DRAMsim3: A cycle-accurate, thermal-capable DRAM simulator S Li, Z Yang, D Reddy, A Srivastava, B Jacob
IEEE Computer Architecture Letters 19 (2), 106-109, 2020
252 2020 TSV-based 3-D ICs: Design methods and tools T Lu, C Serafy, Z Yang, SK Samal, SK Lim, A Srivastava
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2017
57 2017 Electromigration-aware placement for 3D-ICs T Lu, Z Yang, A Srivastava
2016 17th International Symposium on Quality Electronic Design (ISQED), 35-40, 2016
14 2016 Thermoelectric codesign of 3-D CPUs and embedded microfluidic pin-fin heatsinks C Serafy, Z Yang, A Srivastava, Y Hu, Y Joshi
IEEE Design & Test 33 (2), 40-48, 2015
12 2015 Physical design of 3D FPGAs embedded with micro-channel-based fluidic cooling Z Yang, A Srivastava
Proceedings of the 2016 ACM/SIGDA International Symposium on Field …, 2016
8 2016 Phase-driven learning-based dynamic reliability management for multi-core processors Z Yang, C Serafy, T Lu, A Srivastava
Proceedings of the 54th Annual Design Automation Conference 2017, 1-6, 2017
7 2017 Voltage noise induced DRAM soft error reduction technique for 3D-CPUs T Lu, C Serafy, Z Yang, A Srivastava
Proceedings of the 2016 International Symposium on Low Power Electronics and …, 2016
6 2016 Post-placement optimization for thermal-induced mechanical stress reduction T Lu, Z Yang, A Srivastava
2016 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 158-163, 2016
6 2016 Physical co-design for micro-fluidically cooled 3D ICs Z Yang, A Srivastava
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
5 2016 Co-placement for pin-fin based micro-fluidically cooled 3D ICs Z Yang, A Srivastava
International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015
4 2015 Value-driven synthesis for neural network ASICs Z Yang, A Srivastava
Proceedings of the International Symposium on Low Power Electronics and …, 2018
3 2018 Enhanced Phase-Driven Z Yang, C Serafy, T Lu, A Srivastava
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018
2 2018 HMCTherm: A cycle-accurate HMC simulator integrated with detailed power and thermal simulation Z Yang, M Zuzak, A Srivastava
Proceedings of the International Symposium on Memory Systems, 209-117, 2018
2 2018 Design Space Modeling and Simulation for Physically Constrained 3D CPUs C Serafy, Z Yang, A Srivastava
Proceedings of the Great Lakes Symposium on VLSI 2017, 375-380, 2017
1 2017 ECO based placement and routing framework for 3D FPGAs with micro-fluidic cooling Z Yang, C Serafy, A Srivastava
2016 IEEE 24th Annual International Symposium on Field-Programmable Custom …, 2016
1 2016 Thermal, Power Delivery and Reliability Management for 3D ICS Z Yang
University of Maryland, College Park, 2018
2018 
Tiantao LuCadence Design SystemsEmail yang diverifikasi di cadence.com