Heat and fluid flow in high-power LED packaging and applications X Luo, R Hu, S Liu, K Wang Progress in Energy and Combustion Science 56, 1-32, 2016 | 495 | 2016 |
LED packaging for lighting applications: design, manufacturing and testing S Liu Wiley and Chemical Industry Press, 2011 | 472 | 2011 |
Emerging materials and strategies for personal thermal management R Hu, Y Liu, S Shin, S Huang, X Ren, W Shu, J Cheng, G Tao, W Xu, ... Advanced Energy Materials 10 (17), 1903921, 2020 | 468 | 2020 |
Thermal conductivity of polymer-based composites with magnetic aligned hexagonal boron nitride platelets C Yuan, B Duan, L Li, B Xie, M Huang, X Luo ACS applied materials & interfaces 7 (23), 13000-13006, 2015 | 436 | 2015 |
Illusion thermotics R Hu, S Zhou, Y Li, DY Lei, X Luo, CW Qiu Advanced Materials 30 (22), 1707237, 2018 | 282 | 2018 |
Thermal camouflaging metamaterials R Hu, W Xi, Y Liu, K Tang, J Song, X Luo, J Wu, CW Qiu Materials Today 45, 120-141, 2021 | 254 | 2021 |
Design of compact freeform lens for application specific light-emitting diode packaging K Wang, F Chen, Z Liu, X Luo, S Liu Optics Express 18 (2), 413-425, 2010 | 225 | 2010 |
Optical analysis of color distribution in white LEDs with various packaging methods Z Liu, S Liu, K Wang, X Luo IEEE Photonics Technology Letters 20 (24), 2027-2029, 2008 | 212 | 2008 |
Thermal analysis and optimization of multiple LED packaging based on a general analytical solution T Cheng, X Luo, S Huang, S Liu International Journal of Thermal Sciences 49 (1), 196-201, 2010 | 211 | 2010 |
Phosphor self-heating in phosphor converted light emitting diode packaging X Luo, X Fu, F Chen, H Zheng International Journal of Heat and Mass Transfer 58 (1-2), 276-281, 2013 | 186 | 2013 |
Measurement and numerical studies of optical properties of YAG: Ce phosphor for white light-emitting diode packaging Z Liu, S Liu, K Wang, X Luo Applied optics 49 (2), 247-257, 2010 | 185 | 2010 |
A microjet array cooling system for thermal management of high-brightness LEDs X Luo, S Liu IEEE Transactions on Advanced Packaging 30 (3), 475-484, 2007 | 184 | 2007 |
Quantum dots-converted light-emitting diodes packaging for lighting and display: status and perspectives B Xie, R Hu, X Luo Journal of Electronic Packaging 138 (2), 020803, 2016 | 178 | 2016 |
Design method of high-efficient LED headlamp lens F Chen, K Wang, Z Qin, D Wu, X Luo, S Liu Optics Express 18 (20), 20926-20938, 2010 | 159 | 2010 |
Precise optical modeling of blue light-emitting diodes by Monte Carlo ray-tracing Z Liu, K Wang, X Luo, S Liu Optics express 18 (9), 9398-9412, 2010 | 157 | 2010 |
Encrypted thermal printing with regionalization transformation R Hu, S Huang, M Wang, X Luo, J Shiomi, CW Qiu Advanced Materials 31 (25), 1807849, 2019 | 156 | 2019 |
Structural optimization of a microjet based cooling system for high power LEDs S Liu, J Yang, Z Gan, X Luo International Journal of Thermal Sciences 47 (8), 1086-1095, 2008 | 155 | 2008 |
Freeform LED lens for rectangularly prescribed illumination K Wang, S Liu, F Chen, Z Qin, Z Liu, X Luo Journal of Optics A: Pure and Applied Optics 11 (10), 105501, 2009 | 145 | 2009 |
Analysis of condition for uniform lighting generated by array of light emitting diodes with large view angle Z Qin, K Wang, F Chen, X Luo, S Liu Optics express 18 (16), 17460-17476, 2010 | 138 | 2010 |
Cooling of high-power LEDs by liquid sprays: Challenges and prospects S Khandekar, G Sahu, K Muralidhar, EY Gatapova, OA Kabov, R Hu, ... Applied Thermal Engineering 184, 115640, 2021 | 132 | 2021 |