Boris Murmann

Dikutip oleh

	Semua	Sejak 2020
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indeks-h	64	43
indeks-i10	169	113

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Zhenan BaoStanford UniversityEmail yang diverifikasi di stanford.edu
Bernhard BoserUC BerkeleyEmail yang diverifikasi di eecs.berkeley.edu
Francisco Molina-LopezAssociate Professor KU LeuvenEmail yang diverifikasi di kuleuven.be
Thomas KennyProfessor of Mechanical Engineering, Stanford UniversityEmail yang diverifikasi di cdr.stanford.edu
Daniel BankmanAnalog Design Engineer, Advanced Micro DevicesEmail yang diverifikasi di amd.com
Shan X. WangStanford UniversityEmail yang diverifikasi di stanford.edu
Matthew A HopcroftGeorge Washington, Cambridge, Stanford, Berkeley, Hewlett-PackardEmail yang diverifikasi di mems.stanford.edu
Lita YangStanford UniversityEmail yang diverifikasi di alumni.stanford.edu
Rob CandlerUniversity of California, Los AngelesEmail yang diverifikasi di g.ucla.edu
Bongsang KimInvensenseEmail yang diverifikasi di invensense.com
Manar El-ChammasEmail yang diverifikasi di el-chammas.com
Richard GasterStanford UniversityEmail yang diverifikasi di alumni.stanford.edu
Drew A. HallProfessor, University of California, San DiegoEmail yang diverifikasi di ucsd.edu
Jong Won ChungSamsung Advanced Institue of TechnologyEmail yang diverifikasi di samsung.com
Marian VerhelstMicas - ESAT - KU Leuven, BelgiumEmail yang diverifikasi di esat.kuleuven.be
Dante Gabriel MuratoreAssistant Professor, Delft University of TechnologyEmail yang diverifikasi di tudelft.nl
Saurabh ChandorkarAssistant ProfessorEmail yang diverifikasi di iisc.ac.in
Ross WalkerAssociate Prof. at University of UtahEmail yang diverifikasi di utah.edu
Raphael PfattnerMaterials Science Institute of Barcelona, Spanish National Research Council (ICMAB-CSIC)Email yang diverifikasi di icmab.es
Kofi MakinwaProfessor, Delft University of TechnologyEmail yang diverifikasi di tudelft.nl

Ikuti

Boris Murmann

University of Hawaii

Email yang diverifikasi di hawaii.edu - Beranda

Integrated Circuit Design


Judul Urutkan menurut kutipan Urutkan menurut tahun Urutkan menurut judul	Dikutip oleh Dikutip oleh	Tahun
Skin electronics from scalable fabrication of an intrinsically stretchable transistor array S Wang, J Xu, W Wang, GJN Wang, R Rastak, F Molina-Lopez, JW Chung, ... Nature 555 (7694), 83-88, 2018	2021	2018
Highly stretchable polymer semiconductor films through the nanoconfinement effect J Xu, S Wang, GJN Wang, C Zhu, S Luo, L Jin, X Gu, S Chen, VR Feig, ... Science 355 (6320), 59-64, 2017	1152	2017
A highly stretchable, transparent, and conductive polymer Y Wang, C Zhu, R Pfattner, H Yan, L Jin, S Chen, F Molina-Lopez, F Lissel, ... Science advances 3 (3), e1602076, 2017	994	2017
A 12-bit 75-MS/s pipelined ADC using open-loop residue amplification B Murmann, BE Boser IEEE Journal of Solid-State Circuits 38 (12), 2040-2050, 2004	773	2004
Convolutional neural networks using logarithmic data representation D Miyashita, EH Lee, B Murmann arXiv preprint arXiv:1603.01025, 2016	583	2016
Matrix-insensitive protein assays push the limits of biosensors in medicine RS Gaster, DA Hall, CH Nielsen, SJ Osterfeld, H Yu, KE Mach, RJ Wilson, ... Nature medicine 15 (11), 1327-1332, 2009	487	2009
A 12-GS/s 81-mW 5-bit time-interleaved flash ADC with background timing skew calibration M El-Chammas, B Murmann IEEE journal of solid-state circuits 46 (4), 838-847, 2011	417	2011
A/D converter trends: Power dissipation, scaling and digitally assisted architectures B Murmann 2008 IEEE Custom Integrated Circuits Conference, 105-112, 2008	387	2008
ADC performance survey 1997-2016 B Murmann	374	2016
An Always-On 3.8 J/86% CIFAR-10 Mixed-Signal Binary CNN Processor With All Memory on Chip in 28-nm CMOS D Bankman, L Yang, B Moons, M Verhelst, B Murmann IEEE Journal of Solid-State Circuits 54 (1), 158-172, 2018	355	2018
ADC performance survey 1997-2020 B Murmann IEEE Int. Solid-State Circuits Conf.(ISSCC) Dig. Tech. Papers VLSI Symp, 2020	342	2020
Multi-scale ordering in highly stretchable polymer semiconducting films J Xu, HC Wu, C Zhu, A Ehrlich, L Shaw, M Nikolka, S Wang, ... Nature materials 18 (6), 594-601, 2019	340	2019
Stretchable temperature-sensing circuits with strain suppression based on carbon nanotube transistors C Zhu, A Chortos, Y Wang, R Pfattner, T Lei, AC Hinckley, I Pochorovski, ... Nature Electronics 1 (3), 183-190, 2018	333	2018
HermesE: A 96-Channel Full Data Rate Direct Neural Interface in 0.13m CMOS H Gao, RM Walker, P Nuyujukian, KAA Makinwa, KV Shenoy, B Murmann, ... IEEE Journal of Solid-State Circuits 47 (4), 1043-1055, 2012	239	2012
An analysis of latch comparator offset due to load capacitor mismatch A Nikoozadeh, B Murmann IEEE Transactions on Circuits and Systems II: Express Briefs 53 (12), 1398-1402, 2006	212	2006
GMR biosensor arrays: A system perspective DA Hall, RS Gaster, T Lin, SJ Osterfeld, S Han, B Murmann, SX Wang Biosensors and Bioelectronics 25 (9), 2051-2057, 2010	210	2010
ADC performance survey 1997-2021 B Murmann Online: http://github. com/bmurmann/ADC-survey, 2021	209	2021
Lognet: Energy-efficient neural networks using logarithmic computation EH Lee, D Miyashita, E Chai, B Murmann, SS Wong 2017 IEEE International Conference on Acoustics, Speech and Signal …, 2017	204	2017
Digitally assisted analog circuits B Murmann Ieee Micro 26 (2), 38-47, 2006	195	2006
A 12-bit 75-MS/s pipelined ADC using incomplete settling E Iroaga, B Murmann IEEE Journal of Solid-State Circuits 42 (4), 748-756, 2007	194	2007

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