 …, 2007	87	2007
Flexible chemiresistor sensors: Thin film assemblies of nanoparticles on a polyethylene terephthalate substrate L Wang, J Luo, J Yin, H Zhang, J Wu, X Shi, E Crew, Z Xu, Q Rendeng, ... Journal of Materials Chemistry 20 (5), 907-915, 2010	80	2010
Three-objective shape optimization and parametric study of a micro-channel heat sink with discrete non-uniform heat flux boundary conditions Y Hadad, B Ramakrishnan, R Pejman, S Rangarajan, PR Chiarot, ... Applied Thermal Engineering 150, 720-737, 2019	72	2019

Sustav trenutno ne može provesti ovu radnju. Pokušajte ponovo kasnije.

Članci 1–20

Godišnji broj citata

Dvostruki navodi

Spojeni navodi

Dodavanje suautoraSuautori

Prati

Citirano

Suautori