| Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs H Park, J Park, S Kim, K Cho, D Lho, S Jeong, S Park, G Park, B Sim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 78 | 2020 |
| Transformer network-based reinforcement learning method for power distribution network (PDN) optimization of high bandwidth memory (HBM) H Park, M Kim, S Kim, K Kim, H Kim, T Shin, K Son, B Sim, S Kim, S Jeong, ... IEEE Transactions on Microwave Theory and Techniques 70 (11), 4772-4786, 2022 | 36 | 2022 |
| A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive … B Sim, S Jeong, Y Kim, S Park, S Lee, S Hong, J Song, H Kim, H Kang, ... IEEE Transactions on Electromagnetic Compatibility 63 (3), 935-946, 2020 | 34 | 2020 |
| Fast and accurate power distribution network modeling of a silicon interposer for 2.5-D/3-D ICs with multiarray TSVs K Cho, Y Kim, S Kim, H Park, J Park, S Lee, D Shim, K Lee, S Oh, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019 | 30 | 2019 |
| Reinforcement learning-based optimal on-board decoupling capacitor design method H Park, J Park, S Kim, D Lho, S Park, G Park, K Cho, J Kim 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 28 | 2018 |
| Channel characteristic-based deep neural network models for accurate eye diagram estimation in high bandwidth memory (HBM) silicon interposer D Lho, H Park, S Park, S Kim, H Kang, B Sim, S Kim, J Park, K Cho, ... IEEE Transactions on Electromagnetic Compatibility 64 (1), 196-208, 2021 | 27 | 2021 |
| Signal integrity and computing performance analysis of a processing-in-memory of high bandwidth memory (PIM-HBM) scheme S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 21 | 2021 |
| Processing-in-memory in high bandwidth memory (PIM-HBM) architecture with energy-efficient and low latency channels for high bandwidth system S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 20 | 2019 |
| Measurement and analysis of through glass via noise coupling and shielding structures in a glass interposer G Park, Y Kim, K Cho, J Park, I Hwang, J Kim, K Son, H Park, ... IEEE Transactions on Electromagnetic Compatibility 63 (5), 1562-1573, 2021 | 17 | 2021 |
| Polynomial model-based eye diagram estimation methods for LFSR-based bit streams in PRBS test and scrambling J Park, S Park, Y Kim, G Park, H Park, D Lho, K Cho, S Lee, DH Kim, ... IEEE Transactions on Electromagnetic Compatibility 61 (6), 1867-1875, 2019 | 17 | 2019 |
| Analysis of repetitive bending on flexible wireless power transfer (WPT) PCB coils for flexible wearable devices S Jeong, TW Kim, S Lee, B Sim, H Park, K Son, K Son, S Kim, T Shin, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 13 | 2022 |
| Bayesian optimization of high-speed channel for signal integrity analysis D Lho, J Park, H Park, S Park, S Kim, H Kang, S Kim, G Park, K Son, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 13 | 2019 |
| Reinforcement-learning-based signal integrity optimization and analysis of a scalable 3-D X-point array structure K Son, M Kim, H Park, D Lho, K Son, K Kim, S Lee, S Jeong, S Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2021 | 12 | 2021 |
| Eye-width and eye-height estimation method based on artificial neural network (ANN) for USB 3.0 D Lho, J Park, H Park, H Kang, S Park, J Kim 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 12 | 2018 |
| Thermal and signal integrity co-design and verification of embedded cooling structure with thermal transmission line for high bandwidth memory module K Son, S Kim, H Park, T Shin, K Kim, M Kim, B Sim, S Kim, G Park, S Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 11 | 2022 |
| Policy gradient reinforcement learning-based optimal decoupling capacitor design method for 2.5-d/3-d ics using transformer network H Park, M Kim, S Kim, S Jeong, S Kim, H Kang, K Kim, K Son, G Park, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 11 | 2020 |
| Modeling and analysis of system-level power supply noise induced jitter (PSIJ) for 4 Gbps high bandwidth memory (HBM) I/O interface T Shin, H Park, K Kim, S Kim, K Son, K Son, G Park, J Park, S Choi, J Kim 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 10 | 2021 |
| Deep reinforcement learning framework for optimal decoupling capacitor placement on general PDN with an arbitrary probing port H Kim, H Park, M Kim, S Choi, J Kim, J Park, S Kim, S Kim, J Kim 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 10 | 2021 |
| Reinforcement Learning-based Auto-router considering Signal Integrity M Kim, H Park, S Kim, K Son, S Kim, K Son, S Choi, G Park, J Kim 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 10 | 2020 |
| Deep reinforcement learning-based through silicon via (TSV) array design optimization method considering crosstalk K Kim, H Park, D Lho, M Kim, K Son, K Son, S Kim, T Shin, S Choi, J Kim 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 9 | 2020 |