| EMI reduction methods in wireless power transfer system for drone electrical charger using tightly coupled three-phase resonant magnetic field C Song, H Kim, Y Kim, D Kim, S Jeong, Y Cho, S Lee, S Ahn, J Kim IEEE Transactions on Industrial Electronics 65 (9), 6839-6849, 2018 | 141 | 2018 |
| Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs H Park, J Park, S Kim, K Cho, D Lho, S Jeong, S Park, G Park, B Sim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 78 | 2020 |
| Through silicon via (TSV) defect modeling, measurement, and analysis DH Jung, Y Kim, JJ Kim, H Kim, S Choi, YH Song, HC Bae, KS Choi, ... IEEE Transactions on components, packaging and manufacturing technology 7 (1 …, 2016 | 66 | 2016 |
| Signal integrity design and analysis of silicon interposer for GPU-memory channels in high-bandwidth memory interface K Cho, Y Kim, H Lee, H Kim, S Choi, J Song, S Kim, J Park, S Lee, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018 | 62 | 2018 |
| Signal and power integrity analysis in 2.5 D integrated circuits (ICs) with glass, silicon and organic interposer Y Kim, J Cho, K Kim, V Sundaram, R Tummala, J Kim 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 738-743, 2015 | 37 | 2015 |
| A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System B Sim, S Jeong, Y Kim, S Park, S Lee, S Hong, J Song, H Kim, H Kang, ... IEEE Transactions on Electromagnetic Compatibility 63 (3), 935-946, 2020 | 34 | 2020 |
| Signal integrity design and analysis of differential high-speed serial links in silicon interposer with through-silicon via K Cho, Y Kim, H Lee, J Song, J Park, S Lee, S Kim, G Park, K Son, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018 | 32 | 2018 |
| Design and analysis of power distribution network (PDN) for high bandwidth memory (HBM) interposer in 2.5 D terabyte/s bandwidth graphics module K Cho, Y Kim, H Lee, H Kim, S Choi, S Kim, J Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 407-412, 2016 | 32 | 2016 |
| Design optimization of high bandwidth memory (HBM) interposer considering signal integrity K Cho, H Lee, H Kim, S Choi, Y Kim, J Lim, J Kim, H Kim, Y Kim, Y Kim 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015 | 32 | 2015 |
| A frequency-selective EMI reduction method for tightly coupled wireless power transfer systems using resonant frequency control of a shielding coil in smartphone application S Hong, Y Kim, S Lee, S Jeong, B Sim, H Kim, J Song, S Ahn, J Kim IEEE Transactions on Electromagnetic Compatibility 61 (6), 2031-2039, 2019 | 31 | 2019 |
| Fast and accurate power distribution network modeling of a silicon interposer for 2.5-D/3-D ICs with multiarray TSVs K Cho, Y Kim, S Kim, H Park, J Park, S Lee, D Shim, K Lee, S Oh, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019 | 30 | 2019 |
| Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer D Lho, H Park, S Park, S Kim, H Kang, B Sim, S Kim, J Park, K Cho, ... IEEE Transactions on Electromagnetic Compatibility 64 (1), 196-208, 2021 | 27 | 2021 |
| Miniaturized bandpass filters as ultrathin 3-D IPDs and embedded thinfilms in 3-D glass modules S Sitaraman, V Sukumaran, MR Pulugurtha, Z Wu, Y Suzuki, Y Kim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017 | 27 | 2017 |
| Power distribution network design and optimization based on frequency dependent target impedance Y Kim, K Kim, J Cho, J Kim, K Kang, T Yang, Y Ra, W Paik 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015 | 27 | 2015 |
| Measurement and analysis of glass interposer power distribution network resonance effects on a high-speed through glass via channel Y Kim, J Cho, JJ Kim, K Kim, K Cho, S Kim, S Sitaraman, V Sundaram, ... IEEE Transactions on Electromagnetic Compatibility 58 (6), 1747-1759, 2016 | 25 | 2016 |
| Precise RLGC modeling and analysis of through glass via (TGV) for 2.5 D/3D IC J Kim, I Hwang, Y Kim, J Cho, V Sundaram, R Tummala, J Kim 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 254-259, 2015 | 24 | 2015 |
| Highly-effective integrated EMI shields with graphene and nanomagnetic multilayered composites AO Watanabe, S Jeong, S Kim, Y Kim, J Min, D Wong, MR Pulugurtha, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 206-210, 2016 | 23 | 2016 |
| Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 21 | 2021 |
| Wideband power/ground noise suppression in low-loss glass interposers using a double-sided electromagnetic bandgap structure Y Kim, G Park, K Cho, PM Raj, RR Tummala, J Kim IEEE Transactions on Microwave Theory and Techniques 68 (12), 5055-5064, 2020 | 20 | 2020 |
| Design and measurement of a novel on-interposer active power distribution network for efficient simultaneous switching noise suppression in 2.5-D/3-D IC S Kim, Y Kim, K Cho, J Song, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (2 …, 2018 | 20 | 2018 |
Joungho KimProfessor of Electrical Engineering KAISTEmail yang diverifikasi di kaist.ac.kr
