| Failure mechanisms and optimum design for electroplated copper through-silicon vias (TSV) X Liu, Q Chen, P Dixit, R Chatterjee, RR Tummala, SK Sitaraman 2009 59th Electronic components and technology conference, 624-629, 2009 | 220 | 2009 |
| Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating P Dixit, J Miao Journal of the Electrochemical society 153 (6), G552, 2006 | 191 | 2006 |
| Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins L Xu, P Dixit, J Miao, JHL Pang, X Zhang, KN Tu, R Preisser Applied physics letters 90 (3), 2007 | 113 | 2007 |
| Fabrication of multiple through-holes in non-conductive materials by electrochemical discharge machining for RF MEMS packaging J Arab, DK Mishra, HK Kannojia, P Adhale, P Dixit Journal of Materials Processing Technology 271, 542-553, 2019 | 79 | 2019 |
| Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM J Arab, HK Kannojia, P Dixit Precision Engineering 60, 437-447, 2019 | 74 | 2019 |
| Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper L Xu, D Xu, KN Tu, Y Cai, N Wang, P Dixit, JHL Pang, J Miao Journal of Applied Physics 104 (11), 2008 | 73 | 2008 |
| Effect of SF6 flow rate on the etched surface profile and bottom grass formation in deep reactive ion etching process P Dixit, J Miao Journal of Physics: Conference Series 34 (1), 577, 2006 | 67 | 2006 |
| Experimental investigations of energy channelization behavior in ultrasonic assisted electrochemical discharge machining T Singh, A Dvivedi, A Shanu, P Dixit Journal of Materials Processing Technology 293, 117084, 2021 | 63 | 2021 |
| Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects P Dixit, L Xu, J Miao, JHL Pang, R Preisser Journal of Micromechanics and Microengineering 17 (9), 1749, 2007 | 63 | 2007 |
| Fabrication of high aspect ratio 35 μm pitch through-wafer copper interconnects by electroplating for 3-D wafer stacking P Dixit, J Miao, R Preisser Electrochemical and solid-state letters 9 (10), G305, 2006 | 61 | 2006 |
| High aspect ratio vertical through-vias for 3D MEMS packaging applications by optimized three-step deep RIE P Dixit, J Miao Journal of the Electrochemical Society 155 (2), H85, 2007 | 60 | 2007 |
| A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging HK Kannojia, P Dixit Journal of Materials Science: Materials in Electronics 32 (6), 6742-6777, 2021 | 59 | 2021 |
| Fabrication and characterization of through-glass vias by the ECDM process HK Kannojia, J Arab, BJ Pegu, P Dixit Journal of the Electrochemical Society 166 (13), D531, 2019 | 55 | 2019 |
| Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating P Dixit, CW Tan, L Xu, N Lin, J Miao, JHL Pang, P Backus, R Preisser Journal of Micromechanics and Microengineering 17 (5), 1078, 2007 | 55 | 2007 |
| Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining DK Mishra, AK Verma, J Arab, D Marla, P Dixit Journal of Micromechanics and Microengineering 29 (7), 075004, 2019 | 50 | 2019 |
| Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating P Dixit, X Chen, J Miao, S Divakaran, R Preisser Applied surface science 253 (21), 8637-8646, 2007 | 50 | 2007 |
| Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging P Dixit, N Lin, J Miao, WK Wong, TK Choon Sensors and Actuators A: Physical 141 (2), 685-694, 2008 | 49 | 2008 |
| Influence of tool electrode feed rate in the electrochemical discharge drilling of a glass substrate J Arab, P Dixit Materials and Manufacturing Processes 35 (15), 1749-1760, 2020 | 48 | 2020 |
| Numerical and experimental investigation of thermomechanical deformation in high-aspect-ratio electroplated through-silicon vias P Dixit, S Yaofeng, J Miao, JHL Pang, R Chatterjee, RR Tummala Journal of The Electrochemical Society 155 (12), H981, 2008 | 48 | 2008 |
| High aspect ratio glass micromachining by multi-pass electrochemical discharge based micromilling technique DK Mishra, J Arab, Y Magar, P Dixit ECS Journal of Solid State Science and Technology 8 (6), P322, 2019 | 42 | 2019 |
Jianmin MiaoNanyang Technological UniversityEmail yang diverifikasi di ntu.edu.sg
