| Analytical modeling and characterization of electromigration effects for multibranch interconnect trees HB Chen, SXD Tan, X Huang, T Kim, V Sukharev IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2016 | 68 | 2016 |
| Recent advances in EM and BTI induced reliability modeling, analysis and optimization SXD Tan, H Amrouch, T Kim, Z Sun, C Cook, J Henkel Integration, the VLSI Journal, 2017 | 56 | 2017 |
| Battery management and application for energy-efficient buildings T Wei, T Kim, S Park, Q Zhu, SXD Tan, N Chang, S Ula, M Maasoumy Proceedings of the 51st Annual Design Automation Conference, 1-6, 2014 | 46 | 2014 |
| Electromigration recovery modeling and analysis under time-dependent current and temperature stressing X Huang, V Sukharev, T Kim, H Chen, SXD Tan 2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC), 244-249, 2016 | 42 | 2016 |
| Analytical modeling of electromigration failure for VLSI interconnect tree considering temperature and segment length effects HB Chen, SXD Tan, J Peng, T Kim, J Chen IEEE Transactions on Device and Materials Reliability 17 (4), 653-666, 2017 | 41 | 2017 |
| Voltage-based electromigration immortality check for general multi-branch interconnects Z Sun, E Demircan, MD Shroff, T Kim, X Huang, SXD Tan 2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-7, 2016 | 39 | 2016 |
| Learning-based dynamic reliability management for dark silicon processor considering EM effects T Kim, X Huang, HB Chen, V Sukharev, SXD Tan 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE), 463-468, 2016 | 30 | 2016 |
| Detecting and preventing forward head posture with wireless inertial body sensor networks T Kim, S Chen, J Lach 2011 International Conference on Body Sensor Networks, 125-126, 2011 | 30 | 2011 |
| Energy and lifetime optimizations for dark silicon manycore microprocessor considering both hard and soft errors T Kim, Z Sun, HB Chen, H Wang, SXD Tan IEEE Transactions on Very Large Scale Integration (VLSI) Systems 25 (9 …, 2017 | 28 | 2017 |
| Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing X Huang, V Sukharev, T Kim, SXD Tan Integration 58, 518-527, 2017 | 27 | 2017 |
| Long-Term Reliability of Nanometer VLSI Systems S Tan, M Tahoori, T Kim, S Wang, Z Sun, S Kiamehr | 26 | 2019 |
| Longitudinal high-fidelity gait analysis with wireless inertial body sensors AT Barth, B Boudaoud, JS Brantley, S Chen, CL Cunningham, T Kim, ... Wireless Health 2010, 192-193, 2010 | 25 | 2010 |
| Finite difference method for electromigration analysis of multi-branch interconnects C Cook, Z Sun, T Kim, SXD Tan 2016 13th International Conference on Synthesis, Modeling, Analysis and …, 2016 | 24 | 2016 |
| Interconnect reliability modeling and analysis for multi-branch interconnect trees HB Chen, SXD Tan, V Sukharev, X Huang, T Kim Proceedings of the 52nd Annual Design Automation Conference, 1-6, 2015 | 23 | 2015 |
| Electromigration assessment for power grid networks considering temperature and thermal stress effects X Huang, V Sukharev, JH Choy, M Chew, T Kim, SXD Tan Integration 55, 307-315, 2016 | 21 | 2016 |
| Characterising and minimising sources of error in inertial body sensor networks S Chen, JS Brantley, T Kim, SA Ridenour, J Lach International Journal of Autonomous and Adaptive Communications Systems 6 (3 …, 2013 | 20 | 2013 |
| Characterizing and minimizing synchronization and calibration errors in inertial body sensor networks S Chen, JS Brantley, T Kim, J Lach Proceedings of the Fifth International Conference on Body Area Networks, 138-144, 2010 | 20 | 2010 |
| Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs S Wang, T Kim, Z Sun, SXD Tan, MB Tahoori IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2017 | 11 | 2017 |
| Dynamic reliability management for near-threshold dark silicon processors T Kim, Z Sun, C Cook, J Gaddipati, H Wang, H Chen, SXD Tan 2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-7, 2016 | 11 | 2016 |
| Physics-based full-chip TDDB assessment for BEOL interconnects X Huang, V Sukharev, Z Qi, T Kim, SXD Tan Proceedings of the 53rd Annual Design Automation Conference, 1-6, 2016 | 11 | 2016 |
Sheldon X.-D. TanUniversity of California at RiversidePotvrđena adresa e-pošte na ece.ucr.edu