| Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering D Lorenzini, C Green, TE Sarvey, X Zhang, Y Hu, AG Fedorov, MS Bakir, ... International Journal of Heat and Mass Transfer 103, 1359-1370, 2016 | 118 | 2016 |
| A review of two-phase forced cooling in three-dimensional stacked electronics: technology integration C Green, P Kottke, X Han, C Woodrum, T Sarvey, P Asrar, X Zhang, ... Journal of Electronic Packaging 137 (4), 040802, 2015 | 79 | 2015 |
| Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins P Asrar, X Zhang, CE Green, M Bakir, YK Joshi International Journal of Heat and Mass Transfer 121, 329-342, 2018 | 48 | 2018 |
| Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ... International Journal of Heat and Mass Transfer 108, 1702-1713, 2017 | 42 | 2017 |
| Hotspot thermal management with flow boiling of refrigerant in ultrasmall microgaps MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ... Journal of Electronic Packaging 139 (1), 011006, 2017 | 29 | 2017 |
| Benchmarking digital die-to-die channels in 2.5-D and 3-D heterogeneous integration platforms Y Zhang, X Zhang, MS Bakir IEEE Transactions on Electron Devices 65 (12), 5460-5467, 2018 | 25 | 2018 |
| Heterogeneous Interconnect Stitching Technology With Compressible MicroInterconnects for Dense Multi-Die Integration X Zhang, PK Jo, M Zia, GS May, MS Bakir IEEE Electron Device Letters 38 (2), 255-257, 2017 | 23 | 2017 |
| Three-dimensional integrated circuit with embedded microfluidic cooling: Technology, thermal performance, and electrical implications X Zhang, X Han, TE Sarvey, CE Green, PA Kottke, AG Fedorov, Y Joshi, ... Journal of Electronic Packaging 138 (1), 010910, 2016 | 21 | 2016 |
| High-frequency analysis of embedded microfluidic cooling within 3-D ICs using a TSV testbed H Oh, X Zhang, GS May, MS Bakir 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 68-73, 2016 | 17 | 2016 |
| Flow boiling of R245fa in a microgap with integrated staggered pin fins P Asrar, X Zhang, CD Woodrum, CE Green, PA Kottke, TE Sarvey, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 15 | 2016 |
| Silicon interposer with embedded microfluidic cooling for high-performance computing systems L Zheng, Y Zhang, X Zhang, MS Bakir IEEE Electronic Components and Technology Conference, 828-832, 2015 | 14 | 2015 |
| Heterogeneous multi-die stitching enabled by fine-pitch and multi-height compressible microinterconnects (CMIs) PK Jo, X Zhang, JL Gonzalez, GS May, MS Bakir IEEE Transactions on Electron Devices 65 (7), 2957-2963, 2018 | 13 | 2018 |
| Flow visualization of two phase flow of R245fa in a microgap with integrated staggered pin fins P Asrar, X Zhang, CE Green, PA Kottke, TE Sarvey, A Fedorov, MS Bakir, ... 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2016 | 13 | 2016 |
| Impact of on-chip interconnect on the performance of 3-D integrated circuits with through-silicon vias: Part II X Zhang, V Kumar, H Oh, L Zheng, GS May, A Naeemi, MS Bakir IEEE Transactions on Electron Devices 63 (6), 2510-2516, 2016 | 10 | 2016 |
| 3D IC with embedded microfluidic cooling: technology, thermal performance, and electrical implications X Zhang, X Han, TE Sarvey, CE Green, PA Kottke, AG Fedorov, Y Joshi, ... International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015 | 10 | 2015 |
| Impact of on-chip interconnect on the performance of 3-D integrated circuits with through silicon vias: Part i V Kumar, H Oh, X Zhang, L Zheng, MS Bakir, A Naeemi IEEE Transactions on Electron Devices 63 (6), 2503-2509, 2016 | 9 | 2016 |
| Memory cell XX Li, C Meng, XC Zhang US Patent 9,135,985, 2015 | 9 | 2015 |
| Extreme-microgap (x-µgap) based hotspot thermal management with refrigerant flow boiling MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 7 | 2016 |
| Heterogeneous multi-die stitching: Technology demonstration and design considerations PK Jo, MO Hossen, X Zhang, Y Zhang, MS Bakir 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1512-1518, 2018 | 5 | 2018 |
| Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins X Zhang, MH Nasr, DC Woodrum, CE Green, PA Kottke, TE Sarvey, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 5 | 2016 |
Yogendra JoshiProfessor of Mechanical Engineering, Georgia Institute of TechnologyEmail yang diverifikasi di me.gatech.edu
