| Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach KC Otiaba, RS Bhatti, NN Ekere, S Mallik, M Ekpu Engineering Failure Analysis 28, 192-207, 2013 | 79 | 2013 |
| Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device KC Otiaba, RS Bhatti, NN Ekere, S Mallik, MO Alam, EH Amalu, M Ekpu Microelectronics Reliability 52 (7), 1409-1419, 2012 | 68 | 2012 |
| Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics M Ekpu, R Bhatti, MI Okereke, S Mallik, K Otiaba Microelectronics Reliability 54 (1), 239-244, 2014 | 54 | 2014 |
| Investigation of effects of heat sinks on thermal performance of microelectronic package M Ekpu, R Bhatti, N Ekere, S Mallik, E Amalu, K Otiaba 3rd IEEE International Conference on Adaptive Science and Technology (ICAST …, 2011 | 30 | 2011 |
| Advanced thermal management materials for heat sinks used in microelectronics M Ekpu, R Bhatti, N Ekere, S Mallik 18th European Microelectronics & Packaging Conference, 1-8, 2011 | 25 | 2011 |
| Thermal effects of die-attach voids location and style on performance of chip level package KC Otiaba, RS Bhatti, NN Ekere, S Mallik, EH Amalu, M Ekpu 3rd IEEE International Conference on Adaptive Science and Technology (ICAST …, 2011 | 19 | 2011 |
| Effects of thermal interface materials (solders) on thermal performance of a microelectronic package M Ekpu, R Bhatti, N Ekere, S Mallik, K Otiaba 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 154-159, 2012 | 17 | 2012 |
| Finite Element Analysis of the Effect of Fin Geometry on Thermal Performance of Heat Sinks in Microelectronics M Ekpu Journal of Applied Science and Environmental Management 23 (11), 2059-2063, 2019 | 15 | 2019 |
| Thermal effect of cylindrical heat sink on heat management in LED applications M Ekpu, EA Ogbodo, F Ngobigha, JE Njoku Energies 15 (20), 7583, 2022 | 8 | 2022 |
| Investigating the Reliability of SnAgCu Solder Alloys at Elevated Temperatures in Microelectronic Applications M Ekpu Journal of Electronic Materials 50, 4433-4441, 2021 | 6 | 2021 |
| The effect of thermal constriction on heat management in a microelectronic application M Ekpu, R Bhatti, MI Okereke, S Mallik, K Otiaba Microelectronics Journal 45 (2), 159-166, 2014 | 6 | 2014 |
| Power Production using Natural Gas in Nigeria: Trends, Challenges and Way Forward M Ekpu, OB Obadina Nigerian Research Journal of Engineering and Environmental Sciences 5 (2 …, 2020 | 5 | 2020 |
| Prediction and optimization of design parameters of microelectronic heat sinks M Ekpu, R Bhatti, MI Okereke, S Mallik, KC Otiaba Journal of Emerging Trends in Engineering and Applied Sciences 4 (3), 493-500, 2013 | 5 | 2013 |
| Characterising the Mechanical Properties of a Composite Material Comprising Aluminium and Silicon Carbide M Ekpu, SC Ikpeseni Silicon 16 (10), 4333-4342, 2024 | 4 | 2024 |
| Effect of Tensile Load on the Mechanical Properties of AlSiC Composite Materials using ANSYS Design Modeller M Ekpu Nigerian Journal of Technological Development (NJTD) 17 (4), 301-305, 2020 | 4 | 2020 |
| Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device KC Otiaba, RS Bhatti, NN Ekere, M Ekpu, J Adeyemi 2011 17th International Workshop on Thermal Investigations of ICs and …, 2011 | 4 | 2011 |
| Evaluation of the optimal cutting performance of high-speed steel and tungsten carbide cutting tools in the machining of AISI 304 steel AE Aboloje, SO Sada, M Ekpu, J Eyenubo The International Journal of Advanced Manufacturing Technology 130 (7), 3609 …, 2024 | 3 | 2024 |
| Pyrolysis characteristics and kinetics of the thermal degradation of elephant grass (Pennisetum purpureum): a comparative analysis using the Flynn–Wall–Ozawa … SC Ikpeseni, HO Orugba, UJ Efetobor, SO Sada, M Ekpu, ME Amagre, ... Environment, Development and Sustainability, 1-19, 2023 | 3 | 2023 |
| Fatigue life analysis of Sn96. 5Ag3. 0Cu0. 5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications M Ekpu, R Bhatti, MI Okereke, KC Otiaba International Symposium on Microelectronics 2013 (1), 000473-000477, 2013 | 3 | 2013 |
| Optimization of bio-oil production parameters from the pyrolysis of elephant grass (Pennisetum purpureum) using response surface methodology SC Ikpeseni, SO Sada, UJ Efetobor, HO Orugba, M Ekpu, HI Owamah, ... Clean Energy 8 (5), 241-251, 2024 | 2 | 2024 |
Sabuj MallikProfessor & Head of School of Engineering & the Built Environment, Buckinghamshire New University UKPotvrđena adresa e-pošte na bucks.ac.uk